• Title/Summary/Keyword: electron carrier

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Effects of Rapid Thermal Annealing on the Conduction of a-IGZO Films (급속 열처리가 a-IGZO 박막의 전도에 미치는 영향)

  • Kim, Do-Hoon;Cho, Won-Ju
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.1
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    • pp.11-16
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    • 2016
  • The conduction behavior and electron concentration change in a-IGZO thin-films according to the RTA (rapid thermal annealing) were studied. The electrical characteristics of TFTs (thin-film-transistors) annealed by different temperatures were measured. The sheet resistance, electron concentration, and oxygen vacancy of a-IGZO film were measured by the four-point-probe-measurement, hall-effect-measurement, and XPS analysis. The RTA process increased the driving current of IGZO TFTs but the VTH shifted to the negative direction at the same time. When the RTA temperature is higher than $250^{\circ}C$, the leakage current at off-state increased significantly. This is attributed to the increase of oxygen vacancy resulting in the increase of electron concentration. We demonstrate that the RTA is a promising process to adjust the VTH of TFT because the RTA process can easily modify the electron concentration and control the conductivity of IGZO film with short process time.

Depth-dependent EBIC microscopy of radial-junction Si micropillar arrays

  • Kaden M. Powell;Heayoung P. Yoon
    • Applied Microscopy
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    • v.50
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    • pp.17.1-17.9
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    • 2020
  • Recent advances in fabrication have enabled radial-junction architectures for cost-effective and high-performance optoelectronic devices. Unlike a planar PN junction, a radial-junction geometry maximizes the optical interaction in the three-dimensional (3D) structures, while effectively extracting the generated carriers via the conformal PN junction. In this paper, we report characterizations of radial PN junctions that consist of p-type Si micropillars created by deep reactive-ion etching (DRIE) and an n-type layer formed by phosphorus gas diffusion. We use electron-beam induced current (EBIC) microscopy to access the 3D junction profile from the sidewall of the pillars. Our EBIC images reveal uniform PN junctions conformally constructed on the 3D pillar array. Based on Monte-Carlo simulations and EBIC modeling, we estimate local carrier separation/collection efficiency that reflects the quality of the PN junction. We find the EBIC efficiency of the pillar array increases with the incident electron beam energy, consistent with the EBIC behaviors observed in a high-quality planar PN junction. The magnitude of the EBIC efficiency of our pillar array is about 70% at 10 kV, slightly lower than that of the planar device (≈ 81%). We suggest that this reduction could be attributed to the unpassivated pillar surface and the unintended recombination centers in the pillar cores introduced during the DRIE processes. Our results support that the depth-dependent EBIC approach is ideally suitable for evaluating PN junctions formed on micro/nanostructured semiconductors with various geometry.

The Effects of Environmental Conditions on the Reduction Rate of TNT by $Fe^0$ (환경요인이 $Fe^0$에 의한 TNT의 환원 반응속도에 미치는 영향)

  • 배범한
    • Journal of Korea Soil Environment Society
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    • v.5 no.2
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    • pp.87-97
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    • 2000
  • The effects of environmental conditions, initial dissolved oxygen concentrations, pH, and the presence of electron carrier vitamin $B_{12}$, on the reduction rate of Tn by $Fe^0$ was quantitatively analyzed using a batch reactor In all experiments, TNT reduction was best described with a first order reaction and the reduction rate decreased with the increase in the initial DO concentration. However, the specific reaction rate did not decrease linearly with the increase in the initial DO concentration. In the presence of HEPES buffer 0.2 and 2.0 mM(pH 5.7$\pm$0.2), the specific reaction rate increased more than 5.8 times, which showed reduction rate is rather significantly influenced by the pH of the solution. To test the possibility of reaction rate enhancement, well-known electron carrier(or mediator) , vitamin $B_{12}$, has augmented besides $Fe^0$. In the presence of 8.0 $mu\textrm{g}$/L of vitamin $B_{12}$, the specific reaction rate increased as much as 14.6 times. The results indicate that the addition of trace amount of vitamin $B_{12}$ can be a promising rate controlling option for the removal of organics using a $Fe^0$ filled permeable reactive barrier.

