• Mass Spectrometry Letters
• /
• v.6 no.4
• /
• pp.112-115
• /
• 2015

In this article, we examine the influences of Ne and He buffer gases under confined Ar⁺ ion cloud in a homemade Paul ion trap in various pressures and confinement times. The trap is of small size (r₀ = 1 cm) operating in a radio frequency (rf) voltage only mode, and has limited accuracy of 13 V. The electron impact and ionization process take place inside the trap and a Faraday cup has been used for the detection. Although the experimental results show that the Ar⁺ ion FWHM with Ne buffer gas is wider than the He buffer gas at the same pressure (1×10^-1 mbar) and confinement time is about 1000 μs, nevertheless, a faster cooling was found with He buffer gas with 500 μs. ultimetly, the obtanied results performed an average cloud tempertures reduced from 1777 K to 448.3 K for Ne (1000 μs) and from 1787.9 K to 469.4 K for He (500 μs)

• Electronics and Telecommunications Trends
• /
• v.17 no.4 s.76
• /
• pp.123-134
• /
• 2002

ISO/IEC14443-1(1), ISO/IEC10536-1(2), 그리고 ISO/IEC15693-1(3)에서 정의하고 있는 비접촉식 카드의 교류전기장 및 교류자기장에 대한 내성력 시험에 대해 살펴보고자 한다. 상기 규격은 ISO/IEC JTC1 기술위원회의 SC17에서 다루고 있으며, 아직 상기 표준 규격은 초안 상태에 있어 상세한 시험 방법에 대한 규격이 마련되어 있지 않은 실정이다. 그럼에도 불구하고 칩 카드 수입국은 수출업자에게 교류전기장 및 교류자기장 내성시험을 요구하고 있다. 따라서 업계에서는 시험 시설, 시험 방법, 시험 절차, 시험 평가 부분에서 많은 혼란이 발생되고 있다. 이러한 시험에 대한 대응책이 국가적 차원에서 시급히 마련되어야 할 것이다. 본 고에서는 이를 위한 일련의 과정으로서, 칩 카드 관련 국제 규격(1)-(5) 동향을 살펴보고, 교류전기장 및 교류자기장 내성력 시험 절차를 마련하기 위한 관점에서 IEC61000 시리즈 중에서 RF 복사 내성시험인 IEC61000-4-3(6), IEC61000-4-8, IEC61000-4-9, IEC61000-4-10, IEC61000-4-23(7)에 대한 분석을 동시에 실시하였다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.290-290
• /
• 2012

본 실험에서는 RF magnetron sputtering법과 evaporator법을 이용하여 다층박막 OMO구조를 $30{\times}30mm$ 유리기판 위에 제작하였다. Oxide층은 Sputter장비를 이용 IGZO막을 제작하였으며, Metal 층은 evaporator장비를 이용 Ag 막을 제작하였다. 변수로는 Oxide층의 시간에 따른 특성 변화를 연구하였다. 소결된 타겟으로는 In:Ga:ZnO를 각각 1:1:1 mol%의 조성비로 혼합하여 이용하였으며, Ag는 99.999%의 순도를 가진다. Oxide층의 RF sputter 공정 조건으로는 초기압력 $3.0{\times}10^{-6}$ Torr 이하로 하였으며, 증착 압력 $2.0{\times}10^{-2}$ Torr, Rf power 30 W, Ar gas 50 sccm으로 고정 시켰으며, 변수로는 5, 7, 9, 11분은 시간 차이를 두어 증착을 하였다. Metal층의 Evaporator 공정조건으로는 $5.0{\times}10^{-6}$ Torr이하, 전압은 0.3 V, Thickness moniter로 두께를 확인해가며 증착하였으며, $100{\AA}$으로 고정시켰다. 분석결과로는 XRD 측정 결과 35도 부근에서 Ag 피크가 관찰되었다. IGZO막 하나일때 90% 이상의 평균 투과율을 보였으며, 3층의 구조가 모두 증착됐을때의 투과도는 가시광영역에서 평균 80% 이상의 투과율을 보였으며, 500 nm부터 투과율이 떨어지기 시작해 800 nm부근에서는 평균 투과율이 30%까지 떨어져 Metal층인 Ag가 하나의 layer로 잘 증착이 된것을 보여주며, 플라즈몬효과를 보여줌을 알수있다. AFM측정 결과 평균 거칠기는 1.2 nm 정도의 거칠기를 확인했다. 홀 측정결과 전기적 특성은 발견되지 않았다.

