• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• Proceedings of the Membrane Society of Korea Conference
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• 1999.07a
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• pp.43-47
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• 1999

Pd-ceramic composite membranes and catalytic membrane reactors(CMR) have been studied for hydrogen purification and recovery in th fusion reactor fuel cycle. The development of techniques for coating microporous ceramic tubes with Pd and Pd/Ag layers is described: composite membranes have been produced by electroless deposition (Pd/Ag film of 10-20${\mu}{\textrm}{m}$) and rolling of thin metal sheet (Pd and Pd/ Ag membranes of 50-70 ${\mu}{\textrm}{m}$). Experimental results on electroless membranes showed that the metallic film presented some defects and the membranes had not complete hydrogen selectivity . Then the catalytic membrane reactors with electroless membranes can be applied for some industrial processes that do not require a complete separation of the hydrogen (i.e. in the dehydrogenation of hydrocarbons). The rolled thin Pd/Ag membranes separated the hydrogen from the other gas with a complete selectivity and exhibited a slightly larger (about a factor 1.7) mass transfer resistance with respect to the electroless membranes. Experimental tests confirmed the good performances in terms of durability.

• Journal of the Korean institute of surface engineering
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• v.52 no.4
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• pp.187-193
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• 2019

Electroless Ni-P coatings are widely used in the chemical, mechanical, and electronic industries because of their excellent wear and abrasion resistance. In this study, the effect of $TiO_2$ particles of composite coating was investigated. To improve the corrosion resistance, electroless $Ni-P-TiO_2$composite coating was studied by varying the $TiO_2$ content. The morphology and phase structure of $Ni-P-TiO_2$ composite coatings were analyzed by scanning electron microscopy(SEM), X-ray diffractometry(XRD) and X-ray photoelectron spectroscopy(XPS). The result showed that $Ni-P-TiO_2$composite coating is composed of Ni, P, Ti and O. It exhibits an amorphous structure, high hardness and good corrosion resistance to the substrate. $Ni-P-TiO_2$ composite coatings have higher open circuit potential than that of the substrate, which obtained at $TiO_2$ content of 5.0 g/L optimal integrated properties.

• Journal of the Korean institute of surface engineering
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• v.54 no.6
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• pp.315-323
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• 2021

In general, surface treatments of electroless Ni-P coating are extensively applied in the industry due to their excellent properties for considerable wear resistance, hardness, corrosion resistance. This study aims to determine the effect of ultrasonic conditions on the morphology, alumina content, roughness, hardness, and corrosion resistance of electroless Ni-P-Al₂O₃ composite coatings. The characteristics were analyzed by Energy-dispersive X-ray spectroscopy (EDX), x-ray diffractions (XRD), and atomic force microscopy (AFM), etc. In this study, the effect of ultrasonic condition uniformly distributed alumina within Ni-P solution resulting in a smoother surface, lower surface roughness. Furthermore, the corrosion resistance behavior of the coating was analyzed using tafel polarization curves in a 3.5 wt.% NaCl solution at 25 ℃. Under ultrasonic, Al₂O₃ content in Ni-P composite solution increased from 0.5 to 5.0 g/L, Al₂O₃ content at 3.0 g/L was showed a significantly enhanced corrosion resistance. These results suggested that ultrasonic condition was an effective method to improve the properties of the composite coating.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.120.2-120
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• 2003

• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.179.2-179
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• 2002

• Proceedings of the Korean Magnestics Society Conference
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• 2008.12a
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• pp.163.2-163.2
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• 2008

• Korean Chemical Engineering Research
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• v.45 no.6
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• pp.633-637
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• 2007

Electroless plating of Co-alloy thin films as capping layers for Cu interconnection has been investigated using alkali-free precursors such as $(NH_4)_2Co(SO_4)_2{\cdot}6H_2O$, $(NH_4)_2WO_4$, $(NH_4)H_2PO_4$, etc. The characteristics of the Co-alloy thin films were discussed by analyses of the effects of pH, Co-precursor concentration, and deposition temperature on the thickness and surface morphology of the films. The thickness of the Co-alloy thin films increased with increasing pH, Co-precursor concentration, and deposition temperature, similarly to the results of electroless plating of Co-alloy thin films using alkali-containing chemicals. The SEM images of the surface of the Co-alloy thin films showed that the proper ranges of pH and deposition temperature were 8.5~9.5 and $75{\sim}85^{\circ}C$, respectively. This work found a feasibility that Co-alloy thin films as capping layers for Cu interconnection could be electroless plated using alkali-free chemicals.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.31-37
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• 1999

In this study, the thermal property and adhesion of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu /TaN /Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature for the multilayered Cu /TaN /Si specimen which was annealed at atmospheres of $H_2$and Ar gases, respectively. The adhesion strength of Cu films was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than that of sputtered Cu film and evaporated Cu film.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.