• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.79-80
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.12
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• pp.42-49
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• 2017

The application of electro-coagulation has been attempted to control the membrane fouling problem in a MBR (Membrane Bio-Reactor). This study examined the effects of the operating parameters (current density and contact time) of the electro-coagulation process on the change in the characteristics of activated sludge. The current density changed from 2.5 to 12, $24A/m^2$, and the contact time was varied from 0 to 2 and 6 hr, respectively. At a current density of $24A/m^2$ and 6 hr of operation, the MLSS changed from 6,800 to 7,000 mg/L (3% increase), but the MLVSS did not increase significantly. After 6 hr of operation, the soluble COD decreased from 71 to 37 mg/L under the $24A/m^2$ condition, from 113 to 67 mg/L under the $12A/m^2$ condition, and from 84 to 80 mg/L under the $2.5A/m^2$ condition. On the other hand, soluble-TN and -TP concentration showed slight changes. The soluble-EPS and Bound-EPS concentration decreased slightly with increasing current density. The membrane filtration performance of activated sludge before and after electro-coagulation was compared. The filtration resistances after electro-coagulation decreased from 6 to 61 %, particularly as the current density and contact time were increased. This indicates that electro-coagulation can be used to control membrane fouling in the MBR process.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.26 no.6B
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• pp.661-667
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• 2006

In this study, an experiment of sewage sludge dewatering is carried by using electrokinetic method, and the electrokinetic dewatering efficiency of digested sludge is analyzed. Digested sludge without coagulants is selected and gravitational and pressing dewatering methods are applied in combination with electro-osmotic and electro-osmotic pulse technology. After the test of digested sludge, dewatering test of thickened sludge is carried to evaluate the electrokinetic dewatering feasibility of thickened sludge. Under the condition of constantly applied voltage, however, electrical resistance increases with decreasing of water content so that dewatering rate decreases with time. To reduce such a hindrance caused by constantly applied voltage, electro-osmotic pulse technology which is considered to reduce the difference of water content with height, is applied. For the application of electro-osmotic pulse, the dewatered flow rate and the dewatered volume became more increasing from the middle of the dewatering process than that of continuous voltage. Through the test of thickened sludge, electro-osmotic dewatering combined with gravitational and expression also showed high dewatering rate, which proved the possibility of using electrokinetic dewatering.

• Journal of the Korea institute for structural maintenance and inspection
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• v.23 no.7
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• pp.1-8
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• 2019

The primary purposes of this study are to understand a fundamental effects of electro-deposition on reinforcing steel in saturated Ca(OH)2 electrolyte, and evaluate the corrosion rates of rebars under cyclic 3wt.%NaCl immersion and dry corrosion environment. The three cement mortar specimens with cover thickness 5, 10 and 30mm, were prepared in the experiment. To monitor the corrosion rates of rebars in mortar, the three cement mortar specimens were exposed to 110 wet-drying cycles(8-hour-immersion in 3wt.%NaCl and 16-hour-drying in a room temperature) in the laboratory. During the wet-dry cycles, the polarization resistance, Rp, and solution resistance, Rs, were continuously measured. The instantaneous corrosion rates of rebars on the effect of electro-depositing with sat. Ca(OH)2 electrolyte were estimated from obtained R-1p and degrees of wetness were estimated from Rs values. From the experimental results, the corrosion rates of rebars were greatly accelerated by wet/dry cycles. During the mortars exposed to drying condition, the large increases in the corrosion rates were showed at all rebar surfaces in three mortar specimen, attributed from the accelerated reduction rates of dissolved oxygen in drying process. However, the corrosion rates on rebar surface electrochemically deposited with sat. Ca(OH)2 electrolyte showed the clear decreases, caused by calcium deposits in the porous rust layer.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.5
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• pp.16-22
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• 2002

This paper suggests the optimum processing conditions for obtaining good quality $P^{+}$-n shallow junctions formed by pre-amorphization and furnace annealing(FA) to reflow BPSG(bore phosphosilicate glass). $BF_2$ions, the p-type dopant, were implanted with the energy of 20keV and the dose of 2$\times$10$^{15}$ cm$^{-2}$ into the substrates pre-amorphized by As or Ge ions with 45keV, 3$\times$$10^{14}$ $cm^{-2}$. High temperature annealings were performed with a furnace and a rapid thermal annealer. The temperature range of RTA was 950~$1050^{\circ}C$, and the furnace annealing was employed for BPSG reflow with the temperature of $850^{\circ}C$ for 40 minutes. To characterize the formed junctions, junction depth, sheet resistance and diode leakage current were measured. Considering the preamorphization species, Ge ion exhibited better results than As ion. Samples preamorphized with Ge ion and annealed with $1000^{\circ}C$ RTA showed the most excellent characteristics. When FA was included, Ge preamorphization with $1050^{\circ}C$ RTA plus FA showed the lowest product of sheet resistance and junction depth and exhibited the lowest leakage currents.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.149-149
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• 2017

