• Korean Journal of Materials Research
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• v.4 no.2
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• pp.187-193
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• 1994

무전해 동도금액에서의 각종 안정제, 촉진제등의 첨가제에 따른 영향을 고찰하였다. 욕의 기본성분은 황산구리 10g/1, EDTA-2Na 40g/1, 포르말린 3ml/1, pH조절용 수산화나트륨 용액으로 조성하였고, 안정제, 도금촉진제 및 계면활성제의 첨가에 따른 분극곡선을 검토하여 도금욕의 경향을 검토한뒤 농도변화에 따른 도금속도를 측정하여 최적조건을 구하였다. 안정제는 $\alpha$, $\alpha$'-dipyridy1과 NaSCN을 혼합 사용하는 것이 좋았으며 촉진제로는 pyridine이 계면활성제로는 PEG 4000이 좋았다. 첨가량은 5mg/1이하의 미량이었으며 이후 첨가량이 증가함에 따라 증가함에 따라 도금속도는 직선적으로 감소하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.87-88
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• 2007

무전해 구리 도금 공정에서 첨가제로 사용되는 HIQSA 화합물이 Damascene 공정을 이용한 60nm급 trench 패턴 내 무전해 구리 배선 형성 과정에 미치는 효과를 전기 화학적 기법과 광학적 기법을 이용하여 관찰하였다. HIQSA 농도별 open circuit potential의 변화를 관측한 결과, 3ppm 수준으로 첨가되었을 때, 무전해 도금 과정 중 가장 안정한 전위가 유지됨을 볼 수 있었다. 무전해 도금액 내 HIQSA 농도가 높아짐에 따라 구리 도금층의 두께는 지수적으로 감소하였으며, 표면의 결정 크기도 감소하였다. 60nm급 trench 내 무전해 구리 도금 시, 용액 내 침적 시간 60초가 무결함 superconformal copper filling을 얻기 위한 최적 시간이었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.181-182
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• 2015

본 실험에서는 PET 위 무전해 도금을 위한 대안 공정 개발을 목적으로 은(Ag)와 과망간산염($MnO_4{^-}$)를 사용하여 기존에 일반적으로 사용된 Sn/Pd의 Sensitization과 Activation process를 대체하는 기술을 연구했다. Palladium(Pd)의 경우 공정비용에서 높은 부분을 차지하기 때문에 이를 대신하여 Ag를 사용했으며, PET 표면의 전처리를 위해 Ultra Violet과 과망간 산염을 이용하여 표면의 친수성을 높였다. 과망간산염을 사용하여 표면을 전처리하는 과정에서 이산화망간($MnO_2$)과 알코올 작용기가 생성되는데 Ag activation 단계에서 촉매 생성에 중간 매개체 역할을 하는 것으로 사료된다. 이와 같은 결론을 도출 하기 위해서 표면 위 Ag의 화학적 구조 및 상 분석을 위해 XPS와 TEM이 사용되었으며 표면에서 Ag는 Ag-O와 같은 Silver oxide의 형태와 Ag-Mn-O와 같은 Compound로 무전해 도금을 위한 촉매 역할 하는 것으로 판단된다.

• 전자공학회논문지 IE
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• v.43 no.4
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• pp.122-127
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• 2006

A series of conductive filler were prepared with electroless plating method. Base conductive materials of the filler were nickel and copper. The cores were prepared with Nylon 6 and rayon in different aspect ratio. Also, various complexes were made with ABS resin and conductive filler with different filler feed ratio. The conductivity of the filler was measured with conductivity analyzer and the size distributions of fillers was measured with laser particle size analyzer. Electromagnetic wave shielding efficiency of each complex film was measured with flange circular coaxial transmission line sample holder within the 1MHz$\sim$1GHz bandwidth range. From this study, the conductivity of filers surpass that of other carbon films. It is available that the filler made of fibrous materials can be applied in plastic molding industry of electric appliances as a EMI filler.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.57-62
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• 2017

In the process for preparing Ag-coated Cu flakes by electroless silver plating using hydroquinone reducing agent, Ag coating qualities were compared by changing various process parameters such as type of pretreatment solution, plating temperature, pH of plating solution, type and injection rate of plating solution, and pulp density. Effective pretreatment solution for removing the oxide layer on a Cu flake was preferentially suggested. The conditions of low plating temperature, pH value of 4.34, slow injection rate of Ag plating solution, elimination of deionized water in the Ag plating solution, and high pulp density significantly suppressed the formation of separated tiny Ag particles, and thus the surface coverage of Ag coating on Cu flakes was enhanced.

• Korean Journal of Materials Research
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• v.11 no.5
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• pp.398-404
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• 2001

Effects of coating treatment of metallic Cu film on SiC for Al/SiC composite were studied. The Copper was deposited on SiC by electroless plating method. Al/sic composite was fabricated at temperature range of $670^{\circ}C$ to 90$0^{\circ}C$ under vacuum atmosphere. The wetting behavior of Al/SiC composite were analysed by SEM and XRD. The coating treatment on SiC improved wettability of Al melt on SiC considerably comparing to the non coated SiC. This improved wettability seems strongly concerned to the increase of chemical reactivity between coated layer and Al matrix. The improvement of wettability of Al melt on the Cu coated SiC was closely related to in the initial stage of reaction. The metallic film played an important role in reducing the interfacial free energy and breaking down the aluminum oxide film through the reaction with Al melt. The wetting behavior of the as-received SiC with Al melt was not uniform, indicated by the contact angles from less than $97^{\circ}$to more than $97^{\circ}$.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.97-104
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• 2016

In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Journal of Korean Vacuum Science & Technology
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• v.4 no.4
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• pp.93-96
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• 2000

Microchannel plates (MCPs) have been developed by introducing new materials and process technologies. Main body was made of alumina by programmable punching, laminating, and firing. The channel walls of pore arrays of an MCP were deposited with thin films by electroless copper plating and sol-gel process. Our MCP has advantages such as easy fabrication, durability, high temperature endurance, and applicability to the large size comparing with the conventional MCPs. Experiments on the brightness of an MCP incorporated FED revealed that the FED with a MCP is three to four times brighter than a conventional FED. Moreover, the focusing in a FED is improved. Incorporating an MCP into a FED is one of promising methods to enhance the characteristics of the FED. In addition, amplification yield of the MCP is measured for varying the aspect ratio and the input current.

• New & Renewable Energy
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• v.1 no.1 s.1
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• pp.37-43
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• 2005

High-efficiency silicon solar cells have potential applications on mobile electronics and electrical vehicles. The fabrication processes of the high efficiency cells necessitate com placated fabrication precesses and expensive materials. Ti/Pd/Ag metal contact has been used only for limited area In spite of good stability and low contact resistance because of Its expensive material cost and precesses. Screen printed contact formed by Ag paste causes a low fill factor and a high shading loss of commercial solar cells because of high contact resistance and a low aspect ratio. Low cost Ni/Cu metal contact has been formed by using a low cost electroless and electroplating. Nickel silicide formation at the interface enhances stability and reduces the contact resistance resulting In an energy conversion efficiency of $20.2\%\;on\;0.50{\Omega}cm$ FZ wafer. Tapered contact structure has been applied to large area solar cells with $6.7\times6.7cm^2$ in order to reduce power losses by the front contact The tapered front metal contact Is easily formed by the electroplating technique producing $45cm^2$ solar cells with an efficiency of $21.4\%$ on $21.4\%\;on\;2{\Omega}cm$ FZ wafer.