• Title/Summary/Keyword: edge crack

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Fracture Behavior of Concrete Anchorage Zone of Anchor System subjected to Shear Load (전단하중을 받는 앵커시스템 정착부 콘크리트의 파괴 거동)

  • 손지웅;송하원;변근주
    • Proceedings of the Korea Concrete Institute Conference
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    • 2002.05a
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    • pp.265-270
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    • 2002
  • In this paper, structural behaviors of anchor systems subjected to shear loads are analyzed by using fracture analysis and experiments. Two dimensional finite element analyses of concrete anchor systems to predict breakout failure of concrete through progressive fracture are carried out by utilizing the so-called embedded crack model. Three dimensional finite element analyses are also carried out to investigate the fracture behavior of anchor systems having different effective lengths, edge distances, spacings between anchors, and direction of loads. Results of analyses are compared with both experimental results and design values of ACI code on anchor, and then applicability of finite element method for predicting fracture behavior of concrete anchor systems is verified.

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Optimization of PMD(Pre-Metal Dielectric) Linear Nitride Precess (PMD(Pre-Metal Dielectric) 선형 질화막 공정의 최적화에 대한 연구)

  • 정소영;김상용;서용진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.10
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    • pp.779-784
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    • 2001
  • In this work, we studied the characteristics of nitride films for the optimization of PMD(pro-metal dielectric) linear process, which can be applied to the recent semiconductor manufacturing process. We split the deposit condition of nitride films into four parts such as PO(protect overcoat) nitride, baseline, low hydrogen and high stress and low hydrogen, respectively. We tried to find out correlation between BPSG deposition and densification. In order to analyze the changes of Si-H and Si-NH-Si bonding density, we used FTIR area method. We also investigated the crack generation on wafer edge after BPSG densification, and the changes of nitride film stress as a function of RF power variation to judge whether the deposited films.

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Early Age Cracking Analysis of Massive Concrete Base Slab with Enhanced Microplane Model (개선된 미소면 모델을 적용한 매스콘크리트 기초슬래브의 초기균열거동 해석)

  • Lee, Yun;Kim, Jin-Keun;Woo, Sang-Kyun;Song, Young-Chul;Yi, Seong-Tae
    • Proceedings of the Korea Concrete Institute Conference
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    • 2006.05a
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    • pp.458-461
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    • 2006
  • Early age cracking of concrete is a widespread and complicated problem, and diverse applications in practical engineering have focused on this issue. Since massive concrete base slab composes the infrastructure of other concrete structures such as pier, concrete dam, and high rise buildings, early age cracking of that is considered as a crucial problem. In this study, finite element analysis (FEA) implemented with the age-dependent microplane model was performed. For a massive concrete base slab, cracking initiation and propagation, and deformation variation were investigated with concrete age. In massive concrete slab, autogenous shrinkage increases the risk of early age cracking and it reduces reinforcement effect on control of early age cracking. Gradual crack occurrence is experienced from exterior surface towards interior of the slab in case of combined hydration heat and autogenous shrinkage. FEA implemented with enhanced microplane model successfully simulates the typical cracking patterns due to edge restraint in concrete base slab.

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Prediction Methodology for Reliability of Semiconductor Packages

  • Kim, Jin-Young
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.09a
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    • pp.79-94
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    • 2002
  • Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

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A Measurement of Adhesion Energy between Viscoelastic/Elastic, Viscoelastic/Viscoelastic Materials Using Contact Mechanics Approach (접촉 역학적 접근에 의한 점탄성/탄성, 점탄성/점탄성 재료간의 접합 에너지 측정)

  • Lee, C.;Earmme, Y.Y.
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1030-1035
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    • 2003
  • The nanoimprint lithography technology makes higher density of semiconductor device and larger capacity of storage media. In this technology the induced damage while detaching polymer pattern from mold should be minimized. In order to analyze the problem, the basic knowledge of adhesion between the polymer and the mold is required. In this study a contact experiment of polyisobutylene specimen with spherical steel tip and polyisobutylene bead tip was conducted using nano indenter. During the contact experiment with various loading rate under load control the contact behavior of viscoelastic material was measured, i.e., the load and displacement between the tip and the specimen were measured. The data was analyzed by HBK model to obtain the stress intensity factor of contact edge and the contact radius as a function of time. Also the adhesion energies between steel/polyisobutylene and polyisobutylene/polyisobutylene were obtained employing the analysis of the crack of viscoelastic material by Schapery.