• Electrical & Electronic Materials
• /
• v.9 no.2
• /
• pp.188-195
• /
• 1996

The AlSi etching process using the MERIE type reactor carried out with different process parameters such as C1$_{2}$ and N$_{2}$ gas flow rate, RF power and chamber pressure. The etching characteristics were evaluated in terms of etch rate, selectivity, uniformity and etched profile. As the N2 gas flow rate is increased, the AlSi etch rate is decreased and uniformity has remained constant within .+-.5%. The etch rate is increased and uniformity is decreased, according to increment of the C1$_{2}$ gas flow rate, RF power and chamber pressure. Selective etching of TEOS with respect to AlSi is decreased as the RF power is increased while it is increased by increment of the C1$_{2}$ gas flow rate and chamber pressure, on the other hand, selective etching of photoresist with respect to AlSi is increased by increment of the C1$_{2}$ gas flow rate and chamber pressure, it is decreased as the N$_{2}$ gas flow rate is increased.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.228.1-228.1
• /
• 2014

투명전도성 산화물(TCO,Transparent Conductive Oxide) 물질로 널리 사용되는 ITO 박막은 산화물 반도체를 평판 디스플레이용 투명전극 재료로 개발하기 위한 많은 연구가 진행되고 있다. ITO (Indium tin oxide)는 약 3.5 eV 정도의 넓은 밴드갭을 가진 축퇴반도체로서 전기적 및 광학적 특성이 우수하기 때문에 대표적 투명전도성 박막으로 가장 많이 사용되고 있다.현재 양산화된 ITO의 조성비는 90:10WT%인 타겟을 사용하는대 투명전극은 비저항이 $1{\times}10-3{\Omega}/sq$이하로 면저항이 $103{\Omega}/sq$전기전도성이 우수하고 380에서 780 nm의 가시광선 영역에서의 투과율이 80% 이상이라는 두 가지 성질을 만족시키는 박막이다. 본 실험에서는 SnO2 1~5wt% 인 ITO타겟을 제작하고 RF-Magnetron Sputtering을 사용하여 영구자석을 이용한 고밀도 플라즈마로 높은 점착성과, 균일한 박막 및 대면적 공정이 가능한 RF-magnetron sputtering방법으로 기판인 Slide glass위에 ITO를 증착하여 광학적 특성 및 전기적 특성에 대하여 측정하였다. 전기적, 광학적 특성 등 XRD을 통해 분석하였다. 그리고 증착된 모든 ITO 박막에서 가시광 투과율을 측정하기 위해 UV-Vis spectrophptometer을 이용하여 분석한 결과 90%이상의 높은 투과율이 측정되었다. ITO박막은 Anti-Fogging, Self-Cleaning, Solar cell 및 디스플레이소자 등 다양한 산업에 이용 가능할 것으로 생각된다.

• Journal of Electrical Engineering and Technology
• /
• v.2 no.1
• /
• pp.98-101
• /
• 2007

Yttrium(Y)-substituted bismuth titanate $(Bi_{4-x},Y_x)Ti_3O_{12}$ [x=0, 0.25, 0.5, 0.75, 1](BYT) thin films were deposited using an RF sputtering method on the $Pt/TiO_2/SiO_2/Si$ substrates. The structural properties and electrical properties of yttrium-substituted $(Bi_4-xYx)Ti_3O_{12}$ thin films were analyzed. The remanent polarization of $(Bi_4-xYx)Ti_3O_{12}$ films increased with increasing Y-content. The $(Bi_{3.25}Y_{0.75})Ti_3O_{12}$ films fabricated using a top Au electrode showed saturated polarization-electric field(P-E) switching curves with a remanent polarization(Pr) of $8{\mu}C/cm^2$ and coercive field (Ec) of 53 kV/cm at an applied voltage of 7 V. The $(Bi_{3.25}Y_{0.75})Ti_3O_{12}$ films exhibited fatigue-free behavior up to $4.5{\times}10^{11}$ read/write switching cycles at a frequency of 1MHz.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.8 no.5
• /
• pp.1013-1019
• /
• 2007

