• Bulletin of the Korean Chemical Society
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• v.35 no.3
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• pp.731-736
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• 2014

An organic junction transistor with a vertical structure based on an active layer of poly(3-hexylthiophene) was fabricated by facile micro-contact printing combined with the Langmuir-Schaefer technique, without conventional e-beam or photo-lithography. Direct printing and subsequent annealing of Au-nanoparticles provided control over the thickness of the Au electrode and hence control of the electrical contact between the Au electrode and the active layer, ohmic or Schottky. The junction showed similar current-voltage characteristics to an NPN-type transistor. Current through the emitter was simply controllable by the base voltage and a high transconductance of ~0.2 mS was obtained. This novel fabrication method can be applied to amplifying or fast switching organic devices.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1087-1090
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• 2008

This paper presents the electro-luminescence (EL) display lamp which is patterned on a curved surface by the pad printing method. The printing methods, including the gravure, screen, flexo, inkjet, and pad printing, have an advantage of one-step direct patterning. However, in general, the printing and semi-conductor process, except pad printing method, cannot be applied for patterning on a curved surface. Thus, in this paper, we used pad printing method for patterning an EL display lamp on a curved surface. The EL display lamp consists of 5 layers: Bottom electrode; Dielectric layer; Phosphor; Transparent electrode; Bus electrode. Finally, we printed EL display lamp on a dish, which has a radius of curvature 80mm. The EL display lamp was driven at AC 200V of 1kHz.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.7
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• pp.83-89
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• 2019

In the conventional casting and forging method, there is a disadvantage that a mold is an essential addition, and a production cost is increased when a small quantity is produced. In order to overcome this disadvantage, a metal 3D printing production method capable of directly forming a shape without a mold frame is mainly used. In particular, overseas research has been conducted on various materials, one of which is a metal printer. Similarly, domestic companies are also concentrating on the metal printer market. However, In this case of the conventional metal 3D printing method, it is difficult to meet the needs of the industry because of the high cost of materials, equipment and maintenance for product strength and production. To compensate for these weaknesses, printers have been developed that can be manufactured using sand mold, but they are not accessible to the printer company and are expensive to machine. Therefore, it is necessary to supply three-dimensional casting printers capable of metal molding by producing molds instead of conventional metal 3D printing methods. In this study, we intend to reduce the unit price by replacing the printing method used in the sand casting printer with the FDM method. In addition, Ag paste is used to design the output conditions and enable ceramic printing.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.144.1-144.1
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• 2016

We fabricate organic single crystal nanowire heterojunction p-n diode poly(3-hexylthiophene)(P3HT) and from Phenyl-C61-butyric acid methyl ester(PCBM) using by liquid-bridge mediated nanotransfer molding(LB-nTM) method. LB-nTM has been reported an one step direct printing method for making well-aligned nanowire arrays. Moreover, multi-patterning nanostructures can be fabricated with the consecutive printing process. As a result, it is possible to make simple and basic concept of heterojunction devices such as lateral organic p-n nanojunction diode. P3HT/PCBM nanowires heterojunction diode has rectifying behavior with on/off ratios of ~20.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.261.1-261.1
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• 2013

Well-aligned nanowire arrays can be used as building blocks for nanoscale device. Recently, we reported that well-aligned single-crystal organic nanowires has been created by using a direct printing method which is named liquid-bridge mediated nanotransfer molding (LB-nTM). Moreover, multi-layering nanostructures can be fabricated by repeating this printing process. As a result, it is possible to make simple and basic concept of heterojunction devices such as crossed nanowire devices. We fabricated crossed single-crystal organic nanowires nanojunction devices from 6,13-bis (triisopropylsilylethynyl) pentacene (TIPS-PEN) and fullerene (C60) single-crystal nanowires using by direct printing method in solution process. Crossed TIPSPEN/ C60 single-crystal nanowires diode has rectifying behavior with on/off ratios of ~13. In addition, the device shows photodiode characteristics as well as rectification. Our study represent methodology of heterojunction devices using single-crystal nanowires, thereby provide a new direction of future nanoelectronics.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1747-1751
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• 2008

Electrohydrodynamic jet printing (EHDP) technique is widely used for the direct writing. However, in the existing EHDP method, the printing characteristics are affected by the printing substrate used, and the line width of the printed is determined by the geometry of the nozzle. We propose an EHDP method which is capable of (1) removing the effect from the substrate, and (2) controlling the line width through the ON/OFF control of the each nozzle in the nozzle array. Printing characteristics of our EHDP system were examined and successful ON/OFF control of the nozzle array were demonstrated. By using the proposed EHDP, it is expected that stable meniscus regardless of the substrate and different line widths even using the same nozzle can be achieved.

• Journal of the Korean Graphic Arts Communication Society
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• v.6 no.1
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• pp.13-39
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• 1988

Test colors are halftone dot printed at the rate of 10% halftone dot area by process inksblack, cyan, magenta and yellow ink. Reproduced colors are measured by the weighted-ordinate colorimetric method and the direct colorimetric method. The weighted-ordinate colorimetric method compare favorably with the direct colorimetric method, because the former has good regular changes of tristimuIus values, chromacity coordinates, excitation purities, value functions and has smaller errors of dominant and complementary wavelengths than the latter. All test colors classify with the Munsell renotation.tation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.186-189
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• 2001

The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.