• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.11
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• pp.1358-1366
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• 1988

The dual dielectric films have been grown on single-crystalline silicon substrates with the thickness ranging from 125A to 180A at various gas and temperature conditions by using rapid thermal process that included independent nitridation step. The film characteristics and their dependence on the contents of the hydrochloric gas and the processing time have been studied. By the addition of the hydrochloric gas, the initial oxide thickness was significantly changed, but after sequential nitridation processes the thickness of the films was nevertheless a little bit varied within 10A. All the samples of the dual dielectric films show the increased breakdown voltages in proportion to the additive contents of the hydrochloric gas and also show the higher breakdown strengths than the thermal oxide and nitrided oxide films grown by the conventional furnance process or the rapid thermal nitridation process that was composed of the dependent nitridation cycles.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.41-46
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• 2016

With the recent increase in size of ships and offshore structures, there are more demand for thicker plates. As the thickness increases, it is known that fatigue life of the structures decrease. To improve the fatigue life, post weld treatments techniques, such as toe grinding, TIG dressing and hammer peening, are typically employed. However, these techniques require additional construction time and production cost. Therefore, it is of crucial interest steels with longer fatigue crack growth life compared to conventional steels. This study investigates fatigue crack growth rate (FCGR) behaviours of conventional EH36 steel and Ferrite-Bainite dual phase EH36 steel (F-B steel). F-B steel is known to have improved fatigue performance associated with the existence of two different phases. Ferrite-Bainite dual phase microstructures are obtained by special thermo mechanical control process (TMCP). FCGR behaviours are investigated by a series of constant stress-controlled FCGR tests. Considering all test conditions (ambient, low temperature, high stress ratio), it is shown that FCGR of F-B steel is slower than that of conventional EH36 steel. From the tensile tests and impact tests, F-B steel exhibits higher values of strength and impact energy leading to slower FCGR.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.3
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• pp.242-250
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• 2004

In this thesis, a new broadband PIFA(Planar Inverted-F Antenna) for PCS and IMP-2000 applications is designed. The dual-L antenna structure is adopted in order to improve the characteristics of PIFA which usually has a narrow band. The height of the antenna is fixed 6 mm considering terminal's thickness and the structure is deformed into the folded radiation patches to minimize the size of the antenna. The bandwidth of a realized antenna is 1.66∼2.35 ㎓(34.5 %) fur return loss below -10 ㏈ which contain the required bandwidth of PCS and IMT-2000. And Monopole antenna with λ/4 length is designed and compared with dual-L with folded patch in SAR. 1 g and 10 g averaged peak SAR of PIFA are about 25.7 %, 30.3 % lower than those of monopole antenna respectively.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.9 no.1
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• pp.103-107
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• 2009

In this paper, we designed and implemented a dual band chip antenna for WLAN, which contains within the small LAN card contrary to the enternal AP(Access Point) antenna. Limiting about the antenna size, we used dielectrics of high permittivity. Totally considering problems of demand-supply, price and characteristics, we used that relative dielectrics of ceramic is 9.8 and the thickness is 3.5mm and 5mm. Ceramic antenna can be used not only triple mode of IEEE 802.11.a,g and b but also broadband. The frequency bands have wideband characteristics of 2.4~2.5GHz and 4.9~5.85GHz and relatively constant performance.

• Transactions of Materials Processing
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• v.24 no.6
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• pp.395-399
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• 2015

A microstructure-based finite element simulation was conducted to predict the plastic strain ratio (R-value) of a dual-phase (DP) steel. The representative volume elements (RVEs) concept was adopted for the image-based FE modeling and a 3D model was constructed using sequential 2D images. Each phase was considered with the von-Mises yield criterion and the Swift model. The Swift parameters were defined by the empirical equations based on the chemical composition. The developed model was applied to analyze the effect of residual stress on the R-value and stress distribution. In order to consider the residual stress development after cold rolling, 10 % compression was applied in the thickness direction and unloaded before the tensile stress was applied in the rolling direction. The results showed a reasonable prediction for the R-value evolution: a sharp increase at small strains was well described and a transition followed in the downward direction. The R-value evolution was analyzed using the stress distribution change on the π-plane

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.1
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• pp.11-16
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• 2001

