• Title/Summary/Keyword: distance between pads

Search Result 9, Processing Time 0.025 seconds

Effects of Distance between Pads on the Film Pressure in Pad Bearings (패드 베어링에서 패드사이의 거리가 유막압력에 미치는 영향)

  • Kim, Jong-Soo;Kim, Kyung-Woong
    • Tribology and Lubricants
    • /
    • v.13 no.1
    • /
    • pp.53-61
    • /
    • 1997
  • Experiments are conducted to investigate the effects of distance between pads on the film pressure and the inlet pressure build-up at the entrance of pad bearings. The inlet pressure and the film pressure are measured by manometers in several cases of the distance between pads. The experimental results are also compared with the theoretical results which are calculated using the several methods for the estimation of the inlet pressure. In the experimental results , the distance between pads has a large influence on the film pressure and the inlet pressure build-up a bearing entrance. It is also shown that the effects of the inlet pressure on the film pressure are remarkable, although inertia parameter is a little higher (${\ge}0.05$).

A Study on the Inlet Pressure Build-Up at Bearing Entrance (베어링 입구에서 발생하는 선단압력에 관한 연구)

  • 김종수;김경웅
    • Transactions of the Korean Society of Mechanical Engineers
    • /
    • v.17 no.8
    • /
    • pp.1921-1930
    • /
    • 1993
  • In order to evaluate the inlet pressure correctly, the full Navier-Stokes equations are solved numerically for the computational domain which covers the cavity region between pads as well as the bearing film. A nonuiform grid system is adopted to reduce the number of grid points, and the numerical solutions are obtained for a wide range of Reynolds number in laminar regime with various values of the distance between pads. The numerical results show that the inlet pressure is significantly affected by Reynolds number and the distance between pads. An expression for the loss coefficient in terms of Reynolds number and non-dimensional distance between pads is obtained on the basis of the numerical results. It is found that the inlet pressure over the whole range of numerical solutions can be fairly accurately estimated by applying the formula for the loss coefficient to the extended Bernoulli equation.

Comparison and analysis the Effect of Vibration Control Sleeper Pads on Gwe-Mok Elevated Railway Bridge in Jeolla Line (전라선 괴목고가교 방진침목패드 시공 전/후 비교 분석)

  • 엄기영;유원희;김지훈
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
    • /
    • 2002.05a
    • /
    • pp.924-928
    • /
    • 2002
  • Response of the rail surface is an important factor for the train safety and comfortable travel, and evaluation of vibration at the area along a rail is an important factor for the vibration. The dominant method to reduce the vibration that reach the ground is installing vibration absorber between rall and the under structure. In this paper, we evaluated the vibration reducing effect of using vibration control sleeper pads to slave and earth at certain distance from the sleepers.

  • PDF

A STUDY ON THE OCCLUSAL PLANE AND THE VERTICAL DIMENSION IN KOREAN ADULTS WITH NATURAL DENTITION (한국 성인 유치악자의 교합평면 및 수직고경에 관한 연구)

  • Park Jeong-Hyeong;Jeong Chang-Mo;Jeon Young-Chan;Lim Jang-Seop
    • The Journal of Korean Academy of Prosthodontics
    • /
    • v.43 no.1
    • /
    • pp.41-51
    • /
    • 2005
  • Statement of problem. Anatomic landmarks have been used in the orientation of occlusal plane and the determination of vertical dimension for edentulous patients. Such as labial vestibules of anterior region and hamular notches, retromolar pads of posterior region are very useful anatomic landmarks for fabrication of occlusion rim because they are to be identified on master casts. Therefore, if average distances between landmarks of maxillae and mandible in dentate subjects are measured and applied, not only occlusal plane but also vertical dimension can be established initially. Purpose. The purpose of this study is to measure vertical distances between anatomic landmarks and to present a guide to the orientation of occlusal plane and the determination of vertical dimension of edentulous patients. Material and method. Upper and lower border-molded casts were made in 93 Korean dentulous subjects, mean age 25 years. Incisal edges of central incisors, bottoms of labial vestibules, hamular notches and the half level of retromolar pads were marked on casts. Measurements of vertical distances from incisal edge of central incisor to the bottom of labial vestibule, between upper and lower bottoms of labial vestibules, from hamular notch to retromolar pad and from hamular notch to the occlusal plane established by the incisal edge of maxillary central incisor and mesiopalatal cusps of both maxillary first molars were made on each cast. Results and conclusion. 1. The mean distance from the incisal edge of central incisor to the bottom of labial vestibule was 20.8mm(SD 1.7) on upper casts and 17.3mm(SD 1.4) on lower casts. 2. The mean distance between both bottoms of labial vestibules of upper and lower casts was 35.0mm(SD 2.7). 3 The mean distance from hamular notch to the half level of retromolar pad was 5.0mm(SD 1.3). 4. The mean distance from hamular notch to occlusal plane was 7.9mm(SD 1.5). 5. Distances from incisal edge of central incisor to labial vestibule on lower casts(P<0.01) and from hamular notch to retromolar pad(P<0.0001) were greater in male than in female.

