• Title/Summary/Keyword: direct printing process

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Design of Connectivity Test Circuit for a Direct Printing Image Drum

  • Jung, Seung-Min
    • Journal of information and communication convergence engineering
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    • v.6 no.1
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    • pp.43-46
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    • 2008
  • This paper proposes an advanced test circuit for detecting the connectivity between a drum ring of laser printer and PCB. The detection circuit of charge sharing is proposed, which minimizes the influences of internal parasitic capacitances. The test circuit is composed of precharge circuit, analog comparator, level shifter. Its functional operation is verified using $0.6{\mu}m$ 3.3V/40V CMOS process parameter by HSPICE. Access time is100ns. Layout of the drum contact test circuit is $465{\mu}m\;{\times}\;117{\mu}m$.

New Technique of Spatial Printing of Materials for Arbitrary Shape Forming (임의의 형상 성형을 위한 새로운 공간 직접 성형 기술)

  • 이일한;정용재;김창경
    • Journal of the Korean institute of surface engineering
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    • v.33 no.2
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    • pp.107-114
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    • 2000
  • In this study, we investigated the possibility of the application of the EzROBO system to direct shaping techniques which can make arbitrary shapes without any specific mold. We formed arbitrary shapes using raw materials of EH-260D (Epoxy+Binder) with the conditions of $250\mu\textrm{m}$ layer thickness, 0.2MPa working pressure, 20mm/sec working velocity, and 1.8mm needle thickness. The developed Spatial Printing Technique showed enhanced working velocity and lower cost than existing 3DP process, and is expected to replace the existing process through the process optimization in the future.

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Inkjet Printing of Single Walled Carbon Nanotubes

  • Song, Jin-Wong;Han, Chang-Soo
    • International Journal of Precision Engineering and Manufacturing
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    • v.9 no.3
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    • pp.79-81
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    • 2008
  • A single-wall carbon nanotube (SWNT) transparent conductive film (TCF) was fabricated using a simple inkjet printing method. The TCF could be selectively patterned by controlling the dot size to diameters as small as $34{\mu}m$. In this repeatable and scalable process, we achieved 71% film transmittance and a resistance of 900 ohm/sq sheet with an excellent uniformity, about ${\pm}5%$ deviation overall. Inkjet printing of SWNT is substrate friendly and the TCF is printed on a flexible substrate. This method of fabrication using direct printing permits mass production of TCF in a large area process, reducing processing steps and yielding low-cost TCF fabrications on a designated area using simple printing.

Patterning of Single-wall Carbon Nanotube using Ink-jet Printing (잉크젯 프린팅에 의한 단일벽 탄소나노튜브의 패터닝)

  • Song, Jin-Won;Yoon, Yeo-Hwan;Han, Chang-Soo
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.236-237
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    • 2007
  • A single-wall carbon nanotube (SWNT) transparent conductive film (TCF) was fabricated using a simple inkjet printing method. The TCF could be selectively patterned by controlling the dot size to diameters as small as 34${\mu}m$. In thisrepeatable and scalable process, we achieved 71% film transmittance and a resistance of 900 ohm/sq sheet with an excellent uniformity, about $\pm$5% deviation overall. Inkjet printing of SWNT is substrate friendly and the TCF is printed on a flexible substrate. This method of fabrication using direct printing permits mass production of TCF in a large area process, reducing processing steps and yielding low-cost TCF fabrications on a designated area using simple printing.

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Investigation of Conductive Pattern Line for Direct Digital Printing (디지털 프린팅을 위한 전도성 배선에 관한 연구)

  • Kim, Yong-Sik;Seo, Shang-Hoon;Lee, Ro-Woon;Kim, Tae-Hoon;Park, Jae-Chan;Kim, Tae-Gu;Jeong, Kyoung-Jin;Yun, Kwan-Soo;Park, Sung-Jun;Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.502-502
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    • 2007
  • Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

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Laser Direct Patterning of Photoresist Layer for Halftone Dots of Gravure Printing Roll (그라비아 인쇄물의 망점 형성을 위한 포토레지스터 코팅층의 레이저 직접 페터닝)

  • Seo, Jung;Lee, Je-Hoon;Han, Yu-Hee
    • Laser Solutions
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    • v.3 no.2
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    • pp.35-43
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    • 2000
  • Laser direct patterning of the coated photoresit (PMER-NSG31B) layer was studied to make halftone dots on gravure printing roll. The selective laser hardening of photoresist by Ar-ion laser(wavelength : 333.6nm∼363.8nm) was controlled by the A/O modulator. The coating thickness in the range of 5㎛∼11㎛ could be obtained by using the up-down directional moving device along the vertically located roll. The width, thickness and hardness of the hardened lines formed under laser power of 200∼260㎽ and irradiation time of 4.4∼6.6$\mu$ sec/point were investigated after developing. The hardened width increased according to the increase of coating thickness. Though the hardened thickness was changed due to the effect of the developing solution, the hardened layer showed good resistance to the scratching of 2H pencil. Also, the hardened minimum line widths of 10㎛ could be obtained. The change of line width was also found after etching, and the minimum line widths of 6㎛ could be obtained. The hardened lines showed the good resistance to the etching solution. Finally, the experimental data could be applied to make gravure halftone dots using the developed imaging process, successfully.

