• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.15-18
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• 2004

Nondestructive damage sensing and mechanical properties for thermal treated carbon nanotube(CNT) and nanofiber(CNF)/epoxy composites were investigated using electro-micromechanical technique. Carbon black (CB) was used only for the comparison. Electro-micromechanical techniques were applied to obtain the fiber damage and stress transferring effect of carbon nanocomposites with their contents. Thermal treatment and temperature affected on apparent modulus and electrical properties on nanocomposites due to enhanced inherent properties of each CNMs. Coefficient of variation (COV) of volumetric electrical resistance can be used to obtain the dispersion degree indirectly for various CNMs. Dispersion and surface modification are very important parameters to obtain improved mechanical and electrical properties of CNMs for multifunctional applications. Further optimized functionalization and dispersion conditions will be investigated for the following work continuously.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권2호
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• pp.109-116
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• 2013

The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.

• 한국재료학회지
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• 제16권6호
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• pp.386-393
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• 2006

Increasing environmental concerns require to solve the problem produced due to the use of heavy metals in coating formulations. Therefore, it is necessary to develop new coating strategy employing inherently conducting polymers such as polyaniline. Polyaniline is a conductive polymer that is synthesized by oxidation polymerization, and the electrochemical and chemical polymerization are possible for the oxidation of aniline. Electrochemical oxidation polymerization produces a fine surface and although voltage control is more convenient, it require electrolytic cells, and elaborate thin film can be acquired with the polymerization. Polyaniline films were electro-polymerized on cold rolled sheets using the galvanostat mode in the oxalic acidaniline-sodium molybdate electrolyte. The structure and properties of polyaniline film were studied using Potentiostat/Galvanostat 263A, FE-SEM,, AFM, SST, Colorimetry. A high corrosion resistance of polyaniline film was observed with an increase of corrosion potential by $500{\sim}600$ mV for the substrate covered with polyaniline.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.205-206
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• 2011

Cu thin films for electromagnetic wave shielding were prepared on PET film and Ni-coated PET film by using Dry and Wet coating method, such as evaporation method, DC sputtering method and copper sulfate($CuSO_4$). After that, Zn thin film and Ni thin film were prepared onto the Cu thin films by using evaporation dry process and Ni electro plating wet process as a finishing treatment, respectively. The result of conductivity test and corrosion resistance test revealed Cu thin films which were formed with bigger grain size and high Cu composition rate have superior properties. Zn thin film by dry evaporation process and Ni thin film by wet electro plating process on Cu thin films were largely contributed to corrosion resistance. However, Ni thin film by wet process made conductivity of all specimen worse, the other hand, Zn thin film by dry process made it better to improve condictivity of specimens just prepared by dry process.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2011년도 춘계학술대회
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• pp.687-691
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• 2011

본 논문에서는 아날로그 트리밍용으로 사용되는 $0.18{\mu}m$ generic 공정 기반의 EM(Electro-Migration)과 eFuse의 저항 변동을 고려한 8bit eFuse OTP (One-Time Programmable) 메모리를 설계하였다. eFuse OTP 메모리는 eFuse에 인가되는 program power를 증가시키기 위해 external program voltage를 사용하였으며, 프로그램되지 않은 cell에 흐르는 read current를 낮추기 위해 RWL (Read Word-Line) activation 이전에 BL을 VSS로 precharging하는 방식과 read NMOS transistor를 최적화 설계하였다. 그리고 프로그램된 eFuse 저항의 변동을 고려한 variable pull-up load를 갖는 sensing margin test 회로를 설계하였다. 한편 eFuse link의 length를 split하여 eFuse OTP의 프로그램 수율 (program yield)을 높였다.