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Design of an Electron Ohmic-Contact to Improve the Balanced Charge Injection in OLEDs

  • Park, Jin-U;Im, Jong-Tae;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.283-283
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    • 2011
  • The n-doping effect by doping metal carbonate into an electron-injecting organic layer can improve the device performance by the balanced carrier injection because an electron ohmic contact between cathode and an electron-transporting layer, for example, a high current density, a high efficiency, a high luminance, and a low power consumption. In the study, first, we investigated an electron-ohmic property of electron-only device, which has a ITO/$Rb_2CO_3$-doped $C_{60}$/Al structure. Second, we examined the I-V-L characteristics of all-ohmic OLEDs, which are glass/ITO/$MoO_x$-doped NPB (25%, 5 nm)/NPB (63 nm)/$Alq_3$ (32 nm)/$Rb_2CO_3$-doped $C_{60}$(y%, 10 nm)/Al. The $MoO_x$doped NPB and $Rb_2CO_3$-doped fullerene layer were used as the hole-ohmic contact and electron-ohmic contact layer in all-ohmic OLEDs, respectively, Third, the electronic structure of the $Rb_2CO_3$-doped $C_{60}$-doped interfaces were investigated by analyzing photoemission properties, such as x-ray photoemission spectroscopy (XPS), Ultraviolet Photoemission spectroscopy (UPS), and Near-edge x-ray absorption fine structure (NEXAFS) spectroscopy, as a doping concentration at the interfaces of $Rb_2CO_3$-doped fullerene are changed. Finally, the correlation between the device performance in all ohmic devices and the interfacial property of the $Rb_2CO_3$-doped $C_{60}$ thin film was discussed with an energy band diagram.

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A novel approach in voltage transient technique for the measurement of electron mobility and mobility-lifetime product in CdZnTe detectors

  • Yucel, H.;Birgul, O.;Uyar, E.;Cubukcu, S.
    • Nuclear Engineering and Technology
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    • v.51 no.3
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    • pp.731-737
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    • 2019
  • In this study, a new measurement method based on voltage transients in CdZnTe detectors response to low energy photon irradiations is applied to measure the electron mobility (${\mu}_e$) and electron mobility-lifetime product $({\mu}{\tau})_e$ in a CdZnTe detector. In the proposed method, the pulse rise times are derived from low energy photon response to 59.5 keV($^{241}Am$), 88 keV($^{109}Cd$) and 122 keV($^{57}Co$) ${\gamma}-rays$ for the irradiation of the cathode surface at each detector for different bias voltages. The electron $({\mu}{\tau})_e$ product was then determined by measuring the variation in the photopeak amplitude as a function of bias voltage at a given photon energy using a pulse-height analyzer. The $({\mu}{\tau})_e$ values were found to be $(9.6{\pm}1.4){\times}10^{-3}cm^2V^{-1}$ for $1000mm^3$, $(8.4{\pm}1.6){\times}10^{-3}cm^2V^{-1}$ for $1687.5mm^3$ and $(7.6{\pm}1.1){\times}10^{-3}cm^2V^{-1}$ for $2250mm^3$ CdZnTe detectors. Those results were then compared with the literature $({\mu}{\tau})_e$ values for CdZnTe detectors. The present results indicate that, the electron mobility ${\mu}_e$ and electron $({\mu}{\tau})_e$ values in CdZnTe detectors can be measured easily by applying voltage transients response to low energy photons, utilizing a fast signal acquisition and data reduction and evaluation.

The Relative Effectiveness of Various Radiation Sources on the Resistivity Change in n-Type Silicon

  • Jung, Wun
    • Nuclear Engineering and Technology
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    • v.1 no.2
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    • pp.91-101
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    • 1969
  • Resistivity changes of n-type float-zone silicon crystals with 6.4$\times$10$^{14}$ to 1.25$\times$10$^{17}$ phosphorus atoms/㎤ due to irradiation by (1) 1 MeV electrons, (2) two types of research reactors, and (3) $Co^{60}$ ${\gamma}$-ray sources were investigated. The results were analyzed on the basis of a simple exponential formula derived by Buehler. While the formula gave a fair fit in the low fluence range in most cases, the deviation was quite appreciable in the case of 1 MeV electron irradiation, and a linear change gave better fit in some cases. The large change in the carrier removal rate in electron-irradiated samples in the high fluence range was analyzed in detail in terms of the Fermi level cross-over of the defect levels. Based on the damage constants evaluated from the initial portion of data where the formula was applicable, the relative effectiveness of various radiation sources in causing the resistivity change in n-type silicon was compared. The TRIGA Mark II reactor neutrons, for example, were found to be about 40 times more effective than 1 MeV electrons. The dependence of the damage constant on the initial carrier concentration was also examined. The physical basis of the exponential law and the effect of the Fermi level cross-over of the defect levels on the resistivity change in the high fluence ranges are discussed.

