• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.19-26
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• 2020

Flexible displays have been evolved into curved, foldable, and rollable as the degree of bending increases. Due to the presence of brittle electrodes (e.g. indium-tin oxide (ITO)) that easily cracked and delaminated under severe bending deformation, lowering mechanical stress of the electrodes has been critical issue. Because of this, mechanical stress of brittle electrode in flexible displays has been analyzed mostly in terms of bending radius. On the other hand, in order to make rollable display, various mechanical components such as roller and spring are needed to roll-up or extend the screen for the rollable display apparatus. By these mechanical components, brittle electrode in the rollable display is subjected to the excessive tensile stress due to the retracting force as well as the bending stress by the roller. In this study, mechanical deformation of rollable OLED display was modeled considering boundary conditions of the apparatus. An analytical modeling based on the classical beam theory was introduced in order to investigate the mechanical behavior of the rollable display. In addition, finite element analysis (FEA) was used to analyze the effect of mechanical components in the apparatus on the brittle electrode. Furthermore, a strategy for improving the mechanical reliability of the rollable display was suggested through controlling the stiffness of adhesives in the display panel.

• The monthly packaging world
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• s.349
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• pp.65-81
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• 2022

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.3
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• pp.170-174
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• 2017

In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.1
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• pp.37-40
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• 2001

New package process for PDP was proposed based on the glass-to-glass vacuum-electrostatic bonding process and tubeless packaging concept derived from the previous study. Hermeticity and operating performance of PDP test panel through the seal-off process application and the possibility for practical use might be high if the process simplicity and productivity-related effort was sequentially carried out.

• Proceedings of the Korean Vacuum Society Conference
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• 1997.07a
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• pp.89-90
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• 1997

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.85-89
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• 2006

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.1
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• pp.7-10
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• 2013

A packaging system integrated in primary and secondary packages to deliver consumers fresh peach in the produce supply chain was designed and its effectiveness on quality preservation was tested. The master packaging system was designed to contain 6 individual polypropylene film (PP, $30{\mu}m$ thickness) packages of 300 g peach fruit inside $35{\mu}m$ thick low density polyethylene (LDPE) bag located in a corrugated paperboard box. As a variable to attain the desired package atmosphere around the fruit during cold storage and subsequent retail display at higher temperature, different numbers (1, 3 and 7) of microperforations in $59{\mu}m$ diameter were tested on the individual PP packages. As control treatment, six fruits were placed without wrapping in a corrugated paperboard box. During the storage at $5^{\circ}C$, the control and individual packages were periodically separated from the box or master package, moved to the simulated retail shelf conditions of $20^{\circ}C$ and then stored for 3 more days with package atmosphere and fruit quality being measured. The package with 7 microperforations was the best in the ability to attain beneficial MA of 6~10% $O_2$ and 11~19% $CO_2$ around the fruit during the chilled storage at $5^{\circ}C$ and simulated retail display at $20^{\circ}C$. Packages with smaller number of microperforations resulted in anaerobic atmosphere at the low temperature storage and/or the subsequent high temperature display. Compared to control, all the treatments with master packaging system gave better retention of fruit firmness with significantly less weight loss.

• Food Science and Preservation
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• v.7 no.2
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• pp.166-170
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• 2000

In order to improve cut-flower export packaging on the distribution process, newly developed T-type(trapezoid type) container was tested and evaluated on the viewpoints of the protection, workability, and economics. T-type container performed better in protection and workability comparing to 0201 and modified 0201 type containers. Especially, load efficiency of T-type container was 33 percent higher than others, indicating that total distribution costs from Korea to Japan can be saved up to 1.7million dollars per year. T-type container is also advantageous because of its superior display performance and environmentally friendly design. We recommend that T-type container is suitable for most of cut-flowers which are usually horizontally packed such as roses, chrysanthemums, and lilies.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.45-49
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• 2022

Through Silicon Via (TSV) is a technology that interconnects chips through silicon vias. TSV technology can achieve shorter distance compared to wire bonding technology with excellent electrical characteristics. Due to this characteristic, it is currently being used in many fields that needs faster communication speed such as memory field. However, there is performance degradation issue on TSV technology due to the parasitic capacitance. To deal with this problem, in this study, the parasitic capacitance with TSV design factors is analyzed using commercial tool. TSV design factors were set in three categories: size, aspect ratio, pitch. Each factor was set by dividing the range with TSV used for memory and package. Ansys electronics desktop 2021 R2.2 Q3D was used for the simulation to acquire parasitic capacitance data. DOE analysis was performed based on the reaction surface method. As a result of the simulation, the most affected factors by the parasitic capacitance appeared in the order of size, pitch and aspect ratio. In the case of memory, each element interacted, and in the case of package, it was confirmed that size * pitch and size * aspect ratio interact, but pitch * aspect ratio does not interact.

• Journal of Information Display
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• v.10 no.2
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• pp.49-53
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• 2009

In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.