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High Performance Electrode of Polymer Electrolyte Membrane Fuel Cells Prepared by Direct Screen Printing Process (직접 스크린 프린팅법으로 제조된 고분자 전해질 연료전지의 고성능 전극)

  • 임재욱;최대규;류호진
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.1
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    • pp.65-69
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    • 2004
  • Screen printing it one of the most popular methods for the fabrication of catalytic layer in electrode of polymer electrolyte membrane fuel cells (PEMFCs) due to its convenience and adaptability. This paper suggests an improved screen-printing method, which is rather simple suppressing the swelling trouble without additive process and competitive with very low Pt loading in comparison with the previous methods. Particularly, the gasket unified MEA made better performances than the other especially at high current area due to blocking effect on the gas leakage during the operation. These methods give us more simplified and faster fabrication chances.

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Fabrication of the Printed Circuit Board by Direct Photosensitive Etch Resist Patterning (감광성 에칭 레지스트의 잉크젯 인쇄를 이용한 인쇄회로 기판 제작)

  • Park, Sung-Jun;Lee, Ro-Woon;Joung, Jae-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.5
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    • pp.97-103
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    • 2007
  • A novel selective metallization process to fabricate the fine conductive line based on inkjet printing has been investigated. Recently, Inkjet printing has been widely used in flat panel display, electronic circuits, biochips and bioMEMS because direct inkjet printing is an alternative and cost-effective technology for patterning and fabricating objects directly from design without masks. The photosensitive etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity at ambient temperature. A piezoelectric-driven inkjet printhead is used to dispense 20-30 ${\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. Repeatability of circuitry fabrication is closely related to the formation of steady droplets, adhesion between etching resist and copper substrate. Therefore, the ability to form small and stable droplets and surface topography of the copper surface and chemical attack must be taken into consideration for fine and precise patterns. In this study, factors affecting the pattern formation such as adhesion strength, etching mechanism, UV curing have been investigated. As a result, microscale copper patterns with tens of urn high have been fabricated.

A Preliminary Study on the Application of Three-Dimensional (3D) Printing Technologies to Hot Bulk Forming Processes - Example of Preform Design and Investigation of Hot-working Tool Steel Deposited Surface (3 차원 프린팅 기술의 열간 체적 성형 공정 적용에 관한 기초 연구 - 예비형상 설계 예 및 열간 금형강으로 적층된 표면 특성 분석)

  • Ahn, Dong-Gyu;Kim, Se-Hun;Lee, Ho-Jin
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.12
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    • pp.1093-1100
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    • 2014
  • The goal of this paper is to investigate preliminary the applicability of 3D printing technologies for the development of the hot bulk forming process and die. 3D printing technology based on the plastic material was applied to the preform design of the hot forging process. Plastic hot forging dies were fabricated by Polyjet process for the physical simulation of the workpiece deformation. The feasibility of application of Laser-aided Direct Metal Rapid Tooling (DMT) process to the fabrication of the hot bulk metal forming die was investigated. The SKD61 hot-working tool steel was deposited on the heat treated SKD61 using the DMT process. Fundamental characteristics of SKD 61 hot-working tool steel deposited specimen were examined via hardness and wear experiments as well as the observation of the morphology. Using the results of the examination of fundamental characteristics, the applicability of the DMT process to manufacture hot bulk forming die was discussed.

Ceramic Direct Rapid Tooling with FDM 3D Printing Technology (FDM 3D Printing 기술을 응용한 직접식 세라믹 쾌속툴링)

  • Shin, Geun-Sik;Kweon, Hyun-Kyu;Kang, Yong-Goo;Oh, Won-Taek
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.7
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    • pp.83-89
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    • 2019
  • In the conventional casting and forging method, there is a disadvantage that a mold is an essential addition, and a production cost is increased when a small quantity is produced. In order to overcome this disadvantage, a metal 3D printing production method capable of directly forming a shape without a mold frame is mainly used. In particular, overseas research has been conducted on various materials, one of which is a metal printer. Similarly, domestic companies are also concentrating on the metal printer market. However, In this case of the conventional metal 3D printing method, it is difficult to meet the needs of the industry because of the high cost of materials, equipment and maintenance for product strength and production. To compensate for these weaknesses, printers have been developed that can be manufactured using sand mold, but they are not accessible to the printer company and are expensive to machine. Therefore, it is necessary to supply three-dimensional casting printers capable of metal molding by producing molds instead of conventional metal 3D printing methods. In this study, we intend to reduce the unit price by replacing the printing method used in the sand casting printer with the FDM method. In addition, Ag paste is used to design the output conditions and enable ceramic printing.