• Journal of Mechanical Science and Technology
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• v.19 no.3
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• pp.820-825
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• 2005

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.50-56
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• 2013

Optical-fiber electronic speckle pattern interferometry (ESPI) is a non-contact, non-destructive examination technique with the advantages of rapid measurement, high accuracy, and full-field measurement. The optical-fiber ESPI system used in this study was compact and portable with the advantages of easy set-up and signal acquisition. By suitably configuring the optical-fiber ESPI system, producing an image signal in a charge-coupled device camera, and periodically modulating beam phases, we obtained phase information from the speckle pattern using a four-step phase shifting algorithm. Moreover, we compared the actual defect size with that of interference fringes which appeared on a screen after calculating the pixel value according to the distance between the object and the CCD camera. Conventional methods of measuring defects are time-consuming and resource-intensive because the estimated values are relative. However, our simple method could quantitatively estimate the defect length by carrying out numerical analysis for obtaining values on the X-axis in a line profile. The results showed reliable values for average error rates and a decrease in the error rate with increasing defect length or pressure.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.04a
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• pp.48-53
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• 1997

Electronic Speckle Pattern Interferometry(ESPI) using the Model 95 Ar laserm, a video system and an image processor was applied to the in-plane displacement measurements. Unlike traditional strain gauges or moire method, ESPI method requires no special surface preparation or attachments and can be measured in-plane displacement with no contact and real time. In this experiment wpecimen was loaded in parallel with a loadcell. The specimen was the cold rolled sdteel sheet of 2mm thickness, which was attached strain gauges. The study provides an example of how ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI compare with the data which was measured by strain gauge method in tensile testing.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.7
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• pp.149-154
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• 2001

This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for a deformation measurement of structure. Phase shifting method and unwrapping method have used to make deformation quantitative widely. In this paper, a previous numerical formula for phase shifting method is reconstructed in addition to least square fitting method to improve sensitivity and phase unwrapping based on vertical-horizontal scanning method is applied to analyze in-plane and out-of-plane deformation quantitatively.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.78-83
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• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.10
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• pp.40-49
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• 1995

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interferometry (ESPI) method, in measuring two - dimensional in-plane displacement. The anyalysis result of measurement by ESPE is quite comparable to that tof measurement by strain gauge method. This implies that the method of ESPE is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversal point, measurment error. This error is discussed to be affected not by ESPE method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. In this case, it is turned out that the more errors would be occurred in the large interval of fringe. And so this paper describes a computer method for drawing when the height is available only for some arbitrary collection of points. The method is based on a distance-weighted, last- squares approximation technique with the weight varying with the distance of the data points.

• Transactions of the Korean Society of Automotive Engineers
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• v.1 no.2
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• pp.125-133
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• 1993

Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.556-560
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• 2005

The measurement method by Laser Speckle Interferometry which uses the interference law which will grow precedes and with it explains a resolution measurement ability and together the change of place arrowhead and general measurement, at real-time measurement sensitivity it has application boat song from candle precise measurement field it is increasing. But, currently the domestic application technique to sleeps and optical science military merit by optical science interferometer and directness it composes purchases to the level which it applies the expensive commercial business equipment the outside and in spite of the technical ripple effect is deficient even in many strong point. The hazard which complements like this problem point form technical development it leads from the research which it sees and an application degree and to sleep as the measurement equipment which tries to develop the small-sized optical science interference sensor and an interpretation program it raises it does.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.29-33
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,000$^{\circ}C$. Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 800$^{\circ}C$. There needs to measure the data up to 800$^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000$^{\circ}C$. In previous studies related to thermal strain analysis, the quantitative results are not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,000$^{\circ}C$and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1％ blow 600$^{\circ}C$ however, there is some difference up to 600$^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 800$^{\circ}C$. The reason is the phase transformation of STS430 probably begins at 800$^{\circ}C$.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.807-813
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• 2015

In the present study, an interferometer system, which integrates the laser sensitivity control technique based on the theory of electronic speckle pattern interferometry, one of non-contact non-destructive analysis methods, was developed. This interferometry system receives an image from CCD cameras for each reference and object, and compares the photosensitivity of the object and reference images from imagification. For the purpose of this study, the photosensitivity of object and reference light is measured with power meters, and the amount of light was controlled with an ND filter with a reference light port matching photosensitivity. Using the plate specimen as the object, 0.6, 0.9, 1.2, and $1.5{\mu}m$ of out-plane deformation was made, and images were compared according to the difference in photosensitivity. After analysis, larger object deformations showed larger numbers of stripe patterns. Images became clearer and data error was reduced when the photosensitivity of object and reference light matched.