• Journal of Advanced Marine Engineering and Technology
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• 제23권6호
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• pp.761-769
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• 1999

In this paper the effect of aging heat treatment to the Corrosion behavior for the Nimonic 80A superalloy was studied by AC Impedance methods. Tested solution was 3.5% with tempera-ture $25^{\circ}C$ Electro-chemical corrosion test were carried out for the Nimonic 80A super-alloy which solution heat treated at $1080^{\circ}C$ for 8 hours followed by aging heat treated at $650^{\circ}C,\;700^{\circ}C,\;750^{\circ}C\;800^{\circ}C$ and $850^{\circ}C$ with 16hours under vacuum environment. The obtained results were as follows; 1. Base metal and solution-treated materials were exhibited similar corrosion tendency as Ran-dle equivalent cell. The value of passive film resistance was 579 ohms for the base metal and 124,770 ohms for the solutionized metal such a difference was arose by the ${{\gamma}_^'}$ precipitate on the metal surface during heat treatment. 2. The measure value of $R_p$ for heat-treated at $650^{\circ}C,\;700^{\circ}C,\;800^{\circ}C$and $850^{\circ}C$ were 97,943, 93, 111, 26,961, 15,798 and 11,780ohm respectively. Which indicated that the passive film resistance Rp was reduced as aging temperature increased due to the growth of grain size and sensitization at the grain boundary. 3. The similar tendency was exhibited for corrosion behavior of the electro-chemical corrosion polarization method and AC impedance method and confirmed that AC impedance method was useful tool for corrosion research.

• 한국표면공학회지
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• 제42권1호
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• pp.21-25
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• 2009

Using an evaporation system, $SiO_2$ was deposited as a buffer layer between a PET substrate and a ITO layer and then ITO/$SiO_2$/PET layers were annealed for 1.5 hours at the temperature of $180^{\circ}C$. Adhesion and electro-optical properties of ITO films were studied with thickness variance of a $SiO_2$ buffer layer. As a result of introduction of the $SiO_2$ buffer layer, sheet resistance and resistivity increased and a ITO film with optimum sheet resistance ($529.3{\Omega}/square$) for an upper ITO film of resistive type touch panel could be obtained when $SiO_2$ of $50{\AA}$ was deposited. And it was found that ITO films with $SiO_2$ buffer layer have higher transmittance of $88{\sim}90%$ at 550 nm wavelength than ITO films with no buffer layers and the transmittance was enhanced as $SiO_2$ thickness increased from $50{\AA}$ to $100{\AA}$. Adhesion property of ITO films with $SiO_2$ buffer layers became better than ITO films with no buffer layers and this property was independent of $SiO_2$ thickness variance ($50{\sim}100{\AA}$). By depositing a $SiO_2$ buffer layer of $50{\AA}$ on the PET substrate and sputtering a ITO thin film on the layer, a ITO film with enhanced adhesion, electro-optical properties could be obtained.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• 폴리머
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• 제28권4호
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• pp.285-290
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• 2004

전기적-미세역학 시험법을 이용하여 탄소 나노튜브와 탄소 나노섬유로 강화된 에폭시 복합재료의 비파괴 손상 감지능에 대해 고찰하였다. 카본블랙은 탄소 나노튜브 및 탄소 나노섬유와 비교하기 위해 사용하였다. 두 기지 복합재료 시험에서 탄소 섬유의 파단은 전기저항 변화 측정과 함께 음향방출을 이용하여 동시에 감지하였고 탄소나노복합재료 내부에 함침된 탄소 섬유에 대한 응력 감지는 반복 하중 하에서 전기적-pullout 시험법을 이용하여 수행하였다. 같은 부피 함량에서 섬유파단, 기지재료 변형 및 응력에 대한 감지능은 탄소 나노튜브/에폭시 복합재료에서 가장 높았으며, 카본블랙의 경우가 가장 낮았다. 전기적물성 및 손상 감지능은 탄소나노복합재료의 형상학적인 관찰 결과와 상호 비교하였다. 본 연구에서 탄소 나노재료의 균일한 분산은 손상 감지능을 높이기 위한 가장 중요한 요인으로 고려되며, 탄소 나노복합재료에 대한 손상감지는 전기저항측정과 음향 방출을 이용하여 비파괴적으로 평가할 수 있었다.

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.