• Title/Summary/Keyword: electro-thermal modeling

Search Result 26, Processing Time 0.023 seconds

Electro-Thermal Modeling and Experimental Validation of Integrated Microbolometer with ROIC

  • Kim, Gyungtae;Kim, Taehyun;Kim, Hee Yeoun;Park, Yunjong;Ko, Hyoungho
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제16권3호
    • /
    • pp.367-374
    • /
    • 2016
  • This paper presents an electro-thermal modeling of an amorphous silicon (a-Si) uncooled microbolometer. This modeling provides a comprehensive solution for simulating the electro-thermal characteristics of the fabricated microbolometer and enables electro-thermal co-simulation between MEMS and CMOS integrated circuits. To validate this model, three types of uncooled microbolometers were fabricated using a post-CMOS surface micromachining process. The simulation results show a maximum discrepancy of 2.6% relative to the experimental results.

전력용 반도체소자(IGBT)의 모델링에 의한 열적특성 시뮬레이션 (Modeling and Thermal Characteristic Simulation of Power Semiconductor Device (IGBT))

  • 서영수;백동현;조문택
    • 한국화재소방학회논문지
    • /
    • 제10권2호
    • /
    • pp.28-39
    • /
    • 1996
  • A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

  • PDF

유동형 미세 열유속 센서의 설계 (Design of The Micro Fluidic Heat Flux Sensor)

  • 김정균;조성천;이선규
    • 한국정밀공학회지
    • /
    • 제26권11호
    • /
    • pp.138-145
    • /
    • 2009
  • A suspended membrane micro fluidic heat flux sensor that is able to measure the heat flow rate was designed and fabricated by a complementary-metal-oxide-semiconductor-compatible process. The combination of a thirty-junction gold and nickel thermoelectric sensor with an ultralow noise preamplifier, low pass filter, and lock-in amp has enabled the resolution of 50 nW power and provides the sensitivity of $11.4\;mV/{\mu}W$. The heater modulation method was used to eliminate low frequency noises from sensor output. It is measured with various heat flux fluid of DI-water to test as micro fluidic application. In order to estimate the heat generation of samples from the output measurement of a micro fluidic heat-flux sensor, a methodology for modeling and simulating electro-thermal behavior in the micro fluidic heat-flux sensor with integrated electronic circuit is presented and validated. The electro-thermal model was constructed by using system dynamics, particularly the bond graph. The electro-thermal system model in which the thermal and the electrical domain are coupled expresses the heat generation of samples converts thermal input to electrical output. The proposed electro-thermal system model shows good agreement with measured output voltage response in transient state and steady-state.

On scale-dependent stability analysis of functionally graded magneto-electro-thermo-elastic cylindrical nanoshells

  • Asrari, Reza;Ebrahimi, Farzad;Kheirikhah, Mohammad Mahdi
    • Structural Engineering and Mechanics
    • /
    • 제75권6호
    • /
    • pp.659-674
    • /
    • 2020
  • The present paper employs nonlocal strain gradient theory (NSGT) to study buckling behavior of functionally graded magneto-electro-thermo-elastic (FG-METE) nanoshells under various physical fields. NSGT modeling of the nanoshell contains two size parameters, one related to nonlocal stress field and another related to strain gradients. It is considered that mechanical, thermal, electrical and magnetic loads are exerted to the nanoshell. Temperature field has uniform and linear variation in nanoshell thickness. According to a power-law function, piezo-magnetic, thermal and mechanical properties of the nanoshell are considered to be graded in thickness direction. Five coupled governing equations have been obtained by using Hamilton's principle and then solved implementing Galerkin's method. Influences of temperature field, electric voltage, magnetic potential, nonlocality, strain gradient parameter and FG material exponent on buckling loads of the FG-METE nanoshell have been studied in detail.

Thermal loading effects on electro-mechanical vibration behavior of piezoelectrically actuated inhomogeneous size-dependent Timoshenko nanobeams

  • Ebrahimi, Farzad;Salari, Erfan
    • Advances in nano research
    • /
    • 제4권3호
    • /
    • pp.197-228
    • /
    • 2016
  • In the present study, thermo-electro-mechanical vibration characteristics of functionally graded piezoelectric (FGP) Timoshenko nanobeams subjected to in-plane thermal loads and applied electric voltage are carried out by presenting a Navier type solution for the first time. Three kinds of thermal loading, namely, uniform, linear and non-linear temperature rises through the thickness direction are considered. Thermo-electro-mechanical properties of FGP nanobeam are supposed to vary smoothly and continuously throughout the thickness based on power-law model. Eringen's nonlocal elasticity theory is exploited to describe the size dependency of nanobeam. Using Hamilton's principle, the nonlocal equations of motion together with corresponding boundary conditions based on Timoshenko beam theory are obtained for the free vibration analysis of graded piezoelectric nanobeams including size effect and they are solved applying analytical solution. According to the numerical results, it is revealed that the proposed modeling can provide accurate frequency results of the FGP nanobeams as compared to some cases in the literature. In following a parametric study is accompanied to examine the effects of several parameters such as various temperature distributions, external electric voltage, power-law index, nonlocal parameter and mode number on the natural frequencies of the size-dependent FGP nanobeams in detail. It is found that the small scale effect and thermo-electrical loading have a significant effect on natural frequencies of FGP nanobeams.