Amorphous silicon and silicon-nitride films were deposited using plasma-enhanced chemical vapor deposition (PECVD) method at $150^{\circ}C$. As fraction of $H_2$ in source gas was increased, characteristics of low-temperature silicon-nitride films approached those of conventional high-temperature films; the refractive index approached 1.9 and the ratio of nitrogen-hydrogen bonds to silicon-hydrogen bonds increased. And also, as fraction of $H_2$ in source gas was increased, characteristics of low-temperature silicon films approached those of conventional high-temperature films; refractive index and optical band gap approached 4.2 and 1.8 eV, and $[Si-H]/([Si-H]+[Si-H_2])$ increased. Lower RF power and process-pressure made the amorphous silicon films to be better properties. Increase of $H_2$ ratio seemed as the common factor to get reliable amorphous silicon and silicon-nitride films for thin-film-transistors (TFTs) at low temperature.

• Journal of the Korean Ceramic Society
• /
• v.35 no.5
• /
• pp.472-478
• /
• 1998

Ferroelectric SrBi2Ta2O9(SBT) films were deposited on Pt/Ti/SiO2/Si substrates at 50$0^{\circ}C$ using a sintered SBT target Bi and Ta targets by modified rf magnetron sputtering and then were annealed at 80$0^{\circ}C$ for 10min in oxygen ambinet(760 torr) The composition of the SBT films could be easily controlled using the mul-ti-targets. The film composition of {{{{ {Sr }_{0.8 } {Bi }_{2.9 } {Ta}_{2.0 } {O }_{9 } }} was obtained with SBTd sputtering power of 100 W Bi of 25W and Ta of 10 W. A 250nm thick SBT films exhibited a dense and uniform microstructure and showed the remanent polarization(Pr) of 14.4 $\mu$C/cm2 and the coercive field({{{{ {E }_{c } }})of 60 kV/cm at applied voltage of 5 V. The SBT films show practically no polarization fatigue up to {{{{ {10 }_{10 } }} cycles under 5V bipolar pulse. The retention characteristics of the SBT films looked very promising and the leakage current density of the SBT films was about 1.23$\times${{{{ {10 }^{-7 } }}A/c{{{{ {m }^{2 } }} at 120kV/cm.

• Journal of the Korean Ceramic Society
• /
• v.37 no.7
• /
• pp.632-637
• /
• 2000

Thermoelectric conversion properties of commercial Fe-Si2 and Fe-Si alloy ingots prepared by RF inductive furnace were investigated. As sintering temperature increased, density of the specimen increased and the phase transformation from metallic phases ($\varepsilon$-FeSi, ${\alpha}$-Fe2Si5) to semiconducting phase (${\beta}$-FeSi2) occurred more effectively. The FeSi phase was detected even after 100hrs of annealing treatment. For the Fesi1.95∼FeSi2.05 specimens prepared by RF inductive furnace, the thermoelectric property improved as the composition of the specimen approached to stoichiometric composition FeSi2. Electrical conductivity of the specimen increased with increasing temperatures showing typical semiconducting behavior. From the electrical conductivity measurements, activation energy in the intrinsic region (above about 700 K) was calculated to be approximately 0.46 eV. In spite of non-doping, the Seebeck coefficient for every specimen exhibited p-type conduction due to Si deficiency. Its maximum value was located at about 475 K, and then decreased abruptly with increasing temperatures. The power factor was governed by the Seebeck coefficient of the specimen more significantly than by electrical conductivity.

• Journal of Magnetics
• /
• v.12 no.4
• /
• pp.149-151
• /
• 2007

The AlCrN films were grown by RF reactive sputtering method under the selected conditions. The Cr concentration was varied by the number of Cr pieces placed on the Al target. The sample quality has been studied by XRD, Auger spectroscopy, optical absorption and electrical resistant measurements. The XRD and Auger results show that the samples consist of a major phase with the $Al_{1-x}Cr_xN$ formula, which has a hexagonal structure, and a few percents at. of oxygen, which may form $Al_2O_3$. There exist the Cr clusters in the samples with high concentration of Cr. The optical absorption measurement provides the information about the band gap that relates strongly to the quality of samples. The quality of samples is also clearly reflected in electrical measurement, i.e., the temperature dependence of resistance exhibits a semiconductor characteristic only for the samples that have no Cr cluster. In these cases, the values of ionization energies $E_a$ can be derived from R(T) plots by using the function R(T) = Ro exp $(E_a/k_BT)$.