A Study On Fatigue Properties Of BeCu Thin Film For Probe Tip (프루브 팁용 BeCu 박막의 피로성질 연구)

  • Shin, Myung-Soo;Park, Jun-Hyub;Seo, Jeong-Yun
    • Proceedings of the KSME Conference
    • /
    • 2008.11a
    • /
    • pp.256-259
    • /
    • 2008
  • An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

  • PDF

Topology Optimization of Railway Brake Pad by Contact Analysis (접촉해석에 의한 철도차량용 제동패드의 형상 최적화)

  • Goo, Byeong-Choon;Na, In-Kyun
    • Tribology and Lubricants
    • /
    • v.30 no.3
    • /
    • pp.177-182
    • /
    • 2014
  • To stop a high speed train running at the speed of 300 km/h, the disc brake for the train should be able to dissipate enormous kinetic energy of the train into frictional heat energy. Sintered pin-type metals are mostly used for friction materials of high speed brake pads. A pad comprises several friction pins, and the topology, length, flexibility, composition, etc. have a great influence on the tribological properties of the disc brake. In this study, the topology of the friction pins in a pad was our main concern. We presented the optimization of the topology of a railcar brake pad with nine-pin-type friction materials by thermo-mechanical contact analysis. We modeled the brake pad with/without a back plate. To simulate a continuous braking, the pad or friction materials were rotated at constant velocity on the friction surface of the disc. We varied the positions of the nine friction materials to compare the temperature distributions on the disc surface. In a non-optimized brake pad, the distance between two neighboring friction materials in the radial direction from the rotational center of the disc was not equal. In an optimized pad, the distance between two neighboring friction materials in the radial direction was equal. The temperature distribution on the disc surface fluctuated more for the former than the latter. Optimizing the pad reduced the maximum temperature of the brake disc by more than 10%.

A Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT) (표면실장기술(SMT)의 조립 및 접합 신뢰성에 대한 패드설계의 영향에 관한 연구)

  • Park, Dong-Woon;Yu, Myeong-Hyeon;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.29 no.3
    • /
    • pp.31-35
    • /
    • 2022
  • Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

Fabrication Of Ultraviolet LED Light Source Module Of Current Limiting Diode Circuit By Using Flip Chip Micro Soldering (마이크로솔더링을 이용한 정전류다이오드 회로 자외선 LED 광원모듈 제작)

  • Park, Jong-Min;Yu, Soon Jae;Kawan, Anil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.29 no.4
    • /
    • pp.237-240
    • /
    • 2016
  • The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

First-order Wire-wound SQUID Gradiometer System Having Compact Superconductive Connection Structure between SQUID and Pickup Coil (SQUID와 검출코일의 초전도 결합방식이 개선된 1차 권선형 미분계 시스템)

  • Lee, Y.H.;Yu, K.K.;Kim, J.M.;Kwon, H.;Kim, K.;Park, Y.K.
    • Progress in Superconductivity
    • /
    • v.9 no.1
    • /
    • pp.23-28
    • /
    • 2007
  • In order to have a superconductive connection between the wire-wound pickup coil and input coil, typically Nb terminal blocks with screw holes are used. Since this connection structure occupies large volume, large stray pickup area can be generated which can pickup external noise fields. Thus, SQUID and connection block are shielded inside a superconducting tube, and this SQUID module is located at some distance from the distal coil of the gradiometer to minimize the distortion or imbalance of uniform background field due to the superconducting module. To operate this conventional SQUID module, we need a higher liquid He level, resulting in shorter refill interval. To make the fabrication of gradiometers simpler and refill interval longer, we developed a novel method of connecting the pickup coil into the input coil. Gradiometer coil wound of 0.125-mm diameter NbTi wires were glued close to the input coil pads of SQUID. The superconductive connection was made using an ultrasonic bonding of annealed 0.025-mm diameter Nb wires, bonded directly on the surface of NbTi wires where insulation layer was stripped out. The reliability of the superconductive bonding was good enough to sustain several thermal cycling. The stray pickup area due to this connection structure is about $0.1\;mm^2$, much smaller than the typical stray pickup area using the conventional screw block method. By using this compact connection structure, the position of the SQUID sensor is only about 20-30 mm from the distal coil of the gradiometer. Based on this compact module, we fabricated a magnetocardiography system having 61 first-order axial gradiometers, and measured MCG signals. The gradiometers have a coil diameter of 20 mm, and the baseline is 70 mm. The 61 axial gradiometer bobbins were distributed in a hexagonal lattice structure with a sensor interval of 26 mm, measuring $dB_z/dz$ component of magnetocardiography signals.

  • PDF