New insights in piezoelectric free-vibrations using simplified modeling and analyses

  • Benjeddou, Ayech
    • Smart Structures and Systems
    • /
    • 제5권6호
    • /
    • pp.591-612
    • /
    • 2009
  • New insights are presented in simplified modeling and analysis of free vibrations of piezoelectric - based smart structures and systems. These consist, first, in extending the wide used piezoelectric-thermal analogy (TA) simplified modeling approach in currently static actuation to piezoelectric free-vibrations under short-circuit (SC) and approximate open-circuit (OC) electric conditions; second, the popular piezoelectric strain induced - potential (IP) simplified modeling concept is revisited. It is shown that the IP resulting frequencies are insensitive to the electric SC/OC conditions; in particular, SC frequencies are found to be the same as those resulting from the newly proposed OC TA. Two-dimensional plane strain (PStrain) and plane stress (PStress) free-vibrations problems are then analyzed for above used SC and approximate OC electric conditions. It is shown theoretically and validated numerically that, for both SC and OC electric conditions, PStress frequencies are lower than PStrain ones, and that 3D frequencies are bounded from below by the former and from above by the latter. The same holds for the modal electro-mechanical coupling coefficient that is retained as a comparator of presented models and analyses.

Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays

  • Ban, Zhang;Liang, Zhongzhu;Liang, Jingqiu;Wang, Weibiao;JinguangLv, JinguangLv;Qin, Yuxin
    • Current Optics and Photonics
    • /
    • 제1권2호
    • /
    • pp.143-149
    • /
    • 2017
  • LED arrays with pixel numbers of $3{\times}3$, $4{\times}4$, and $5{\times}5$ have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of $280{\times}280{\mu}m$) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the $3{\times}3$, $4{\times}4$, $5{\times}5$ arrays were $52^{\circ}C/W$, $69.7^{\circ}C/W$, and $84.3^{\circ}C/W$. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with $40{\mu}m$ pixel pitch and $150{\mu}m$ substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.

Experiment and Electro-Thermo-Chemical Modeling on Rapid Resistive Discharge of Large-Capacity Lithium Ion Battery

  • Doh, Chil-Hoon;Ha, Yoon-Cheol;Eom, Seung-Wook;Yu, Jihyun;Choe, Seon-Hwa;Kim, Seog-Whan;Choi, Jae-Won
    • Journal of Electrochemical Science and Technology
    • /
    • 제13권3호
    • /
    • pp.323-338
    • /
    • 2022
  • Heat generation and temperature of a battery is usually presented by an equation of current. This means that we need to adopt time domain calculation to obtain thermal characteristics of the battery. To avoid the complicated calculations using time domain, 'state of charge (SOC)' can be used as an independent variable. A SOC based calculation method is elucidated through the comparison between the calculated results and experimental results together. Experiments are carried for rapid resistive discharge of a large-capacitive lithium secondary battery to evaluate variations of cell potential, current and temperature. Calculations are performed based on open-circuit cell potential (SOC,T), internal resistance (SOC,T) and entropy (SOC) with specific heat capacity.

Modeling of surface roughness in electro-discharge machining using artificial neural networks

  • Cavaleri, Liborio;Chatzarakis, George E.;Trapani, Fabio Di;Douvika, Maria G.;Roinos, Konstantinos;Vaxevanidis, Nikolaos M.;Asteris, Panagiotis G.
    • Advances in materials Research
    • /
    • 제6권2호
    • /
    • pp.169-184
    • /
    • 2017
  • Electro-Discharge machining (EDM) is a thermal process comprising a complex metal removal mechanism. This method works by forming of a plasma channel between the tool and the workpiece electrodes leading to the melting and evaporation of the material to be removed. EDM is considered especially suitable for machining complex contours with high accuracy, as well as for materials that are not amenable to conventional removal methods. However, several phenomena can arise and adversely affect the surface integrity of EDMed workpieces. These have to be taken into account and studied in order to optimize the process. Recently, artificial neural networks (ANN) have emerged as a novel modeling technique that can provide reliable results and readily, be integrated into several technological areas. In this paper, we use an ANN, namely, the multi-layer perceptron and the back propagation network (BPNN) to predict the mean surface roughness of electro-discharge machined surfaces. The comparison of the derived results with experimental findings demonstrates the promising potential of using back propagation neural networks (BPNNs) for getting a reliable and robust approximation of the Surface Roughness of Electro-discharge Machined Components.