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An experimental-computational investigation of fracture in brittle materials

  • De Proft, K.;Wells, G.N.;Sluys, L.J.;De Wilde, W.P.
    • Computers and Concrete
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    • v.1 no.3
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    • pp.227-248
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    • 2004
  • A combined experimental-computational study of a double edge-notched stone specimen subjected to tensile loading is presented. In the experimental part, the load-deformation response and the displacement field around the crack tip are recorded. An Electronic Speckle Pattern Interferometer (ESPI) is used to obtain the local displacement field. The experimental results are used to validate a numerical model for the description of fracture using finite elements. The numerical model uses displacement discontinuities to model cracks. At the discontinuity, a plasticity-based cohesive zone model is applied for monotonic loading and a combined damage-plasticity cohesive zone model is used for cyclic loading. Both local and global results from the numerical simulations are compared with experimental data. It is shown that local measurements add important information for the validation of the numerical model. Consequently, the numerical models are enhanced in order to correctly capture the experimentally observed behaviour.

Weight Function Theory for a Mode III Crack In a Rectilinear Anisotropic Material (가중함수이론을 이용한 선형이방성재료에서의 Mode III 균열해석)

  • An, Deuk-Man;Kwon, Sun-Hong
    • Journal of Ocean Engineering and Technology
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    • v.23 no.1
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    • pp.146-151
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    • 2009
  • In this paper, a weight function theory for the calculation of the mode III stress intensity factor in a rectilinear anisotropic body is formulated. This formulation employs Lekhnitskii's formalism for two dimensional anisotropic materials. To illustrate the method used for the weight function theory, we calculated the mode III stress intensity factor in a single edge-notched configuration.

A Machine Vision Algorithm for the Automatic Inspection of Inserts (인서트 자동검사를 위한 시각인식 알고리즘)

  • 이문규;신승호
    • Journal of Institute of Control, Robotics and Systems
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    • v.4 no.6
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    • pp.795-801
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    • 1998
  • In this paper, we propose a machine vision algorithm for inspecting inserts which are used for milling and turning operations. Major defects of the inserts are breakage and crack on insert surfaces. Among the defects, breakages on the face of the inserts can be detected through three stages of the algorithm developed in this paper. In the first stage, a multi-layer perceptron is used to recognize the inserts being inspected. Edge detection of the insert image is performed in the second stage. Finally, in the third stage breakages on the insert face are identified using Hough transform. The overall algorithm is tested on real specimens and the results show that the algorithm works fairly well.

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Mixed Mode Fracture of the Crack Inclined to the Grain Direction in Wood (목재(木材)의 섬유방향(纖維方向)에 경사(傾斜)진 균열의 혼합모-드파괴(破壞)에 관한 연구)

  • Lee, Jun-Jae
    • Journal of the Korean Wood Science and Technology
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    • v.17 no.4
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    • pp.83-88
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    • 1989
  • 목재의 섬유방향에 경사진 균열의 모-드I과 모-드II의 혼합모-드파괴시의 파괴거동을 조사하기 위하여 라왕(Shorea Spp.)의 LA시스템에 있어서 서로 다른 경사각도를 가진 SEN시험편(Single edge notch specimen)에 대하여 휨 시험을 행하였다. 얻이진 결과는 혼합모-드파괴시, 모-드I응력확대계수$K_I$과 모-드II응력확대계수$K_II$간에 일정한 상호작용이 존재한다는 것을 나타내었다. 또한, 모-드I과 모-드II의 임계응력확대계수(Critical stress intensity factor) $K_{IC}$$K_{IIC}$ 이용하여 혼합모-드파괴시의 $K_I$$K_II$간의 상호관계를 규정할 수 있었으며, 이미 보고된 여러 실험식과 본 실험결과를 비교하여 가장 적합한 관계로서 아래와 같은 관계를 얻을 수 있었다.

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Analysis of Thermal Residual Stress in Composite Patches (복합재 패춰의 열잔류응력 해석)

  • 김위대;김난호
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.63-66
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    • 2000
  • This research addresses study on thermal residual stress of a composite patch repair of the edge cracked aluminium panel of aging aircraft. Composite patch repair is an efficient and economical technique to improve the damage tolerance of cracked metallic structures. These are thermal residual stresses due to the mismatch of coefficient of thermal expansion, and these are affected by the curing cycle of patch specimen. In this study, three curing cycles were selected for F.E. analysis. This study features the effect on composite patch and aluminum by thermal residual stress during crack propagation in aluminum plate.

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