• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.426-429
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• 2005

The fringe-field switching (FFS) mode associated with a transition from a homogenously aligned to twist deformation require rubbing process. In this devices, $1^o$ of misalignment in an azimuthal direction could cause voltage-dependent transmittance (V-T) to be different from that in a normal area and consequently results in a rubbing mura. According to our studies, the single domain FFS cells are much more sensitive to the rubbing mura than the dual domain FFS cell. Moreover, the FFS cells with negative LC are much more sensitive to the rubbing mura than the FFS cells with positive LC.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.419-422
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• 2005

We have studied transflective liquid crystal displays (LCDs) associated with fringe-field switching (FFS) mode to achieve high image quality. In the past, several cell structures were used to fabricate transflective FFS liquid crystal display s. Their structures and characteristics are carefully examined to find their merits and cons. Further, optimization of cell parameters to achieve a single driving circuit is performed.

• 반도체디스플레이기술학회지
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• 제11권1호
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• pp.49-54
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• 2012

There have been plenty of difficulties because properties of Alq3 are unable to acquire in a process of manufacture of OLED. In this paper it will predict a viscosity of Alq3 through DSMC technique and suggest the way regarding a study to estimate properties of material through the computer simulation. There could generate errors of a simulation process in a vacuum deposition process since the properties of material that is used in a high-degree vacuum environment are not secured. Therefore, we would like to propose the new methods that can not only predict properties of a molecular unit but also raise an accuracy of simulation process by forecasting properties of Alq3.

• 반도체디스플레이기술학회지
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• 제6권3호
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• pp.1-6
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• 2007

The integrated thermal-chemical-mechanical (TCM) material removal model presented in the companion paper is dynamically simulated in this work. The model is applied to a Cu CMP process for the simulation and the results of the three individual ingredients composing the model are presented separately first. These results are then incorporated to calculate the total material removal rate (MRR) of the Cu CMP. It is shown that the non-linear trend of MRR with respect to the applied mechanical power (i.e., non-Prestonian behavior), which is not well explained with the models established in principle on conventional contact mechanics, may be due to the chemical reaction(s) varying non-linearly with the temperature in the wafer.

• 반도체디스플레이기술학회지
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• 제6권2호
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• pp.35-40
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• 2007

An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

• 한국전기전자재료학회논문지
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• 제20권12호
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• pp.1068-1071
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• 2007

When a dielectric layer, in-cell retarder (ICR) is formed between electrode and LC layer to get a single gap transflective fringe-field switching (FFS) display, the operating voltage ($V_{op}$) is highly increased due to the thickness of dielectric material. But, we also knew the phenomenon that the increasing rate of Vop is different whether the 1st common electrode was composed of plate type or slit type. In this paper, the common electrode in transmissive part was composed of slit type which had less steepness effect of the Vop and in reflective part was composed of plate type. The rubbing angle of reflective part can be adjusted properly to match the voltage dependent transmittance and reflectance.

• 반도체디스플레이기술학회지
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• 제14권4호
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• pp.78-83
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• 2015

The method of electrical discharge machining (EDM), one of the processing methods based on non-traditional manufacturing procedures, is gaining increased popularity, since it does not require cutting tools and allows machining involving hard, brittle, thin and complex geometry. Modern ED machinery is capable of machining geometrically complex or hard material components, that are precise and difficult-to-machine such as heat treated tool steels, composites, super alloys, ceramics, etc. This paper reports the results of an experimental investigation by Taguchi method carried out to study the effects of machining parameters on material surface roughness in electric discharge machining of SM45C. The work material was ED machined with graphite and copper electrodes by varying the pulsed current, voltage and pulse time. Investigations indicate that the surface roughness is strongly depend on pulsed current.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.435-436
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• 2007

In general, Single gap transflective FFS display has an in-cell retarder (ICR) between reflective electrode and liquid crystal (LC) layer. Therefore, Operating voltage is highly increased due to this thick dielectric material. But, we also knew the phenomenon that the increasing rate of Vop is different whether the 1st common electrode was composed of plate type or slit type. In this paper, the common electrode in transmissive part was composed of slit type which had less steepness effect of the V op and in reflective part was composed of plate type. The rubbing angle of reflective part can be adjusted properly to match the voltage dependent transmittance and reflectance.

• 반도체디스플레이기술학회지
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• 제17권2호
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• pp.61-66
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• 2018

The objective of this research study is to investigate the optimal process parameters of electrical discharge machining (EDM) on SCM440 steel with copper as a tool electrode. The effect of various process parameters on machining performance is investigated in this study. Modern ED machinery is capable of machining geometrically complex or hard material components, that are precise and difficult-to-machine such as heat treated tool steels, composites, super alloys, ceramics, etc. This paper reports the results of an experimental investigation by Taguchi method carried out to study the effects of machining parameters on material surface roughness in electric discharge machining of SCM440 steel. To predict the optimal condition, the experiments are conducted by using Taguchi's L27 orthogonal array. The work material was ED machined with copper electrodes by varying the pulsed current, pulse on-time, voltage, servo speed and spark speed. Investigations indicate that the surface roughness is strongly depend on pulsed current.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.92-97
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• 2022

Plastics are classified into 7 types such as PET (PETE), HDPE, PVC, LDPE, PP, PS, and Other for separation and recycling. Recently, large corporations advocating ESG management are replacing them with bioplastics. Incineration and landfill of disposal of plastic waste are responsible for air pollution and destruction of the ecosystem. Because it is not easy to accurately classify plastic materials with the naked eye, automated system-based screening studies using various sensor technologies and AI-based software technologies have been conducted. In this paper, NIR scanning devices considering the NIR wavelength characteristics that appear differently for each plastic material and a system that can identify the type of plastic by learning the NIR spectrum data collected through it. The accuracy of plastic material identification was evaluated through a decision tree-based SVM model for multiclass classification on NIR spectral datasets for 8 types of plastic samples including biodegradable plastic.