• Wind and Structures
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• v.36 no.4
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• pp.237-247
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• 2023

The emergence of high-rise buildings has necessitated frequent structural health monitoring and maintenance for safety reasons. Wind causes damage and structural changes on tall structures; thus, safe structures should be designed. The pressure developed on tall buildings has been utilized in previous research studies to assess the impacts of wind on structures. The wind tunnel test is a primary research method commonly used to quantify the aerodynamic characteristics of high-rise buildings. Wind pressure is measured by placing pressure sensor taps at different locations on tall buildings, and the collected data are used for analysis. However, sensors may malfunction and produce erroneous data; these data losses make it difficult to analyze aerodynamic properties. Therefore, it is essential to generate missing data relative to the original data obtained from neighboring pressure sensor taps at various intervals. This study proposes a deep learning-based, deep convolutional generative adversarial network (DCGAN) to restore missing data associated with faulty pressure sensors installed on high-rise buildings. The performance of the proposed DCGAN is validated by using a standard imputation model known as the generative adversarial imputation network (GAIN). The average mean-square error (AMSE) and average R-squared (ARSE) are used as performance metrics. The calculated ARSE values by DCGAN on the building model's front, backside, left, and right sides are 0.970, 0.972, 0.984 and 0.978, respectively. The AMSE produced by DCGAN on four sides of the building model is 0.008, 0.010, 0.015 and 0.014. The average standard deviation of the actual measures of the pressure sensors on four sides of the model were 0.1738, 0.1758, 0.2234 and 0.2278. The average standard deviation of the pressure values generated by the proposed DCGAN imputation model was closer to that of the measured actual with values of 0.1736,0.1746,0.2191, and 0.2239 on four sides, respectively. In comparison, the standard deviation of the values predicted by GAIN are 0.1726,0.1735,0.2161, and 0.2209, which is far from actual values. The results demonstrate that DCGAN model fits better for data imputation than the GAIN model with improved accuracy and fewer error rates. Additionally, the DCGAN is utilized to estimate the wind pressure in regions of buildings where no pressure sensor taps are available; the model yielded greater prediction accuracy than GAIN.

• Steel and Composite Structures
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• v.50 no.6
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• pp.705-720
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• 2024

Analyzing the collapse behavior of thin-walled steel structures holds significant importance in ensuring their safety and longevity. Geometric imperfections present on the surface of metal materials can diminish both the durability and mechanical integrity of steel shells. These imperfections, encompassing local geometric irregularities and deformations such as holes, cavities, notches, and cracks localized in specific regions of the shell surface, play a pivotal role in the assessment. They can induce stress concentration within the structure, thereby influencing its susceptibility to buckling. The intricate relationship between the buckling behavior of these structures and such imperfections is multifaceted, contingent upon a variety of factors. The buckling analysis of thin-walled steel shell structures, similar to other steel structures, commonly involves the determination of crucial material properties, including elastic modulus, shear modulus, tensile strength, and fracture toughness. An established method involves the emulation of distributed geometric imperfections, utilizing real test specimen data as a basis. This approach allows for the accurate representation and assessment of the diversity and distribution of imperfections encountered in real-world scenarios. Utilizing defect data obtained from actual test samples enhances the model's realism and applicability. The sizes and configurations of these defects are employed as inputs in the modeling process, aiding in the prediction of structural behavior. It's worth noting that there is a dearth of experimental studies addressing the influence of geometric defects on the buckling behavior of cylindrical steel shells. In this particular study, samples featuring geometric imperfections were subjected to experimental buckling tests. These same samples were also modeled using Finite Element Analysis (FEM), with results corroborating the experimental findings. Furthermore, the initial geometrical imperfections were measured using digital image correlation (DIC) techniques. In this way, the response of the test specimens can be estimated accurately by applying the initial imperfections to FE models. After validation of the test results with FEA, a numerical parametric study was conducted to develop more generalized design recommendations for the stainless-steel shell structures with the initial geometric imperfection. While the load-carrying capacity of samples with perfect surfaces was up to 140 kN, the load-carrying capacity of samples with 4 mm defects was around 130 kN. Likewise, while the load carrying capacity of samples with 10 mm defects was around 125 kN, the load carrying capacity of samples with 14 mm defects was measured around 120 kN.

• Journal of Technology Innovation
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• v.26 no.3
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• pp.37-68
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• 2018

Since the 20th century, automobiles, which are the most common means of transportation, have been evolving as the use of electronic control devices and automotive semiconductors increases dramatically. Automotive semiconductors are a key component in automotive electronic control devices and are used to provide stability, efficiency of fuel use, and stability of operation to consumers. For example, automotive semiconductors include engines control, technologies for managing electric motors, transmission control units, hybrid vehicle control, start/stop systems, electronic motor control, automotive radar and LIDAR, smart head lamps, head-up displays, lane keeping systems. As such, semiconductors are being applied to almost all electronic control devices that make up an automobile, and they are creating more effects than simply combining mechanical devices. Since automotive semiconductors have a high data rate basically, a microprocessor unit is being used instead of a micro control unit. For example, semiconductors based on ARM processors are being used in telematics, audio/video multi-medias and navigation. Automotive semiconductors require characteristics such as high reliability, durability and long-term supply, considering the period of use of the automobile for more than 10 years. The reliability of automotive semiconductors is directly linked to the safety of automobiles. The semiconductor industry uses JEDEC and AEC standards to evaluate the reliability of automotive semiconductors. In addition, the life expectancy of the product is estimated at the early stage of development and at the early stage of mass production by using the reliability test method and results that are presented as standard in the automobile industry. However, there are limitations in predicting the failure rate caused by various parameters such as customer's various conditions of use and usage time. To overcome these limitations, much research has been done in academia and industry. Among them, researches using data mining techniques have been carried out in many semiconductor fields, but application and research on automotive semiconductors have not yet been studied. In this regard, this study investigates the relationship between data generated during semiconductor assembly and package test process by using data mining technique, and uses data mining technique suitable for predicting potential failure rate using customer bad data.