• Korean Journal of Materials Research
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• v.11 no.11
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• pp.941-946
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• 2001

Conductive microspheres with a density of 0.2 g/cc were fabricated by electroless silver plating for application to the light-weighted microwave absorbers. The silver plating was conducted with the variation of plating conditions (sensitizing condition, $AgNO_3$, concentration, amount of reducing agent). Specimens have very low electro-resistivity. Under an optimum processing condition, conductive microspheres with uniform silver plating layer can be produced. Rubber-sphere composites were fabricated and their microwave absorbing properties were measured by HP8722D Network Analyzer. It was found that the lower the electrical resistance of microsphere, the better the microwave absorbing properties. Feasibility of microwave absorbers using this microspheres can be demonstrated with the result of microwave reflection loss of -15 dB and thickness of 1.44 mm.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.33 no.10
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• pp.803-810
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• 2009

Micromirrors have a wide range of applications such as optical switches, laser scanners, and digital projection displays. Due to their low performances and high costs, however, practical applications of micromirrors are quite limited. At present micromirrors demand not only a better design but also a simple fabrication process. In this study a twisting-type micromirror that can be driven by two thermal bimorph actuators bending in opposite directions is designed from electro-thermo-mechanical theories and fabricated through a simple MEMS process. Each actuator consists of $SiO_2$ and gold thin-film layers. Simplified analytical model has been built to optimize the performance of micromirror. Due to unexpected resistance increase of metal film and alignment mismatch during fabrication process, experimental rotation angles of micromirrors are about $11^{\circ}$ at applied voltages less than 0.6V. From numerical simulation and analytical studies, however, the next design can provide rotation angles over $20^{\circ}$ at the same applied voltage.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.27-30
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• 2004

Clad wire , which has the advantages of the high strength of a steel core and the electro-conductivity, corrosion resistance of a copper layer, is widely being used the telecommunications, electric-electronic and military technology industries, among others. It is important to obtain uniform coated rate when producing clad wires. Clad wire drawing process can be influenced on damage and coated rate of core and sleeve by process variables as semi-die angle and reduction in area. Therefore, in this study, the finite-element results established in previous study is used to analyze the effect of the various forming parameters, which included the semi-die angle, reduction in area etc. The coated rate will be predicted with observation copper coated rate variation according to total reduction in area and the optimal pass schedule will be set up through proper reduction in area and semi-die angle variation.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.10
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• pp.33-40
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• 1993

A reflection type 16x8 S-SEED array from LP(Low Pressure)-MODVD-grown GaAs/AlGaAs extremely shallow quantum well(ESQW) structures, with 4% Al fraction, has been fabricated. Its intrinsic region consists of 50 pairs of alternating 100.angs. GaAs and 100.angs. $Al_{0.04}$Ga$_{0.96}$As layers. A multilayer reflector stack of $Al_{0.04}$/Ga$_{0.96}$ As(599$\AA$)/AlAs(723$\AA$) was incorporated for the reflection plane below the p-i-n structures. The device processing after the MOCVD growth includes the mesa etching, isolation etching, insulator deposition, p & n metallization, and AR(Anti-Reflection) coating. For switching characteristics of the S-SEED in the form of p-i-n ESQW diode, the maximum optical negative resistance was observed at 856nm. Reflectance measurements showed a change from 15.6% to 43.3% for +0.9V to -6V bias. The maximum contrast ration of the S-SEED array was 2.0 and all the 128 devices showed optical bistability with contrast ratios over 2.4 at 5V reverse bias.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.13 no.6
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• pp.109-114
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• 2013

The biological active points (BAP) are known as low resistance spots or good electro-permeable points. In this paper, a new method for BAP detection using the bio-impedance measurement system based on the adaptive frequency tracking filter (AFTF) and the transition event detector is presented. Also, the microcontroller process continuous time demodulation of the modulated signal by multi frequency components using the AFTF. The transition event detector based on the phase space method is applied about each frequency using the BAP equivalent model which is proposed.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1600-1602
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• 2001

