Microstructural Evolution Analysis in Thickness Direction of An Oxygen Free Copper Processed by Accumulative Roll-Bonding Using EBSD Measurement (EBSD측정에 의한 반복겹침접합압연된 무산소동의 두께방향으로의 미세조직 변화 분석)
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- Korean Journal of Materials Research
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- v.24 no.11
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- pp.585-590
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- 2014