• Journal of Electrochemical Science and Technology
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• 제14권2호
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• pp.194-204
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• 2023

Models based on diffusion-limited aggregation (DLA) have been extensively used to explore the mechanisms of dendritic particle aggregation phenomena. The physical and chemical properties of systems in which DLA aggregates emerge are given in their fractal. In this paper, we present a comprehensive study of the growth of electrodeposited copper dendrites in flat plate electrochemical cells from a fractal perspective. The effects of growth time, applied voltage, copper ion concentration, and electrolyte acidity on the morphology and fractal dimension of deposited copper were examined. 'Phase diagram' set out the variety of electrodeposited copper fractal morphology analysed by metallographic microscopy. The box counting method confirms that the electrodeposited dendritic structures manifestly exhibit fractal character. It was found that with the increase of the voltage and copper ion concentration. The fractal copper size becomes larger and its morphology shifts towards a dendritic structure, with the fractal dimension fluctuating around 1.60-1.70. In addition, the morphology of the deposited copper is significantly affected by the acidity of the electrolyte. The increase in acidity from 0.01 to 1.00 mol/L intensifies the hydrogen precipitation side reactions and the overflow path of hydrogen bubbles affects the fractal growth of copper dendrites.

• 전기화학회지
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• 제6권4호
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• pp.236-241
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• 2003

Magnetic CoW thin film alloys were electrodeposited from citrate baths to investigate the resulting microstructure and magnetic properties. Deposit tungsten (W) content in the films electrodeposited at $70^{\circ}C$ were independent of current density, while coercivity decreased from hard $(H_{c,//}\~150\;Oe\;and\;H_{c.{\bot}}\;\~240\;Oe)$ to soft magnetic properties $(H_{c,//}\~20\;Oe\;and\;H_{c.{\bot}}\;\~30\;Oe)$ with increasing current densities from $10\;to\;100mA{\cdot}cm^2$, with deposit W content $(\~40\%)$ relatively unaffected by the applied current density. X-ray diffraction analysis indicated that hcp $Co_3W$ phases [(200), (201) and (220) planes] in the CoW films electrodeposited at $70^{\circ}C\;and\;10mA{\cdot}cm^{-2}$ were dominant, whereas amorphous CoW phases with small amount of hcp $Co_3W$ [(002) planes] were dominant with deposition at $70^{\circ}C\;and\;100mA{\cdot}cm^{-2}$. At intermediate current densities $(25\;and\;50mA{\cdot}cm^{-2}),\;hop\;Co_3W$ phases [(200), (002), (201) and (220)] were observed. The average grain size was measured to be 30 nm from Sheller formula. It is suggested that the change of the deposit coercivities in the CoW thin films electrodeposited at $70^{\circ}C$ is attributed to the change of microstructures with varying the current density. Nanostructured $Co_3W/amorphous-CoW$ multilayers were fabricated by alternating current density between 10 and $100 mA{\cdot}cm^{-2}$, varying the individual layer thickness. The magnetic properties of $Co_3W/amorphous-CoW$ multilayers were strongly dependent on the thickness of the alternating hard and soft magnetic thin films. The nanostructured $Co_3W/amorphous-CoW$ multilayers exhibited a shift from low to high coercivities suggesting a strong coupling effect.

• 한국표면공학회지
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• 제48권3호
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• pp.73-81
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• 2015

Chloride plating solution was fabricated by dissolving metal Ni powders in solution with HCl and deionized water. Effects of deposition conditions on the properties of Ni films electrodeposited from chloride baths were studied. Current efficiency of Ni films electrodeposited from the baths containing saccharin was decreased with increasing the current density. Residual stress of Ni thin films ware measured to be about 230 ~ 435 MPa in the range of current density of $10{\sim}25mA/cm^2$. Cathode current efficiency in baths without saccharin was initially increased with increasing pH, while it was decreased with increasing pH further. Cathode current efficiency in baths with saccharin (except at pH 2) exhibited less 10 ~ 20% than that in baths without saccharin. Residual stress of Ni films electrodeposited from baths without saccharin was measured to be 388 ~ 473 MPa in the range of pH 2 ~ pH 5 and then was increased to 551 MPa at pH 6. On the other hand, residual stress of Ni films electrodeposited from baths with saccharin was increased with increasing pH. Surface morphology was strongly affected by the change of current density, but slightly by solution pH and addition of saccharin.