A pulsed power supply of 2.4MJ capacitor bank has been developed to make investigation into electric gun technology. It is made up of eight paralleled 300kJ modules, and can supply various shape of high current pulse by changing charging voltage, inductance, capacitance, and firing time of each module. The 300kJ module has been designed and fabricated for the maximum operating voltage of 22kV, peak current of 150kA, and pulse duration of 1msec. The experiments of the modules were done, and the equivalent circuit of the module was determined. The characteristics of the module were analyzed more deeply through the circuit simulation. The experiments of the paralleled modules with inductance of 20 $\mu$H and load resistance of 100 m$\Omega$ were performed, where the modules were discharged simultaneously and/or sequentially. The results of the experiments were analyzed. The 2.4MJ capacitor bank is currently used as the pulsed power supply for the ETCG (Electro Thermal Chemical Gun) research.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.163-163
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• 2008

반도체 소자가 고집적화 되고 고속화를 필요로 하게 됨에 따라, 기존에 사용되었던 알루미늄이나 텅스텐보다 낮은 전기저항, 높은 electro-migration resistance으로 미세한 금속배선 처리가 가능한 Cu가 주목받게 되었다. 하지만 과잉 디싱 현상과 에로젼을 유도하여 메탈라인 브리징과 단락을 초래할 있고 Cu의 단락인 islands를 남김으로서 표면 결함을 제거하는데 효과적이지 못다는 단점을 가지고 있었다. 특히 평탄화 공정시 높은 압력으로 인하여 Cu막의 하부인 ILD막의 다공성의 low-k 물질의 손상을 초래 할 수 있는 문제점을 해결하기 위하여 기존의 CMP에 전기화학을 결합시킴으로서 낮은 하력에서의 Cu 평탄화를 달성 할 수 있는 기존의 CMP 기술에 전기화학을 접목한 새로운 개념의 ECMP (electrochemical-mechanical polishing) 기술이 생겨나게 되었다. 따라서 본 논문에서는 최적화된 ECMP 공정을 위하여 I-V곡선과 CV법을 이용하여 active. passive. trans-passive 영역의 전기화학적 특징을 알아보았고. Cu막의 표면 형상을 알아보기 위해 Scanning Electron Microscopy (SEM) 측정과 Energy Dispersive Spectroscopy (EDS) 분석을 통해 금속 화학적 조성을 조사하였다.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.969-972
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• 1997

Ultrasonic machining technology has been developed over recent years for he manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile application. The past decade has seen a tremendous in the use of ceramic in structural application. The excellent thermal, chemical and wear resistance of these material can be realized because of recent improvement in the overall strength and uniformity of advanced ceramics. Ultrasonic machining, in which abrasive particles in slurry with water are presented to the work surface in the presence of an ultrasonic-vibrating tool, is process which should be of considerable interest, as its potential is not limited by he electrical or chemical characteristics of the work material, making it suitable for application to ceramics. In order to improve the currently used ultrasonic machining using ultrasonic energy, technical accumulation is needed steadily through development of exciting device of ultrasonic machine composed of piezoelectric vibrator and horn. This paper intends to further the understanding of the basic mechanism of ultrasonic machining for brittle material and ultrasonic machining of ceramics based in the fracture-mechanic concept has been analyzed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.6
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• pp.127-134
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• 2004

As the result of reduction of the barrier of national economy on matters of quality assurance of weighing instruments in recently, it is considering in domestic as well as international matters. Therefore, this study is to analysis and compare with international md national measuring standards on the electric self-indicating scale, to improve the quality of electronic machine by providing a reformation plan on currently problems of domestic manufactured, and to identify to introduce in domestic criteria from international standards. I had compared KSC 1313 to OIML R 76-1 as the performance assessment items, such as metrology Properties test, static temperature test, temperature effect testing under the un-load, electronic wave disturbance test, high-tempereature and high-humidity stability test and durability test. Therefore, only one company is passed all items of the test according to the international (reference) standards, but it is possible to improve the quality in general if it should be use the load cell and electric components which is stability of temperature change in order to supplementation to the static temperature test and temperature effect testing under the un-load. It is also possible to apply in the domestic with the OIML 76-1 after correcting the design.