CuNi alloy films are deposited by co-sputtering of dual targets (Cu and Ni, respectively). Effects of the co-sputtering conditions, such as powers applied to the targets, deposition pressures, and substrate temperatures, on the structural and electrical properties of deposited films are systematically investigated. The composition ratio of Ni/Cu is almost linearly decreased by increasing the DC power applied to the Cu target from 25.6 W to 69.7 W with the RF power applied to the Ni target unchanged(140 W). it is noted that the chamber pressure during deposition and the film thickness give rise to a change of the Ni/Cu ratio within the films deposited. The former may be due to a higher sputtering yield of Cu atom and the latter due to the re-sputtering phenomenon of Cu atoms on the surface of deposited film. The film deposited at higher pressures or at lower substrate temperatures have a smaller crystallite size, a higher electrical resistivity, and much more voids. This may be attributed to a lower surface mobility of sputtered atoms over the substrate.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.76-78
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• 2011

In this paper, 0.8 GHz and 1.8 GHz dual-band antenna was designed for global system for mobile communications (GSM) and the Long Term Evolution (LTE) The proposed antenna was made using CST Microwave Studio 2009. My script antenna's substrate is Taconic TLY-5 and dielectric constant is 2,2 and has 1.0mm thickness with a compact design of the proposed antenna, Thus it shows that this proposed antenna can be used in Wireless Communication System.

• Archives of Plastic Surgery
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• v.48 no.3
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• pp.287-292
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• 2021

Background We report the efficacy of a dual-plane approach using a Dufourmentel skin flap with a purse-string suture of the de-epithelized dermis to manage pseudoaneurysm at the vascular access site for hemodialysis. Methods A retrospective analysis was conducted of 61 patients from 2013 to 2018 with pseudoaneurysms at the arteriovenous fistula or graft who were treated with rhomboid excision, vessel repair with a purse-string suture, and a full-thickness Dufourmentel skin flap. The success rate was defined as the probability of complete wound closure and intact vascular access patency without infection or other complications. Results The success rate was 93.4% at 6 months postoperatively. Complications included newly occurring pseudoaneurysms (n=2), wound dehiscence (n=1) and bleeding (n=1). There were no complications such as stenosis or thrombosis from the procedure. Conclusions A dual-plane approach using a Dufourmentel skin flap with a purse-string suture for vessel repair was shown to be a favorable option for managing stable, small (diameter <2 cm) pseudoaneurysms without infection, rapid expansion, or patency issues of the vascular access.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.11
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• pp.725-728
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• 2016

We investigated the characterizations of carbon films fabricated by dual magnetron sputtering under various film thickness for the electrodes in TCO-less DSSC (dye-sensitized solar cells). Carbon films prepared at various conditions were exhibited smooth and uniform surfaces without defects. Also, the rms surface roughness of carbon films was decreased from 2.25 nm to 1.0 nm with the increase of film thickness. The sheet resistance as the electrical properties are improved from $11.2{\times}10^{-3}$ to $2.28{\times}10^{-3}$ with the increase of film thickness. In the results, the performance of TCO-less DSSC critically depended on the film thickness of working electrodes, indicating the conductivity of carbon films.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.30-35
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• 2020

A microlens has been fabricated by various methods such as a thermal reflow, hot embossing, diamond milling, etc. However, these methods require a relatively complex process to control the microlens shape. In this work, we report on a simple and cost-effective method to fabricate a cylindrical microlens (CML), which can diffuse light widely. We have employed a slot-die head with the dual plate (a meniscus guide with a protruded μ-tip and a shim with a slit channel) for coating of a narrow stripe using poly(methyl methacrylate) (PMMA). We have shown that the higher the coating gap, the lower the maximum coating speed, which causes an increase in the stripe width and thickness. The coated PMMA stripe has the concave shape. To make it in the shape of a convex microlens, we have applied the thermal reflow method. When the stripe thickness is small, however, its effect is negligible. To increase the stripe thickness, we have increased the number of repeated coating. With this scheme, we have fabricated the CML with the width of 223 ㎛ and the thickness of 7.3 ㎛. Finally, we have demonstrated experimentally that the CML can diffuse light widely, a feature demanded for light extraction efficiency of organic light-emitting diodes (OLEDs) and suppression of moiré patterns in displays.