• 한국표면공학회지
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• 제43권6호
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• pp.283-288
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• 2010

Ni-$TiO_2$ nano composite coatings were fabricated using pulse current electrodeposition technique at 100 Hz pulse frequency with a constant 50% pulse duty cycles and reference was taken with respect to the direct current (dc) electrodeposition. The properties of the composite coatings were investigated by using SEM, XRD, Wear test and Vicker's microhardness test. Pulse electrodeposited composite has exhibited enhancement of (111), (220), and (311) diffraction lines with an attenuation of (200) line. The results demonstrated that the microhardness of composite coatings under pulse condition was significantly improved than that of pure nickel coating as well as dc electrodeposited Ni-$TiO_2$ composite coatings. Wear tracks have shown the less plastic deformation in pulse plated composite. Coefficient of friction was also found to be lower in pulse plated composite coatings as compared to dc plated composite coatings.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.38-42
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• 1995

In this paper, a theoretical analysis is presented on the mechanics for the side-cut grinding by electrodeposited CBN wheel of a hemispheric type. Each of the grinding force components is calculated by using the geometrical model. It is also presented that experimental results show grinding forces for grinding variable such as wheel speed, feed speed,depth of cut, and grinding wheel positions. The experimental results are found to be in good agreement with those predicted by the analytcal calculation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
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• pp.88-91
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• 2001

The mechanical properties and surface luminous intensities of copper foil have been studied with variation of the amount of additives into the electrolyte. Especially, organic compound of HEC was added from 0.1 to 10ppm for the propose of increasing the mechanical property and the surface state. The total thickness of electrodeposited copper foil was decreased with increasing the amount of organic compounds. There was not so much significant effect of the current density. It has been observed that mechanical property and surface luminous intensity increase with increasing concentration of organic compounds.

• 한국표면공학회지
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• 제39권5호
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• pp.210-214
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• 2006

In order to enhance the electromagnetic shielding efficiency of commercialized cold-rolled steel sheets, we have prepared Ni deposited steel sheets by the electrodeposition method. Surface alloying with Ni and Fe was achieved on a steel sheet by diffusion annealing process. Shielding effectiveness measurement results showed that annealed Ni electrodeposited steel sheets enhanced the shielding efficiency up to about 3 dB in the frequency range of 20 to 200Hz, compared with that of non-deposited steel sheets.

• 한국표면공학회지
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• 제42권4호
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• pp.145-151
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• 2009

Nanocrystalline Cu thin films for FCCL were electrodeposited from sulfate baths to investigate systematically the influences of current density, solution pH on current efficiency, residual stress, surface morphology, and microstructure of thin Cu films. Current efficiencies were measured to be approximately 100%, irrespective of the applied current density and solution pH. But these influenced residual stress, surface morphology, XRD pattern, and grain size of electrodeposited Cu thin film. The residual stress decreased with decreasing the surface roughness, but increased with increasing the fcc(111) peak strength of XRD patterns.

• 전기화학회지
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• 제16권1호
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• pp.19-29
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• 2013

피로인산구리용액에서 전기도금공정을 이용하여 상온과 $55^{\circ}C$에서 각각 제조된 Cu박막의 특성에 미치는 전류밀도, 도금용액 온도, pH의 영향에 대한 연구를 수행하였다. 전류효율은 전류밀도가 증가함에 따라 감소하였으나, 도금용액의 온도가 증가함에 따라 증가하는 경향을 나타내었다. 그러나 pH 는 전류효율에 거의 영향을 미치지는 않았으며, 상온과 $55^{\circ}C$에서 모두 90% 이상으로 측정되었다. 상온에서 전기도금 된 Cu 박막의 잔류응력은 전류밀도의 증가에 따라 감소하며, 60 $mA/cm^2$ 이상에서는 거의 0에 근접하였다. $55^{\circ}C$에서 전기도금 된 Cu 박막은 0~40 MPa의 잔류응력을 나타내었다. 상온에서 도금하는 경우 수지상 표면 형상이 30 $mA/cm^2$ 이상의 전류밀도로부터 관찰되었고, $55^{\circ}C$에서는 100 $mA/cm^2$ 이상의 전류밀도부터 관찰되었다. 상온과 $55^{\circ}C$의 도금용액으로부터 전기도금 된 Cu 박막은 거의 (111) 피크들로 구성되어 있다. 특히 $55^{\circ}C$, 30 $mA/cm^2$에서 전기도금 된 Cu 박막의 경우 (111) 피크의 강한 우선방향을 나타내었다.

• 한국재료학회지
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• 제11권5호
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• pp.413-418
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• 2001

황산구리 전해욕에 분산제인 콜리이달 실리카($SiO_2$현탁액)를 첨가시키는 분산도금의 방법을 이용하여 음극에 석출하는 전해 석출물의 결정구조, 표면형상, 결정방향 등의 변화를 검토하였고 내식성, 물리적 특성 또한 조사하였다. 콜로이달 실리카를 분산시킨 구리 전해욕의 석출피막의 특성에 대해서 조사한 결과, 다음과 같은 결론을 얻었다. 전해 석출피막의 결정입자가 미세화 되고, 균일하게 성장됨은 물론, 결정 수가 증가하였으며, 콜로이달 실리카의 분산 효과에 의해서 전해 석출피막의 경도가 대략 16%까지 상승하였다. 또한 콜로이달 실리카를 분산시킨 극리 전착층의 X-선 회절패턴이 (111)면, (200)면과 (311)면이 거의 소멸되어 우선 방위가 (111)에서 (110)면으로 변화되었다. 부식전위의 측면에서도 콜로이달 실리카의 흡착 효과에 의해서 구리 전착층의 전위가 귀하게 이동하는 효과를 얻을 수 있었다.