• Title/Summary/Keyword: effect of Sn addition

검색결과 187건 처리시간 0.029초

인공치근용 cp-Ti에 첨가원소(Ta, Zr, Sn)가 기계적 특성 및 내식성에 미치는 영향 (Effect for Alloy Addition(Ta, Zr, Sn) on Mechanical Properties and Corrosion Resistance of cp-Ti for Dental Implants)

  • 박효병
    • 대한치과기공학회지
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    • 제21권1호
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    • pp.43-53
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    • 1999
  • The mechannical properties and corrosion resistance of alloy added commercially pure titanium for dental implants have been investigated. Ti, To-65Zr, Ti-10.1Ta and Ti-17Sn alloys were melthed in arc furnace and the corrosion resistance of Ti alloys was evaluated by anodic polarization test. The microstructure and mechanical properties of Ti alloy were analysed by optical micrograph. hardness tester and instron. In isothermal test, Ti-10.1Ta and Ti-17Sn alloys exhibited the best oxidation resistance below $1100^{\circ}C$. Ti65Zr, Ti-10.1Ta and Ti-17Sn alloys showed better rockwell hardness compared with commercially pure. Ti As the result of the anodic polarization test in 5%HCl, it 5%HCl, it was known knows that Ti-65Zr, alloy showed a rapid decrease in current density at higher potenial in comparision with other Ti alloys.

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열처리 및 전류인가 조건에서 Cu/Ni/Sn-2.5Ag 미세범프의 Ni-Sn 금속간화합물 성장 거동에 미치는 비전도성 필름의 영향 분석 (Non-conductive Film Effect on Ni-Sn Intermetallic Compounds Growth Kinetics of Cu/Ni/Sn-2.5Ag Microbump during Annealing and Current Stressing)

  • 김가희;류효동;권우빈;손기락;박영배
    • 마이크로전자및패키징학회지
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    • 제29권2호
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    • pp.81-89
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    • 2022
  • 비전도성 필름(non-conductive film, NCF)의 적용이 Cu/Ni/Sn-2.5Ag 미세범프의 금속간화합물(intermetallic compound, IMC) 성장 거동에 미치는 영향을 분석하기 위해 110, 130, 150℃의 온도 조건과 1.3×105 A/cm2의 전류밀도 조건에서 실시간 열처리 및 electromigration(EM) 실험을 진행하였다. 그 결과, NCF 적용 유무와 열처리 및 EM 실험과 관계없이 Ni3Sn4 IMC 성장에 필요한 활성화에너지는 약 0.52 eV로 큰 차이는 보이지 않았다. 이는 Ni-Sn IMC의 성장속도가 Cu-Sn IMC 성장 속도보다 매우 느리며, 또한 Ni-Sn IMC의 성장 거동은 시간의 제곱근에 선형적으로 증가하므로 확산이 지배하는 동일한 반응기구를 가지며 NCF 적용에 따른 역응력(back stress)의 EM 억제 효과가 크지 않기 때문에 Ni3Sn4 IMC 성장에 필요한 활성화에너지는 차이가 나지 않는 것으로 판단된다.

전해도금에 의해 형성된 반도체 금속도금용 주석-납 합금피막의 첨가제 및 전해조건의 영향 (Effect of Additives and Plating Conditions on Sn-Pb Alloy Film of Semiconductor Formed by High Speed Electroplating)

  • 정강효;김병관;박상언;김만;장도연
    • 한국표면공학회지
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    • 제36권1호
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    • pp.34-41
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    • 2003
  • Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from $10A/dm^2$ to $50A/dm^2$, and the current efficiency on the cathode was decreased. The carbon content in the electrodeposit was decreased with increasing current density from $10A/dm^2$ to $30A/dm^2$, however the carbon content was highly increased in the range of $40A/dm^2$$∼50A/dm^2$. The formation of tetravalent tin and stannic oxide sludge was prevented by the addition of gallic acid in the bath. The changing of Sn content in the electrodeposit is caused by the addition of gallic acid.

