• Title/Summary/Keyword: electro-generation

검색결과 236건 처리시간 0.028초

Synthesis of Novel Y-type Nonlinear Optical Polyester with Enhanced Thermal Stability of Second Harmonic Generation for Electro-Optic Applications

  • Cho, You-Jin;Lee, Ju-Suk;Lee, Ju-Yeon
    • Bulletin of the Korean Chemical Society
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    • 제31권6호
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    • pp.1509-1514
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    • 2010
  • Methyl 3,4-di-(2'-hydroxyethoxy)benzylidenecyanoacetate (3) was prepared and condensed with terephthaloyl chloride to yield novel Y-type polyester (4) containing 3,4-dioxybenzylidenecyanoacetate groups as NLO-chromophores, which constituted parts of the polymer main chains. The resulting polymer 4 is soluble in common organic solvents such as acetone and N,N-dimethylformamide. Polymer 4 shows thermal stability up to $280^{\circ}C$ in thermogravimetric analysis with glass-transition temperature obtained from differential scanning calorimetry near $105^{\circ}C$. The second harmonic generation (SHG) coefficient ($d_{33}$) of poled polymer films at the 1064 nm fundamental wavelength is around 2.42 pm/V. The dipole alignment exhibits high thermal stability up to near $T_g$, and there is no SHG decay below $100^{\circ}C$ due to the partial main-chain character of polymer structure, which is acceptable for NLO device applications.

초소형 전자 렌즈의 전자 광학적 분석 (Electro-optical analysis of a miniaturized electrostatic electron lens)

  • 김호섭;김대욱;김영철;최상국;김대용
    • 한국광학회지
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    • 제14권2호
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    • pp.194-199
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    • 2003
  • FCM(Fast moving least square reproducing kernel point collocation method) 방식의 simulation tool을 이용하여 전기장으로 구동되는 초소형 전자 렌즈의 구동 특성을 조사·분석하였다. Einzel 렌즈의 retarding mode와 accelerating mode구동에서 포텐셜 분포는 유사하지만, electric field strength는 서로 다른 방향을 갖게 되어 서로 다른 형태의 전자 궤적을 보인다. 동일한 working distance에서 accelerating mode로 구동되는 전자렌즈는 retarding mode로 구동되는 경우보다 매우 높은focusing 전압을 필요로 한다.

평면형 ECF 펌프를 이용한 전자기기 액체냉각 시스템 (Liquid Cooling System Using Planar ECF Pump for Electronic Devices)

  • 서우석;함영복;박중호;윤소남;양순용
    • 한국정밀공학회지
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    • 제24권12호
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    • pp.95-103
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    • 2007
  • This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.

광분해법을 이용한 액정 배향 및 광배향 TN-LCD의 전기광학 특성 (Electro-optical characteristics of photo-aligned TN-LCD and LC alignment by using photo-depolymerization method)

  • 박태규;서대식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1998년도 추계학술대회 논문집
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    • pp.343-346
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    • 1998
  • The generation of pretilt angle in nematic liquid crystal (NLC) and electro-optical (EO) characteristics of photo-aligned twisted nematic (TN)-LCD with oblique P-polarized ultraviolet (UV) light irradiation on the two kinds of the soluble polyimide (PI) surfaces containing trifluoromethyl moieties were investigated. The generated pretilt angle of NLC is about 2.5$^{\circ}$with P-polarized UV light irradiation of 20$^{\circ}$on PI-3 surface at 20 min.; However pretilt angle of about 0.5$^{\circ}$are observed on PI-1 and PI-2 surfaces. The generated pretilt angle of NLC on PI-3 surface may be attributed to the trifluoromethyl moieties attached to the lateral benzene rings. The voltage-transmittance and response time characteristics of photo-aligned TN-LCD with P-polarized UV light irradiation of 20$^{\circ}$on PI-1 surface at 20 min were almost same in comparison with the rubbing-aligned TN-LCD. However, the high threshold voltage and slow response are observed on PI-3 surface. Also, the decay time $\tau$$\sub$d/ of photo-aligned TN-LCD is attributed to the anchoring energy of NLC.

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새로운 액티브 보조 공진 DC 링크 스너버를 이용한 3상 전압형 소프트 스위칭 인버터의 특성 (Characteristic of Three-Phase Voltage Type Soft-Switching Inverter using the Novel Active Auxiliary Resonant DC Link Snubber)

  • 성치호;허영환;문상필;박한석
    • 전기학회논문지P
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    • 제65권2호
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    • pp.114-121
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    • 2016
  • This paper is Instant space vector PWM(Pulse Width Modulation)power conversion devices in switching power semiconductors from my generation to losses and switching when the voltage surge and current surge of electronic noise(EMI: Electro Magnetic Interference / RFI: Radio Frequency Interference)to effectively minimize the power soft-switching power conversion circuit topologies of auxiliary resonant DC tank for the purpose of high performance realization of the electric power conversion system by the high-speed switching of a semiconductor device(AQRDCT simultaneously : an active auxiliary resonance using auxiliary Quasi-resonant DC tank)DC link snubber switch has adopted a three-phase voltage inverter. AQRDCL proposed in this paper can reduce the effective and current peak stress of the power semiconductors of the auxiliary resonant snubber circuit compared to the conventional active-resonant DC link snubber, it is not necessary to install the clamp switch of the auxiliary resonant DC link, DC the peak current and power loss of the bus line can be reduced.

