• ETRI Journal
• /
• 제24권4호
• /
• pp.259-269
• /
• 2002

Polymers are emerging as new alternative materials for optical communication devices. We developed two types of polymer-based devices for optical communications. One type is for ultra high-speed signal processing that uses nonlinear optical (NLO) polymers in such devices as electro-optic (EO) Mach-Z${\ddot{e}} $ hnder (MZ) modulators and EO 2${\times}$2 switches. The other is for WDM optical communications that use low-loss optical polymers in such devices as 1${\times}$2, 2${\times}$2, 4-arrayed 2${\times}$2 digital optical switches (DOSs) and 16${\times}$16 arrayed waveguide grating (AWG) routers. For these devices, we synthesized a polyetherimide-disperse red 1 (PEI-DR1) side chain NLO polymer and a low-loss optical polymer known as fluorinated polyaryleneethers (FPAE). This paper presents the details of our development of these polymeric photonic devices considering all aspects from materials to packaging.

• Advances in materials Research
• /
• 제6권2호
• /
• pp.185-220
• /
• 2017

Merits, attributes and challenges associated with the application of analytical modeling in electronics and photonics materials science are addressed, based mostly on the author's research during his tenure with Bell Labs, University-of-California, Portland State University, and small business innovative research (SBIR) ERS Co., USA. The emphasis is on practically important, yet often paradoxical, i.e., intuitively non-obvious, material behaviors. It is concluded that when material reliability is crucial, ability to effectively quantify it is imperative, and that analytical modeling is the most suitable, although never straightforward, technique to understand, explain and quantify material behaviors, especially in extreme, extraordinary and paradoxical situations.

• Current Optics and Photonics
• /
• 제1권6호
• /
• pp.613-617
• /
• 2017

Due to optimal advances such as chromatic performance, durability, low power consumption, high efficiency, long-lifetime, and excellent environmental friendliness, white LEDs (WLEDs) are widely used in vehicle front lighting, backlighting, decorative lighting, street lighting, and even general lighting. In this paper, the remote packaging WLEDs (RP-WLEDs) with bi-layer red-emitting $Sr_2Si_5N_8:Eu^{2+}$ and yellow-emitting YAG:Ce phosphor was proposed and investigated. The simulation results based on the MATLAB software and the commercial software Light Tools indicated that the color rendering index (CRI) of bi-layer phosphor RP-WLEDs had a significant increase. The CRI had a considerable increase from 72 to 94. In conclusion, the results showed that bi-layer red-emitting $Sr_2Si_5N_8:Eu^{2+}$ and yellow-emitting YAG:Ce phosphor could be a prospective approach for manufacturing RP-WLEDs with enhanced optical properties.

• 마이크로전자및패키징학회지
• /
• 제28권4호
• /
• pp.47-50
• /
• 2021

Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.

• 한국광학회지
• /
• 제19권5호
• /
• pp.381-385
• /
• 2008

InGaN/Sapphire LED에서 기판 제거와 패키지 방식이 광출력 특성에 미치는 영향을 분석하였다. Sapphire 기판의 제거는 반도체 접합에서 발생된 열의 방출에 도움이 되지만, 반대로 광추출효율이 손상되는 문제점이 수반된다. Sapphire 기판이 제거된 칩을 열전도율이 좋은 금속의 마운트 위에 부착하면, 최대 구동전류는 현저히 증가하고 광출력도 상당히 증가됨으로써, 광추출효율이 손상되는 문제점이 어느 정도 보상된다. 하지만, sapphire 기판이 제거된 칩을 상대적으로 열전도율이 낮은 유전체의 마운트 위에 부착하는 경우에는, 거의 모든 입력전류 범위에서 sapphire 기판이 남아 있는 일반형 칩보다 낮은 광출력을 나타낸다. 따라서, 작은 광출력이 요구되는 응용분야에서는 사용된 칩 마운트의 종류에 무관하게, 일반형 칩이 sapphire 기판이 제거된 칩 보다 유리한 것으로 분석된다.

• Current Optics and Photonics
• /
• 제1권4호
• /
• pp.389-395
• /
• 2017

This paper investigates a method to improve the lighting performance of white light-emitting diodes (WLEDs), which are packaged using two separate remote phosphor layers, a yellow-emitting YAG:Ce phosphor layer and a red-emitting ${\alpha}-SrO{\cdot}3B_2O_3:Sm^{2+}$ phosphor layer. The thicknesses of these two layers are $800{\mu}m$ and $200{\mu}m$, respectively. Both of them are examined in conditions where the average correlated color temperatures (CCT) are 7700 K and 8500 K. For this two-layer model, the concentration of red phosphor is varied from 2% to 30% in the upper layer, while in the lower layer the yellow phosphor concentration is kept at 15%. It was found interestingly that the lighting properties such as color rendering index (CRI) and luminous flux are enhanced significantly, while the color uniformity is maintained in a relatively close range to the one of one-layer configuration (measured at the same correlated color temperature). Besides, the transmitted and reflected light of each phosphor layer are revised by combining Kubelka-Munk and Mie-Lorenz theories. Through analysis, it is demonstrated that the packaging configuration of two-layer remote phosphor that employs red-emitting ${\alpha}-SrO{\cdot}3B_2O_3:Sm^{2+}$ phosphor particles provides a practical solution for general WLEDs lighting.

• 한국광학회지
• /
• 제8권6호
• /
• pp.510-515
• /
• 1997

광모듈에서는 반도체소자와 광섬유간의 복잡한 정렬에 필요한 패키지비용이 제조단가의 많은 비중을 차지하고 있어 수동정렬방식으로 광정렬절차를 제거하여 패키지비용을 절감하는데 대한 많은 연구가 행해지고 있다. 본 연구에서는 단일 모드 광섬유와 레이저 및 광검출기를 수동적으로 광결합시킬 수 있는 실리콘 광학벤치를 제작하고 이를 사용하여 광송수신기용의 광부모듈을 제작하였다. 기판의 구조에 있어서 V-홈에 정렬된 광섬유와 플립칩 본딩되는 LD간의 위치 정밀도를 개선하기 위하여 V-홈 식각패턴과 자기정렬된 정렬마크와 솔더댐을 사용하고 레이저의 높이조절 및 열방출을 위하여 도금된 금 받침대를 도입하였다. 실리콘 광학벤치를 이용하여 수동정렬방식으로 조립된 송신기용 광부모듈은 평균 -11.75.+-.1,75 dB의 광결합효율을 나타내었고 수신기용 광부모듈은 평균 -35.0.+-.1.5 dBm의 수신감도를 나타내었다.