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Comparison on Autogenous Weldability of Stainless Steel using High Energy Heat Source (고에너지 열원에 따른 스테인리스강의 제살용접특성 비교)

  • Kim, Jong-Do;Lee, Chang-Je;Song, Moo-Keun
    • Journal of Advanced Marine Engineering and Technology
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    • v.36 no.8
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    • pp.1076-1082
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    • 2012
  • Today the welding for LNG carrier is known to be possible using arc and plasma arc welding process. But because of the lower energy density, arc welding is inevitable to multi-pass welding for thick plate and has a limit of welding speed compared to laser which is high energy density heat source. When thick plate is welded, weld defect by multi-pass welding and heat-affected zone by high heat-input were formed. Therefore one-pass welding by key-hole has been considered to work out the problems. It is possible for Laser, electron beam, plasma process to do key-hole welding. Nowadays, plasma process has been used for welding membrane of cargo tank for LNG carrier instead of arc process. Recently, many studies have examined to apply laser process to welding of membrane. In this paper, weldability, microstructure and mechanical properties of stainless steel for LNG carrier welded by fiber laser were compared to those by plasma. As a result, although the laser welding has several times faster speed, similar properties and smaller weld and heat affected zone were obtained. Consequently, this study proves the superiority of fiber laser welding for LNG carrier.

Effects of Device Layout On The Performances of N-channel MuGFET (소자 레이아웃이 n-채널 MuGFET의 특성에 미치는 영향)

  • Lee, Sung-Min;Kim, Jin-Young;Yu, Chong-Gun;Park, Jong-Tae
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.49 no.1
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    • pp.8-14
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    • 2012
  • The device performances of n-channel MuGFET with different fin numbers and fin widths but the total effective channel width is constant have been characterized. Two kinds of Pi-gate devices with fin number=16, fin width=55nm, and fin number=14, fin width=80nm have been used in characterization. The threshold voltage, effective electron mobility, threshold voltage roll-off, inverse subthreshold slope, PBTI, hot carrier degradation, and drain breakdown voltage have been characterized. From the measured results, the short channel effects have been reduced for narrow fin width and large fin numbers. PBTI degradation was more significant in devices with large fin number and narrow fin width but hot carrier degradation was similar for both devices. The drain breakdown voltage was higher for devices with narrow fin width and large fin numbers. With considering the short channel effects and device degradation, the devices with narrow fin width and large fin numbers are desirable in the device layout of MuGFETs.

Simulated Study on the Effects of Substrate Thickness and Minority-Carrier Lifetime in Back Contact and Back Junction Si Solar Cells

  • Choe, Kwang Su
    • Korean Journal of Materials Research
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    • v.27 no.2
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    • pp.107-112
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    • 2017
  • The BCBJ (Back Contact and Back Junction) or back-lit solar cell design eliminates shading loss by placing the pn junction and metal electrode contacts all on one side that faces away from the sun. However, as the electron-hole generation sites now are located very far from the pn junction, loss by minority-carrier recombination can be a significant issue. Utilizing Medici, a 2-dimensional semiconductor device simulation tool, the interdependency between the substrate thickness and the minority-carrier recombination lifetime was studied in terms of how these factors affect the solar cell power output. Qualitatively speaking, the results indicate that a very high quality substrate with a long recombination lifetime is needed to maintain the maximum power generation. The quantitative value of the recombination lifetime of minority-carriers, i.e., electrons in p-type substrates, required in the BCBJ cell is about one order of magnitude longer than that in the front-lit cell, i.e., $5{\times}10^{-4}sec$ vs. $5{\times}10^{-5}sec$. Regardless of substrate thickness up to $150{\mu}m$, the power output in the BCBJ cell stays at nearly the maximum value of about $1.8{\times}10^{-2}W{\cdot}cm^{-2}$, or $18mW{\cdot}cm^{-2}$, as long as the recombination lifetime is $5{\times}10^{-4}s$ or longer. The output power, however, declines steeply to as low as $10mW{\cdot}cm^{-2}$ when the recombination lifetime becomes significantly shorter than $5{\times}10^{-4}sec$. Substrate thinning is found to be not as effective as in the front-lit case in stemming the decline in the output power. In view of these results, for BCBJ applications, the substrate needs to be only mono-crystalline Si of very high quality. This bars the use of poly-crystalline Si, which is gaining wider acceptance in standard front-lit solar cells.

OLED Analog Behavioral Modeling Based on Physics

  • Lee, Sang-Gun;Hattori, Reiji
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.431-434
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    • 2008
  • The physical OLED analog behavioral model for SPICE simulation has been described using Verilog-A language. The model is based on the carrier-balance between the hole and electron injected through Schottky barrier at anode and cathode. The accuracy of this model was examined by comparing with the results from device simulation.

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