Aluminum alloys have poor corrosion resistance compared to the pure aluminum due to the additive elements. Thus, anodizing technology artificially generating thick oxide films are widely applied nowadays in order to improve corrosion resistance. Anodizing is one of the surface modification techniques, which is commercially applicable to a large surface at a low price. However, most studies up to now have focused on its commercialization with hardly any research on the assessment and improvement of the physical characteristics of the anodized films. Therefore, this study aims to select the optimum temperature of sulfuric electrolyte to perform excellent corrosion resistance in the harsh marine environment through electrochemical experiment in the seawater upon generating porous films by variating the temperatures of sulfuric electrolyte. To fabricate uniform porous film of 5083 aluminum alloy, we conducted electro-polishing under the 25 V at $5^{\circ}C$ condition for three minutes using mixed solution of ethanol (95 %) and perchloric (70 %) acid with volume ratio of 4:1. Afterward, the first step surface modification was performed using sulfuric acid as an electrolyte where the electrolyte concentration was maintained at 10 vol.% by using a jacketed beaker. For anode, 5083 aluminum alloy with thickness of 5 mm and size of $2cm{\times}2cm$ was used, while platinum electrode was used for cathode. The distance between the two was maintained at 3 cm. Anodic polarization test was performed at scan rate of 2 mV/s up to +3.0 V vs open circuit potential in natural seawater. Surface morphology was compared using 3D analysis microscope to observe the damage behavior. As a result, the case of surface modification showed a significantly lower corrosion current density than that without modification, indicating excellent corrosion resistance.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.153-153
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• 2016

Aluminum alloys have poor corrosion resistance compared to the pure aluminum due to the additive elements. Thus, anodizing technology artificially generating thick oxide films are widely applied nowadays in order to improve corrosion resistance. Anodizing is one of the surface modification techniques, which is commercially applicable to a large surface at a low price. However, most studies up to now have focused on its commercialization with hardly any research on the assessment and improvement of the physical characteristics of the anodized films. Therefore, this study aims to select the optimum temperature of sulfuric electrolyte to perform excellent corrosion resistance in the harsh marine environment through electrochemical experiment in the sea water upon generating porous films by variating the temperatures of sulfuric electrolyte. To fabricate uniform porous film of 5083 aluminum alloy, we conducted electro-polishing under the 25 V at $5^{\circ}C$ condition for three minutes using mixed solution of ethanol (95 %) and perchloric (70 %) acid with volume ratio of 4:1. Afterward, the first step surface modification was performed using sulfuric acid as an electrolyte where the electrolyte concentration was maintained at 10 vol.% by using a jacketed beaker. For anode, 5083 aluminum alloy with thickness of 5 mm and size of $2cm{\times}2cm$ was used, while platinum electrode was used for cathode. The distance between the two was maintained at 3 cm. Afterward, the irregular oxide film that was created in the first step surface modification was removed. For the second step surface modification process (identical to the step 1), etching was performed using mixture of chromic acid (1.8 wt.%) and phosphoric acid (6 wt.%) at $60^{\circ}C$ temperature for 30 minutes. Anodic polarization test was performed at scan rate of 2 mV/s up to +3.0 V vs open circuit potential in natural seawater. Surface morphology was compared using 3D analysis microscope to observe the damage behavior. As a result, the case of surface modification presented a significantly lower corrosion current density than that without modification, indicating excellent corrosion resistance.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Journal of the Korea Concrete Institute
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• v.16 no.3 s.81
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• pp.319-326
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• 2004

This paper investigates the effect of the concrete containing mineral admixtures(pozzolanic materials such as fly-ash, ground granulated blast-furnace slag, silica fume and meta kaolin) on the resistance properties to chloride ion invasion. The purposed testing procedure was applied to the concrete replaced mineral admixtures for 3${\~}$4 replacement ratios under water-binder ratios ranged from 0.40 to 0.55. For the electro-migration test, Tang and Nilsson's method was used to estimate the diffusion coefficient of chloride ion. As a results, the water-binder ratios, kinds of mineral admixtures and replacement ratios, water curing periods had a great effect on the diffusion coefficient of chloride ion, and the optimal replacement ratios had a limitation for each mineral admixtures. Also, the use of mineral admixtures by mass(replacement of OPC) enhance the resistance ability against chloride penetration compared with the plain concrete. The compressive strength was shown related to the diffusion coefficient of chloride ion, the compressive strength increases with the diffusion coefficient of chloride ion decreasing. Below the 50 MPa, the variation of diffusion coefficient of concrete replaced mineral admixtures was bigger than that of plain concrete.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.