• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 1999.11a
• /
• pp.111-115
• /
• 1999

The $Li_2O-MgO-MgF_2-SiO_2$glasses with addition of $B_2O_3$ were investigated in order to make glass-ceramics for low temperature firing substrate. Glasses were made by melting at $1450^{\circ}C$ in the electronic furnace and crystallized at $750^{\circ}C$. After the crystallization, crystal phases and microstructure were observed. The crystal phases were polycrystalline of lithium boron fluorphlogopite and lithium fluorhectorite. The crystal shape was changed to grande type from needle type with the increase in $B_2O_3$ contents. Average particle size of the glass-ceramics aftar water swelling was $3.77{\mu}{\textrm}{m}$. The optimum sintering temperature and sintering shrinkage of the substrate were $900^{\circ}C$ and 13.4vol%, respectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.3
• /
• pp.25-29
• /
• 2002

Single ion exchange process was used, and the ion exchange behavior and mechanical properties were investigated in substrate glass for flat panel display. In order to study the effects of ion exchange, ion exchange behavior with ion penetration depth, amount of ion exchange, density and thermal expansion was measured according to the time and temperature. The mechanical properties were evaluated by the three point bending test and curvature change, and then the fracture patterns were investigated by optical microscope.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.1272-1273
• /
• 2009

We demonstrate conformal phosphor coating and patterning methods on light emitting diodes (LEDs) using image processing based optofluidic maskless lithography (IP-OFML) system in microfluidic channels. IP-OFML allows a real-time detection and dynamic mask generation for packaging of randomly dispersed microchips. Our system detects each chip by considering rotation of the chip through image processing regardless of their arrangement error. Therefore, it precisely packages the chip making conformal polymer layer.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.2
• /
• pp.55-59
• /
• 2017

An optical method to inspect the 3-D shape of surface of Micro BGA is proposed, where spatially arranged LED light sources and specular reflection are considered. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics for all BGA's contained in a captured image are used together to find out the criteria for the detection of existing defects, and the usefulness of the proposed method is shown via experiments.

• Journal of Korean Vacuum Science & Technology
• /
• v.3 no.1
• /
• pp.95-97
• /
• 1999

A 3.12" FED panel was packaged successfully using the anode plate on which phosphors and black matrix were coated and cathode plate containing emitter arrays. The vacuum level of the panel was investigated during panel evacuation, tip-off and getter activation process. The packaged panel exhibited vacuum level below 2${\times}$10-6 Torr. Similar experiments were carried out for 10" panel made of bare plates. In addition, the vacuum level of two panels was compared continuously after tip off process; one with the getter and the other without it.

• The Journal of the Convergence on Culture Technology
• /
• v.6 no.3
• /
• pp.377-380
• /
• 2020

The increase in single households, changes in consumption behavior, and the size of marts are becoming larger, whereas the packaging form is being changed to small packaging containers, small packages are being exported when exporting agricultural products, especially fruits and related crops, leading to CO2 at the time of export. Although it was processed, it was difficult to guarantee the freshness of the crops inside the package during the transportation period. Therefore, it is necessary to provide a new method of maintaining freshness for application to agricultural products distributed in small packaging containers as a freshness retention agent to prevent deterioration of crops by microorganisms due to changes in product temperature during transportation or display during distribution of agricultural products. I was researching ways to bring about innovation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.1
• /
• pp.63-67
• /
• 2008

The charged particle type display is a kind of electronic paper showing information images using positive and negative charged particles ($<10{\mu}m$). In this work we used yellow(-) and black(+) particles which are respectively addressed to the cells of a upper and a rear substrate by using electric field. Our independent addressing method has strong points compared to the mixed particle putting method. The packaging with two orthogonal substrates and the aging process is followed by addressing process. The panel is sequentially driven by matrix method for each 4-unit cells. Layers of particles are controlled by barrier ribs and must be addressed to minimum 2 layers.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.1
• /
• pp.21-27
• /
• 2015

We propose a fabrication process of a 3-electrode type reflective display and ascertain the realized color panel. The first design is proceeded with basis on Ti electrode for fast panel fabrication, easy align process, and high reflection of a white image. To observe the particle movement at the lower electrodes and optimize the space between electrodes, we design the second patterns, from which we establish a fabrication process with the mixing of electronic ink, loading of this ink, electronic ink assembly, driving, and packaging. After aging process, we ascertain a normally driving panel with black, white, and blue color.

• Journal of the Semiconductor & Display Technology
• /
• v.3 no.4
• /
• pp.33-37
• /
• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.11a
• /
• pp.76-79
• /
• 2003

The characteristic of single wall carbon nanotube (SW-CNT) and herringbone nano fiber (HB-CNF) emitters was described. SW-CNT synthesized by arc discharge and HB-CNF prepared by thermal CVD were mixed with binders and conductive materials, and then were formed by screen-printing process. In order to obtain efficient field emissions, the surface treatment of rubbing & peel-off was applied to the printed CNT and CNF emitters. The basic structure of FED was of a diode type through fully vacuum packaging. Also, we proposed a new triode type of field emitter using a mesh gate plate having tapered holes and could achieve the ideal triode properties with no gate leakage currents.