Effects of Ta addition in Co-sputtering Process for Ta-doped Indium Tin Oxide Thin Film Transistors

  • 박시내;손대호;김대환;강진규
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.334-334
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    • 2012
  • Transparent oxide semiconductors have recently attracted much attention as channel layer materials due to advantageous electrical and optical characteristics such as high mobility, high stability, and good transparency. In addition, transparent oxide semiconductor can be fabricated at low temperature with a low production cost and it permits highly uniform devices such as large area displays. A variety of thin film transistors (TFTs) have been studied including ZnO, InZnO, and InGaZnO as the channel layer. Recently, there are many studies for substitution of Ga in InGaZnO TFTs due to their problem, such as stability of devices. In this work, new quaternary compound materials, tantalum-indium-tin oxide (TaInSnO) thin films were fabricated by using co-sputtering and used for the active channel layer in thin film transistors (TFTs). We deposited TaInSnO films in a mixed gas (O2+Ar) atmosphere by co-sputtering from Ta and ITO targets, respectively. The electric characteristics of TaInSnO TFTs and thin films were investigated according to the RF power applied to the $Ta_2O_5$ target. The addition of Ta elements could suppress the formation of oxygen vacancies because of the stronger oxidation tendency of Ta relative to that of In or Sn. Therefore the free carrier density decreased with increasing RF power of $Ta_2O_5$ in TaInSnO thin film. The optimized characteristics of TaInSnO TFT showed an on/off current ratio of $1.4{\times}108$, a threshold voltage of 2.91 V, a field-effect mobility of 2.37 cm2/Vs, and a subthreshold swing of 0.48 V/dec.

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구상흑연주철의 내마모성에 미치는 Sb 및 Sn 의 영향에 관한 연구 (The Effects of Antimony and Tin Addition on the wear resistance properties of ductile cast iron)

  • 권영훈;김창규;김복석;김성한;천병욱;최창옥
    • 한국주조공학회지
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    • 제11권6호
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    • pp.463-474
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    • 1991
  • The effect of $0.01{\sim}0.10%$ Sb and Sn on the wear resistance of ductile cast iron was investigated. The hardness was increased with Sb to 0.10%, but the elongation and the impact value were decreased. The tensile strength was increased with up to 0.05% Sb, however decreased with $0.05{\sim}0.10%$ Sb. The hardness and the tensile strength were increased and the elongation was decreased with up to 0.10% Sn. The nodularity of graphite was decreased with above 0.08% Sb however Sn had no effect on that. When the maximum compressive stress was low ($42kg.f/mm^2$), the weigth loss was decreased with increased hardness and when that was high ($54kg.f/mm^2$ and $65kg.f/mm^2$), the weight loss did not depend upon the hardness. The pearlite stabilization with Sb and Sn increased with the wear resistance of ductile cast iron.

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Mg-4Al-2Sn-1Si 합금의 조직 및 상온 인장 특성에 미치는 Ce의 영향 (Effect of Cerium on the Microstructure and Room Temperature Tensile Properties of Mg-4Al-2Sn-1Si Alloys)

  • 김정훈;조대현;박익민
    • 한국주조공학회지
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    • 제32권6호
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    • pp.289-295
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    • 2012
  • Mg-Al-Sn-Si system alloy, as a promising cheap heat-resistant Mg alloy for automobile engine part, has been investigated. Refinement of microstructure and precipitation of thermally stable secondary phases are important goal for the design of heat-resistant Mg alloy. In this study, the effect of Ce on the microstructure and room temperature mechanical properties of Mg-Al-Sn-Si alloy was investigated. High thermally stable $Mg_2Si$ phases in Mg-Al-Sn-Si alloy is very useful intermetallic compound. However, the $Mg_2Si$ phases often result in poor mechanical properties due to the coarse chinese type $Mg_2Si$ phases. The experimental specimens were fabricated by fluxless melting under $CO_2+SF_6$ atmosphere and poured into the permanent pre-heated at $200^{\circ}C$. It was told that Ce addition can modify $Mg_2Si$ phases and refine microstructure and improve the tensile strength, yield strength and elongation.

