• Korean Journal of Materials Research
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• v.8 no.5
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• pp.444-449
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• 1998

There are various shielding materials that have been considered; the use of a metallic plate or the layering of a conductive material on a plastic surface and the insertion of filler in plastics. All of these methods have shown their merits and weakness. Therefore, many studies have concentrated on developing materials that effectively cut down EMI without increase in weights of housing materials. In these respects, this study has focused on investigations of the shielding effect of materials that have electroless nickel plating on the lamella structured micro particles surface with low specific gravity. When a film of electroless nickel were plated on a micro particle surfaces and then mixed with paint, the electromagnetic shielding effects were measured as 63dB. Although these effects were less than that 90dB of the copper plate, trials in a series of 6 times increased the shielding effect by IOdB and is applicable to wide range of EMI shielding.

• Korean Journal of Materials Research
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• v.21 no.6
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• pp.309-313
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• 2011

The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.

• Progress in Superconductivity
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• v.6 no.2
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• pp.133-137
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• 2005

We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.

• Korean Chemical Engineering Research
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• v.59 no.2
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• pp.269-275
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• 2021

In this study, ordered mesoporous silica-supported Ni catalysts were prepared for catalytic partial oxidation of methane (CPOM) by using electroless nickel plating method. Unlike conventionally impregnated catalysts, the electrolessly-plated nickel catalyst showed that nickel was highly dispersed and formed stably on silica-supported surface. It was verified by TEM-EDS analysis. During the activity tests, the electrolessly-plated nickel was barely sintered and the amount of carbon deposition was very small. Consequently, the catalyst was far less deactivated, while the sintering was significantly observed in the cases of the catalysts prepared by the conventional impregnation method. Regarding the palladium-promoted catalysts, the reducibility of nickel was increased, and the reaction performances were enhanced in terms of CH4 conversion and H2/CO ratio of produced syngas.

• Korean Journal of Materials Research
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• v.6 no.7
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• pp.700-708
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• 1996

Electroless plating technique was utilized to flip chip bonding to improve surface mount characteristics. Each step of plating procedure was studied in terms pf pH, plating temperature and plating time. Al patterned 4 inch Si wafers were used as substrstes and zincate was used as an activation solution. Heat treatment was carried out for all the specimens in the temperature range from room temperature to $400^{\circ}C$ for $30^{\circ}C$ minutes in a vacuum furnace. Homogeneous distribution of Zn particles of size was obtained by the zincate treatment with pH 13 ~ 13.5, solution concentration of 15 ~ 25% at room temperature. The plating rates for both Ni-P and Au electroless plating steps increased with increasing the plating temperature and pH. The main crystallization planes of the plated Au were found to be (111) a pH 7 and (200) and (111) at pH 9 independent of the annealing temperature.

• Journal of Welding and Joining
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• v.23 no.3
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.672-678
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• 2011

In this work, carbon fibers were electrolessly Ni-plated in order to investigate the effect of metal plating on the electromagnetic shielding effectiveness (EMI-SE) of Ni-coated carbon fibers-reinforced epoxy matrix composites. The surfaces of carbon fibers were characterized by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Electric resistance of the composites was tested using a 4-point-probe electric resistivity tester. The EMI-SE of the composites was evaluated by means of the reflection and adsorption methods. From the results, it was found that the EMI-SE of the composites enhanced with increasing Ni plating time and content. In high frequency region, the EMI-SE didn't show further increasing with high Ni content (Ni-CF 10 min) compared to the Ni-CF 5 min sample. In conclusion, Ni content on the carbon fibers can be a key factor to determine the EMI-SE of the composites, but there can be an optimized metal content at a specific electromagnetic frequency region in this system.