• ETRI Journal
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• v.24 no.4
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• pp.259-269
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• 2002

Polymers are emerging as new alternative materials for optical communication devices. We developed two types of polymer-based devices for optical communications. One type is for ultra high-speed signal processing that uses nonlinear optical (NLO) polymers in such devices as electro-optic (EO) Mach-Z${\ddot{e}} $ hnder (MZ) modulators and EO 2${\times}$2 switches. The other is for WDM optical communications that use low-loss optical polymers in such devices as 1${\times}$2, 2${\times}$2, 4-arrayed 2${\times}$2 digital optical switches (DOSs) and 16${\times}$16 arrayed waveguide grating (AWG) routers. For these devices, we synthesized a polyetherimide-disperse red 1 (PEI-DR1) side chain NLO polymer and a low-loss optical polymer known as fluorinated polyaryleneethers (FPAE). This paper presents the details of our development of these polymeric photonic devices considering all aspects from materials to packaging.

• Advances in materials Research
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• v.6 no.2
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• pp.185-220
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• 2017

Merits, attributes and challenges associated with the application of analytical modeling in electronics and photonics materials science are addressed, based mostly on the author's research during his tenure with Bell Labs, University-of-California, Portland State University, and small business innovative research (SBIR) ERS Co., USA. The emphasis is on practically important, yet often paradoxical, i.e., intuitively non-obvious, material behaviors. It is concluded that when material reliability is crucial, ability to effectively quantify it is imperative, and that analytical modeling is the most suitable, although never straightforward, technique to understand, explain and quantify material behaviors, especially in extreme, extraordinary and paradoxical situations.

• Current Optics and Photonics
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• v.1 no.6
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• pp.613-617
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• 2017

Due to optimal advances such as chromatic performance, durability, low power consumption, high efficiency, long-lifetime, and excellent environmental friendliness, white LEDs (WLEDs) are widely used in vehicle front lighting, backlighting, decorative lighting, street lighting, and even general lighting. In this paper, the remote packaging WLEDs (RP-WLEDs) with bi-layer red-emitting $Sr_2Si_5N_8:Eu^{2+}$ and yellow-emitting YAG:Ce phosphor was proposed and investigated. The simulation results based on the MATLAB software and the commercial software Light Tools indicated that the color rendering index (CRI) of bi-layer phosphor RP-WLEDs had a significant increase. The CRI had a considerable increase from 72 to 94. In conclusion, the results showed that bi-layer red-emitting $Sr_2Si_5N_8:Eu^{2+}$ and yellow-emitting YAG:Ce phosphor could be a prospective approach for manufacturing RP-WLEDs with enhanced optical properties.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.47-50
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• 2021

Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.381-385
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• 2008

We have analyzed the effect of the substrate removal and packaging schemes on light output characteristics in InGaN/Sapphire LEDs. The removal of the sapphire substrate helps to dissipate the heat generated in the junction, but the advantage comes only with the detrimental effect of degrading the photon extraction efficiency. If the substrate-removed chip is attached to a metallic mount with good thermal conductivity, the maximum driving current is increased drastically, producing significantly increased light output and therefore compensating the photon extraction efficiency degradation. On a dielectric mount with a relatively poor thermal conductivity, however, it produces smaller light output, over most input current range, than the regular type of chips with the sapphire substrate remaining. Thus, for low power applications, the regular chips may be preferred over the substrate-removed chips, regardless of the chip mounts employed.

• Current Optics and Photonics
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• v.1 no.4
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• pp.389-395
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• 2017

This paper investigates a method to improve the lighting performance of white light-emitting diodes (WLEDs), which are packaged using two separate remote phosphor layers, a yellow-emitting YAG:Ce phosphor layer and a red-emitting ${\alpha}-SrO{\cdot}3B_2O_3:Sm^{2+}$ phosphor layer. The thicknesses of these two layers are $800{\mu}m$ and $200{\mu}m$, respectively. Both of them are examined in conditions where the average correlated color temperatures (CCT) are 7700 K and 8500 K. For this two-layer model, the concentration of red phosphor is varied from 2% to 30% in the upper layer, while in the lower layer the yellow phosphor concentration is kept at 15%. It was found interestingly that the lighting properties such as color rendering index (CRI) and luminous flux are enhanced significantly, while the color uniformity is maintained in a relatively close range to the one of one-layer configuration (measured at the same correlated color temperature). Besides, the transmitted and reflected light of each phosphor layer are revised by combining Kubelka-Munk and Mie-Lorenz theories. Through analysis, it is demonstrated that the packaging configuration of two-layer remote phosphor that employs red-emitting ${\alpha}-SrO{\cdot}3B_2O_3:Sm^{2+}$ phosphor particles provides a practical solution for general WLEDs lighting.

• Korean Journal of Optics and Photonics
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• v.8 no.6
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• pp.510-515
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• 1997

Packaging takes an extremely important element of optical module cost due primarily to the added complication of alignment between semiconductor devices and optical fiber, and many efforts have been devoted on reducing the cost by eliminating the complicated optical alignment procedures in passive manner. In this study, we fabricated silicon optical benches on which the optical alignments are accomplished passively. To improve the positioning accuracy of a flip-chip bonded LD, we adopted fiducial marks and solder dams which are self-aligned with V-groove etch patterns, and a stand-off to control the height and to improve the heat dissipation of LD. Optical sub-assemblies exhibited an average efficiency of -11.75$\pm$1.75 dB(1$\sigma$) from the LD-to-single mode fiber coupling and an average sensitivity of -35.0$\pm$1.5 dBm from the fiber and photodetector coupling.