Influence of Sn Doping on Structural and Optical Properties of Zinc Oxide Nanorods Prepared Via Hydrothermal Process

  • Park, Hyunggil;Kim, Younggyu;Ji, Iksoo;Kim, Soaram;Kim, Jin Soo;Son, Jeong-Sik;Leem, Jae-Young
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.203.2-203.2
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    • 2013
  • Hydrothermally grown ZnO nanorods were synthesized with various Sn contents on quartz substrates, ranging from 0 to 2.5 at% in increment 0.5 at%. Scanning electron microscopy (SEM) and ultraviolet (UV)- visible spectroscopy were used to determine the effect of Sn doping on the structural and optical properties. In the SEM images, the nanorods have hexagonal wurzite structure and the diameter of the nanorods increase with increase in the Sn contents. The optical parameters of the Sn-doped ZnO nanorods such as the absorption coefficients, optical bandgaps, Urbach energies, refractive indices, dispersion parameters, dielectric constants, and optical conductivities were gained from the transmittance and reflectance results. In the PL spectra, the NBE peaks in the UV region decrease and blue-shift with increase in the Sn contents. In addition, the DLE peaks in the visible region of the nanorods shift toward low-energy region when the ZnO nanorods doped with various Sn contents.

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Sn-Pb 공정솔더 플립칩의 접합강도에 미치는 플라즈마 처리 효과 (Effect of Plasma Treatment on the Bond Strength of Sn-Pb Eutectic Solder Flip Chip)

  • 홍순민;강춘식;정재필
    • Journal of Welding and Joining
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    • 제20권4호
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    • pp.498-504
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    • 2002
  • Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

금형 주조한 마그네슘 합금의 부식 거동에 미치는 Al 및 Sn의 영향 (The Effect of Al and Sn Additions on Corrosion Behavior of Permanent Mold Casting Magnesium Alloy)

  • 김병호;서재현;박경철
    • 한국주조공학회지
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    • 제35권2호
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    • pp.36-43
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    • 2015
  • In this study, the influences of aluminum and tin additions (individual and combined) on corrosion behavior of magnesium alloy have been determined. The studied alloys were fabricated by permanent mold casting method to measure the corrosion properties, a potentiodynamic test, hydrogen evolution test and immersion test were carried out in a 3.5% NaCl solution at pH 7.2. From the results of microstructure analysis, the Mg-9Al-1Zn alloy was found to be composed of ${\alpha}$-Mg and rod-like $Mg_{17}Al_{12}$ phase and the Mg-5Sn-5Al-1Zn alloy was found to be composed of ${\alpha}$-Mg, rod-like $Mg_{17}Al_{12}$ and $Mg_2Sn$ phases. In the case of the Mg-9Sn-1Zn alloy, the microstructure was composed of ${\alpha}$-Mg and eutectic $Mg_2Sn$ phase. With Sn addition (individual and combined), the corrosion resistance of the Mg alloys improved.

졸-겔 공법으로 제작된 SnO2 박막 트랜지스터의 광전기적 특성 (Optoelectronic Properties of Sol-gel Processed SnO2 Thin Film Transistors)

  • 이창민;장재원
    • 센서학회지
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    • 제29권5호
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    • pp.328-331
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    • 2020
  • In this study, a highly crystalline SnO2 thin film was formed using a sol-gel process. In addition, a SnO2 thin-film transistor was successfully fabricated. The fabricated SnO2 thin-film transistor exhibited conventional n-type semiconductor properties, with a mobility of 0.1 cm2 V-1 s-1, an on/off current ratio of 1.2 × 105, and a subthreshold swing of 2.69. The formed SnO2 had a larger bandgap (3.95 eV) owing to the bandgap broadening effect. The fabricated photosensor exhibited a responsivity of 1.4 × 10-6 Jones, gain of 1.43 × 107, detectivity of 2.75 × 10-6 cm Hz1/2 W-1, and photosensitivity of 4.67 × 102.