광대역 피코셀 응용을 위한 다중양자우물 광전흡수 변조기 (A Multiple Quantum Well Electro-absorption Modulator for Broadband Picocell Applications)

  • 송주빈
    • 한국항행학회논문지
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    • 제8권2호
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    • pp.91-97
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    • 2004
  • 본 논문은 수직 구조와 고성능 특성을 가진 InGaAsP 다중양자우물(MQW; Multiple Quantum Well) 비대칭 페브리페롯 변조기(AFPM; Asymmetric Fabry-Perot Modulators)에 관한 연구결과로써 광대역 동작특성과 저가격이 요구되는 피코셀과 같은 차세대 광대역 무선통신 시스템에 응용 가능성을 제안하고자 한다. 이 AFPM은 <-2V 동작전압과 광섬유와 간단히 결합되어 결합손실이 3dB 내외인 장점과 -3dB 주파수응답 특성이 10GHz인 특성을 보이므로 광대역 및 다중 무선서비스가 요구되는 시스템에 적용 가능할 것으로 기대된다. 이를 위한 간단한 링크실험 결과 92dB/Hz의 SFDR(Spurious Free Dynamic Range)과 약 40dB의 IMD(Inter-Modulation Distortion)의 결과를 보였다.

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High-accuracy quantitative principle of a new compact digital PCR equipment: Lab On An Array

  • Lee, Haeun;Lee, Cherl-Joon;Kim, Dong Hee;Cho, Chun-Sung;Shin, Wonseok;Han, Kyudong
    • Genomics & Informatics
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    • 제19권3호
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    • pp.34.1-34.6
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    • 2021
  • Digital PCR (dPCR) is the third-generation PCR that enables real-time absolute quantification without reference materials. Recently, global diagnosis companies have developed new dPCR equipment. In line with the development, the Lab On An Array (LOAA) dPCR analyzer (Optolane) was launched last year. The LOAA dPCR is a semiconductor chip-based separation PCR type equipment. The LOAA dPCR includes Micro Electro Mechanical System that can be injected by partitioning the target gene into 56 to 20,000 wells. The amount of target gene per wells is digitized to 0 or 1 as the number of well gradually increases to 20,000 wells because its principle follows Poisson distribution, which allows the LOAA dPCR to perform precise absolute quantification. LOAA determined region of interest first prior to dPCR operation. To exclude invalid wells for the quantification, the LOAA dPCR has applied various filtering methods using brightness, slope, baseline, and noise filters. As the coronavirus disease 2019 has now spread around the world, needs for diagnostic equipment of point of care testing (POCT) are increasing. The LOAA dPCR is expected to be suitable for POCT diagnosis due to its compact size and high accuracy. Here, we describe the quantitative principle of the LOAA dPCR and suggest that it can be applied to various fields.

Factors Influencing Edge Dendritic Plating of Steel Sheet in the Electro-Galvanizing Line

  • Du-Hwan Jo;Moonjae Kwon;Doojin Paik;Myungsoo Kim
    • Corrosion Science and Technology
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    • 제23권3호
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    • pp.215-220
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    • 2024
  • Recently, the demand for Zn-Ni electrogalvanized steel sheets for home appliances and automobiles is increasing. Products should have a thick plating (30 to 40 g/m2) on both side with a thin thickness (≤ 0.8 mm) and the highest surface quality. By a high current density operation, current is concentrated in the edge part of the steel sheet, resulting in large surface dent defects due to dendritic plating. This can lead to a low productivity due to low line speed operation. To solve this problem, this study aimed to identify factors influencing dendritic plating. A cylindrical electroplating device was manufactured. Effects of cut edge shape and thickness of steel plate, current density, temperature, flow rate, electrolyte concentration, and pH on dendrite generation of Zn-Ni electroplating were examined. To investigate effect of edge shape of the steel sheet, the steel sheet was manufactured using three processing methods: shearing, polishing after shearing, and laser. Relative effects thickness and cut edge processing methods of the steel plate, current density, temperature, flow rate, electrolyte concentration, and pH of plating solution on dendrite plating were investigated. To prevent dendrite plating, an edge mask was manufactured and its application effect was investigated.

전기화학 기계적 연마를 이용한 Cu 배선의 평탄화 (Planarization of Cu intereonnect using ECMP process)

  • 정석훈;서현덕;박범영;박재홍;이호준;오지헌;정해도
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.79-80
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    • 2007
  • Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

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Plus(+) Point Probe를 이용한 용접부 와전류검사 (Eddy Current Testing of Weldment by Plus(+) Point Probe)

  • 이희종;김용식;남민우;윤병식;김석곤
    • 비파괴검사학회지
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    • 제19권6호
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    • pp.426-432
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    • 1999
  • 발전설비를 구성하는 주요 기기중 펌프, 발브, 배관 등의 용접부에 발생할 수 있는 균열 등의 결함을 검출하기 위한 plus-point 와전류검사탐촉자를 설계하여 결함을 검출하고 그 크기를 측정할 수 있는 검사기법을 연구하였다. 차동형 모드로 운전되는 plus-point 와전류탐촉자는 2개의 "I"자형 코일 이 십자형태로 교차되어 있으며, 탐촉자와 시험체 표면사이의 lift-off 변화에 의한 영향이 재래식 표면 탐촉자에 비해서 작게 발생하는 특징이 있다. 결함에 대한 탐촉자 반응을 평가하기 위해서 304 스텐 인레스강 용접부에 인공결함인 균열성 노치를 방전가공하여 시험편을 제작하였으며, 이를 활용하여 plus-point 와전류탐촉자의 결함 검출, 종류 판별 및 크기를 측정 할 수 있는 기법을 연구하였다.

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