• ETRI Journal
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• 제33권4호
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• pp.645-647
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• 2011

In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• 수산해양교육연구
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• 제16권2호
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 동계학술발표대회 논문집
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.1063-1066
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• 2002

An equivalent circuit for the superconductor flux flow transistor(SFFT) was combined with high temperature cooling device, based on the analogy between thermal and electrical variables using the high-temperature superconductor(HTS), is proposed. The device is composed of parallel weak links with a nearby magnetic control line. A model has been developed that is based on solving the equation of motion of Abrikosov vortices subject to Lorentz viscous and pinning forces as well as magnetic surface barriers. The use of thermal models the global performance of thermal cooling circuit and signal system to be checked by using electrical circuit analysis programs such as SPICE.

• Transactions on Electrical and Electronic Materials
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• 제6권2호
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• pp.39-45
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• 2005

Numerical and visualization procedures are used in a finite difference grid to analyze and better understand the heat transfer in the MEMS based air micro-jet array (MIA) impingement cooling device. The Navier-Stokes (NS) equations with incompressible flow are solved using an implicit procedure. The temperature contour and velocity vector visualization diagrams are used for illustration. The computed temperature distribution at the bottom of the MIA is in good agreement with the experimental measurement data. The parameters are investigated to improve the efficiency of heat transfer in the MIA. The optimum configuration of the MIA is suggested. The present modeling explains the flow phenomenon and yields valuable information to understand the flow and heat transfer in MIA.

• 동력기계공학회지
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• 제21권6호
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• pp.79-85
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• 2017

A heat pump system is a highly efficient, eco-friendly device which consumes a small amount of energy and supply a lot of energy for heat formation. In addition, it is a single device system that has low generation effect about carbon dioxide. There are many researches related to the electronic expansion valve and the heat pump, but the detailed data analysis of each influence is insufficient. In this study, the cooling capacity and COP of the heat pump system were investigated by varying frequency of the inverter connected to compressor, inlet temperature of chilled water into evaporator and inlet temperature of cooling water into condenser. The results are as follows : (1) The cooling capacity increased as the inverter frequency, inlet temperature of chilled water into evaporator increased, and inlet temperature of cooling water into condenser decreased. (2) The COP increased as the frequency of inverter, inlet temperature of cooling water into condenser decreased and the inlet temperature of chilled water into evaporator increased.

• 한국전자통신학회논문지
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• 제9권7호
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• pp.799-804
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• 2014

무한정한 발전자원과 무공해성 등의 장점을 가진 태양광 발전 시스템은 직류전력을 생산하기 때문에 계통의 연계송전이 가능한 교류전력으로 변환시켜주기 위해서는 태양광 인버터의 사용이 필요하다. 외부에 옥외형 구조로 노출되어 설치되는 소용량의 태양광 인버터는 태양이 강하게 내리쬐는 낮 시간 및 여름철과 같이 외부 환경의 온도가 상승함에 따라 에너지 손실이 발생하고 효율이 감소하게 된다. 태양광 발전 산업의 범위가 확대됨에 따라 태양광 인버터 또한, 상당한 에너지 손실 문제를 야기하므로 이에 따른 대책이 필요하다. 따라서 본 논문에서는 온도조건에 구애받지 않도록 태양광 인버터 외함에 열전소자를 부착한 냉각장치를 설치하고 냉각효과의 극대화를 위해 두 개의 냉각장치를 사용하여 위치 조절에 따른 냉각효과를 비교분석하고자 한다.

• 대한안전경영과학회지
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• 제15권2호
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• pp.129-134
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• 2013

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

• 설비공학논문집
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• 제7권2호
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• pp.266-275
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• 1995

A numerical investigation on the conduction-natural convection-surface radiation conjugate heat transfer in the enclosure having substrate and chips has been performed. A 2-dimensional simulation model is developed by considering heat transfer by conduction, convection and radiation. The solutions to the equation of radiative transfer are obtained by the discrete ordinates method using S-4 quadrature. The effects of Rayleigh number and the substrate-fluid thermal conductivity ratio on the cooling of chip are analyzed. The result shows that radiation is the dominant heat transfer mode in the enclosure.