• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1806-1809
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• 2008

Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.635-636
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• 2007

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.1.2-1.2
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• 2011

With recent advances in materials and products, materials processing experiences new challenges. More particles and polymers in material side and thinner and faster deformations in processing side. It happens in most emergying industries such as manufacturing of batteries, solar cells, multi-layer chips, displays, printed electronics, to list a few. In most cases, they are manufactured by coating or printing process, which is defined as a process in which gas is replaced by liquid on a substrate. In this sense, casting, inkjet printing, and roll-to-roll printing are all included. The printing process consists of three unit processes. As the materials used in the above mentioned applications typically contain a large amount of particles with polymers and solvents, they continuously change microstructures during preparation, flow, and even drying. However, little is known about the flow characteristics of such complex fluids and less is known about how to design and control the process. Therefore, for better control of the process and for better quality of the product, we need to understand the flow characteristics of these complex fluids under extremely fast flow environment.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 추계학술대회 논문집
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• pp.186-189
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• 2001

The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.58.1-58.1
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• 2012

Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

• Design & Manufacturing
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• 제16권3호
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• pp.58-65
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• 2022

Micro-fluidic chip has been fabricated by lithography process on silicon or glass wafer, casting using PDMS, injection molding of thermoplastics or 3D printing, etc. Among these processes, 3D printing can fabricate micro-fluidic chip directly from the design without master or template for fluidic channel fabricated previously. Due to this direct printing, 3D printing provides very fast and economical method for prototyping micro-fluidic chip comparing to conventional fabrication process such as lithography, PDMS casting or injection molding. Although 3D printing is now used more extensively due to this fast and cheap process done automatically by single printing machine, there are some issues on accuracy or surface characteristics, etc. The accuracy of the shape and size of the micro-channel is limited by the resolution of the printing and printing direction or layering direction in case of SLM type of 3D printing using UV curable resin. In this study, the printing direction and thickness of each printing layer are investigated to see the effect on the size, shape and surface of the micro-channel. A set of micro-channels with different size was designed and arrayed orthogonal. Micro-fluidic chips are 3D printed in different directions to the micro-channel, orthogonal, parallel, or skewed. The shape of the cross-section of the micro-channel and the surface of the micro-channel are photographed using optical microscopy. From a series of experiments, an optimal printing direction and process conditions are investigated for 3D printing of micro-fluidic chip.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.261.1-261.1
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• 2013

Well-aligned nanowire arrays can be used as building blocks for nanoscale device. Recently, we reported that well-aligned single-crystal organic nanowires has been created by using a direct printing method which is named liquid-bridge mediated nanotransfer molding (LB-nTM). Moreover, multi-layering nanostructures can be fabricated by repeating this printing process. As a result, it is possible to make simple and basic concept of heterojunction devices such as crossed nanowire devices. We fabricated crossed single-crystal organic nanowires nanojunction devices from 6,13-bis (triisopropylsilylethynyl) pentacene (TIPS-PEN) and fullerene (C60) single-crystal nanowires using by direct printing method in solution process. Crossed TIPSPEN/ C60 single-crystal nanowires diode has rectifying behavior with on/off ratios of ~13. In addition, the device shows photodiode characteristics as well as rectification. Our study represent methodology of heterojunction devices using single-crystal nanowires, thereby provide a new direction of future nanoelectronics.

• 드라이브 ㆍ 컨트롤
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• 제16권3호
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• pp.51-58
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• 2019

The objective of this study was to investigate a simulation technology for the AM field based on ANSYS Inc.. The introduction of metal 3D printing AM process, and the examining of the present status of AM process simulation software, and the AM process simulation processor were done in the previous study (part 1). This present study (part 2) examined the use of the AM process simulation processor, presented in Part 1, through direct execution of Topology Optimization, Ansys Workbench, Additive Print and Additive Science. Topology Optimization can optimize additive geometry to reduce mass while maintaining strength for AM products. This can reduce the amount of material required for additive and significantly reduce additive build time. Ansys Workbench and Additive Print simulate the build process in the AM process and optimize various process variables (printing parameters and supporter composition), which will enable the AM to predict the problems that may occur during the build process, and can also be used to predict and correct deformations in geometry. Additive Science can simulate the material to find the material characteristic before the AM process simulation or build-up. This can be done by combining specimen preparation, measurement, and simulation for material measurements to find the exact material characteristics. This study will enable the understanding of the general process of AM simulation more easily. Furthermore, it will be of great help to a reader who wants to experience and appreciate AM simulation for the first time.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.563-563
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• 2012

We report a one-step fabrication of single-crystal organic nanowire arrays on substrates using a new direct printing method (liquid-bridge-mediated nanotransfer moulding, LB-nTM), which can simultaneously enable the synthesis, alignment and patterning of the nanowires using molecular ink solutions. Two- or three-dimensional complex structures of various single-crystal organic nanowires were directly fabricated over a large area with a successive process. The position of the nanowires can be aligned easily on complex structures because the mold is movable on substrates before drying the polar liquid layer, which acts as an adhesive lubricant. This efficient manufacturing method can produce a wide range of optoelectronic devices and integrated circuits with single-crystal organic nanowires.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.85-85
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• 2010

We report a new direct printing method, called liquid-mediated nanotransfer molding (LB-nTM), that uses a polar liquid-mediated transfer process. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid- bridge between the stamp and the substrate. This procedure can be adopted in automated printing machines that generate various material patterns with a wide range of feature sizes (as small as 60 nm) on diverse substrates. The patterns have been investigated by scanning electron microscopy(SEM).