• 제목/요약/키워드: displacement mesurement

검색결과 3건 처리시간 0.018초

Four-bucket 알고리즘을 이용한 레이저 간섭계 (Multiphase Homodyne Laser Interferometer with Four Bucket)

  • 박윤창;정경민
    • 한국정밀공학회지
    • /
    • 제16권10호
    • /
    • pp.203-208
    • /
    • 1999
  • By tilting the reference mirror of Twynman-Green interferometer having a reference mirror and a moving mirror, firinge pattern composed of bright and dark parallel lines can be obtained and the fringe pattern is shifted according to the displacement of the mowing mirror. Several studies are executed for displacement measurement by detecting the intensity of the fringe with photo-diodes having small detecting area. In this study, to improve the sensitivity and robustness, the intensity of fringe is detected by using a large-area quadratic photo-diode masked with a grating panel having four kinds of binary grating having phase-difference of 0, {\pi}$/4, {\pi}$/2, 3 {\pi}$/4. The phase of the fringe is calculated with a simple 4-buckets algorithm. A experimental result shows that standard deviation of 5.653 nm is obtained comparing with a capacitive type gap sensor having nearly 1 nm accuracy.

  • PDF

무아레 간섭계 초정밀 변위 측정장치의 설계 및 PBGA 패키지 열변형 측정에의 응용 (Submicro-displacement Measuring System with Moire Interferometer and Application to the Themal Deformation of PBGA Package)

  • 오기환;주진원
    • 대한기계학회논문집A
    • /
    • 제28권11호
    • /
    • pp.1646-1655
    • /
    • 2004
  • A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.