• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.101-101
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• 2018

Quantitative measurement of chloride ion concentration has an important role in various fields of electrochemistry, medical science, biology, metallurgy, architecture, etc. Among them, its importance of architecture is ever-growing due to unexpected degradations of building structure. These situations are caused by corrosion of reinforced concrete (RC) structure of buildings. And chloride ions are the most powerful factors of RC structure corrosion. Therefore, precise inspection of chloride ion concentration must be required to increase the accuracy of durability monitoring. Multi-walled Carbon nanotubes (MWCNTs) have high chemical resistivity, large surface area and superior electrical property. Thus, it is suitable for the channels of electrical signals made by the sensor. Silver nanoparticles were added to giving the sensing property. CuBTC, one of the metal organic frameworks (MOFs), was employed as a material to improve the sensing property because of its hydrophilicity and high surface area to volume ratio. In this study, sensing element was synthesized by various chemical reaction procedures. At first, MWCNTs were functionalized with a mixture of sulfuric acid and nitric acid because of enhancement of solubility in solution and surface activation. And functionalized MWCNTs, silver nanoparticles, and CuBTC were synthesized on PTFE membrane, one by one. Electroless deposition process was performed to deposit the silver nanoparticles. CuBTC was produced by room temperature synthesis. Surface morphology and composition analysis were characterized by scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS), respectively. X-ray photoelectron spectroscopy (XPS) was also performed to confirm the existence of sensing materials. The electrical properties of sensor were measured by semiconductor analyzer. The chloride ion sensing characteristics were confirmed with the variation of the resistance at 1 V.

• 한국표면공학회지
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• 제47권2호
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• pp.68-74
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• 2014

The seed step-coverage enhancement process (SSEP) using Pd/Cu/PVP colloids was investigated for the filling of through silicon via (TSV) without void. TEM analysis showed that the Pd/Cu nano-particles were well dispersed in aqueous solution with the average diameter of 6.18 nm. This Pd/Cu nano-particles were uniformly deposited on the substrate of Si/$SiO_2$/Ti wafer using electrophoresis with the high frequency Alternating Current (AC). After electroless Cu deposition on the substrate treated with Pd/Cu/PVP colloids, the adhesive property between deposited Cu layer and substrate was evaluated. The Cu deposit obtained by SSEP with Pd/Cu/PVP colloids showed superior adhesion property to that on Pd ion catalyst-treated substrate. Finally, by implementing the SSEP using Pd/Cu/PVP colloids, we achieved 700% improvement of step coverage of Cu seed layer compared to PVD process, resulting in void-free filling in high aspect ratio TSV.