• Composites Research
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• v.15 no.5
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• pp.19-26
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• 2002

Real defects in composite structures were detected by using laser measuring system. Four types of real defects, that is, impact-induced delamination in a composite laminate, debond in a honeycomb structure, free-edge delamination in a composite laminate and debond in an adhesive joint, were made by applying several types of loads to the specimens. Laser measuring system such as ESPI and shearography technique were used to detect those defects. Thermal loading method, which can easily induce the surface deformation of specimen, was used to detect the defects. Experimental results show that the defects in composite structures could be easily detected by ESPI and shearography technique. Moreover, it shows that ESPI and shearography technique could be usefully applied to the detection of defects in various kinds of composite structures.

• Applied Microscopy
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• v.45 no.3
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• pp.107-114
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• 2015

Two-dimensional (2D) materials containing hole defects are a promising substitute for conventional nanopore membranes like silicon nitride. Hole defects on 2D materials, as atomically thin nanopores, have been used in nanopore devices, such as DNA sensor, gas sensor and purifier at lab-scale. For practical applications of 2D materials to nanopore devices, researches on characteristics of hole defects on graphene, hexagonal boron nitride and molybdenum disulfide have been conducted precisely using transmission electron microscope. Here, we summarized formation, features, structural preference and stability of hole defects on 2D materials with atomic-resolution transmission electron microscope images and theoretical calculations, emphasizing the future challenges in controlling the edge structures and stabilization of hole defects. Exploring the properties at the local structure of hole defects through in situ experiments is also the important issue for the fabrication of realistic 2D nanopore devices.

• Journal of the Semiconductor & Display Technology
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• v.15 no.1
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• pp.56-64
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• 2016

It is generally accepted that the surface quality of wafer edge is mostly damaged by the vibrations of the edge grinding machine. The surface quality of wafer edge is supposed to be the most dominant factor of the cracks, scratches, burrs and chips on the edge surfaces, which are the main defects of the wafers. In this study, the structure of a wafer edge grinder has been investigated through the frequency response experiment and the computer simulation to find ways to suppress the vibrations from the structure. The main reasons of the structural vibrations were analyzed. And further the design alterations were deduced from the results of the experiment and the simulation, and applied to the machine to check the effects of those alterations and to eventually improve the structural stability. The result shows that the machine can have much improved stability with relatively simple design changes.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.12
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• pp.60-70
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• 1999

An efficient automatic inspection system for Floating Seal is developed, The proposed system consists of a high resolution line scan camera, microcomputer, and PLC (Programmable Logic Controller). In order to perform rapid inspection, The ROI (Region of Interest) is extracted from the original image. There are types of defects; shape defects and surface defects. Each features of defects are captured by edge detect, segmentation, morphological operation, and threshold analysis. PLC controller is used to synchronize the whole system and store the inspection results temporarily to reduce the overhead of microcomputer. As a result, the system is being utilized successfully in a teal inspection line.

• International Journal of Precision Engineering and Manufacturing
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• v.5 no.3
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• pp.11-18
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• 2004

In this paper, the classification of artificial defects in semiconductor packages is studied by using pattern recognition technology. For this purpose, the pattern recognition algorithm includes the user made MATLAB code. And preprocess is made of the image process and self-organizing map, which is the input of the back-propagation neural network and the dimensionality reduction method, The image process steps are data acquisition, equalization, binary and edge detection. Image process and self-organizing map are compared to the preprocess method. Also the pattern recognition technology is applied to classify two kinds of defects in semiconductor packages: cracks and delaminations.

• Journal of Oral Medicine and Pain
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• v.7 no.1
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• pp.41-46
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• 1982

The patient, 11 yeats old male was examined for routine oral health care. He had been hospitalized for treatment of nephritis. Hos physical condition os mental retarded & undergrowth state. In oral examination, notch on cutting edge and screw-driver shaped crown of maxillary central incisors, narrow crown and dwarfed & pinched occlusal surface of lower first molars and scars(rhagades) on the angle of the lip were shown. We diagnosed the above symptoms as dental defects of congenital syphilis; Huchinson's inscisors and mulberry molar.

• Proceedings of the Korean Nuclear Society Conference
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• 1998.05b
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• pp.160-165
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• 1998

Under the heavy irradiation, when the production and the recombination of interstitials and vacancies are included, the diffusion equations become nonlinear. An effort has been made to arrange an appropriated transformation of these nonlinear differential equations to soluble Poisson's equations, so that analytical solutions for simultaneously calculating the concentrations of interstitials and vacancies in the angular dependent Cottrell's potential of the edge dislocation have been derived from the well-known Green's theorem and perturbation theory.

• Nuclear Engineering and Technology
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• v.31 no.2
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• pp.151-156
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• 1999

Under the heavy irradiation of crystalline materials when the production and the recombination of interstitials and vacancies are included, the diffusion equations become nonlinear. An effort has been made to arrange an appropriate transformation of these nonlinear differential equations to more solvable Poisson's equations, finally analytical solutions for simultaneously calculating the concentrations of interstitials and vacancies in the angular dependent Cottrell's potential of the edge dislocation have been derived from the well-known Green's theorem and perturbation theory.

• Progress in Superconductivity
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• v.3 no.1
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• pp.65-69
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• 2001

We measured the transport properties of$ YBa_2$$Cu_3$$O_{x}$ ramp-edge junction fabricated with interface-engineered barrier. The current-voltage characteristics show a typical resistively-shunted junction like behavior Voltage noise measurement revealed that the main source of the 1/f noise is the critical current and resistance fluctuations. The analysis of the noise data showed that the critical current fluctuations increase with temperature, whereas the resistance fluctuations are almost constant, and both fluctuations are almost correlated. The smaller magnitude of the critical current and resistance fluctuations seems to result from the columnar-deflects.s.

• Journal of the Korea Furniture Society
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• v.11 no.1
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• pp.61-68
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• 2000

This study was carried out to investigate the effect of grain and veneer thickness on drying rate, required energy consumption, and drying defects such as checking, end waving, and burning during a far-infrared radiation drying process of decorative veneers of hard maple and beech. Most of the veneer could be dried from green to in-use moisture content within 30 to 360 seconds. The drying rates were significantly affected by veneer thickness, but there was little difference between edge-and flat-sliced veneers. The formation of checking during drying test was none or very slight. The percentages of the veneers defected by checks were higher in the flat-sliced veneers than in the edge-sliced veneers. The maximum end wavinesses in the flat-sliced veneers were almost 1.6 to 3 times larger than that in the edge-sliced veneers. All veneers were fee from burned marks during drying test.