• Journal of the Korean Society for Precision Engineering
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• v.27 no.6
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• Laser Solutions
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• v.10 no.2
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• pp.5-15
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• 2007

A new printing process for LCD color filter is proposed in this work by using the localized laser heating, which is called laser-induced spray printing (LISP) process. The LISP is a non-contact process, which injects the ink from the donor substrate to the glass substrate by the bubble pressure induced by laser heating. The temperature distribution of the donor substrate is calculated numerically to explain the ink ejection phenomena. The composition of the ink was includes the red pigment, n-butanol, xylene, BCA and epoxy. Experiments were conducted by using the fiber laser system, and the color filter patterns were deposited successfully under the proper laser heating conditions.

• Journal of the Optical Society of Korea
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• v.9 no.1
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• pp.16-21
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• 2005

Using a cantilever type nanoprobe having a 100㎚m aperture at the apex of the pyramidal tip of a near-field scanning optical microscope (NSOM), nanopatterning of polymer films are conducted. Two different types of polymer, namely a positive photoresist (DPR-i5500) and an azopolymer (Poly disperse orange-3), spincoated on a silicon wafer are used as the substrate. A He-Cd laser with a wavelength of 442㎚ is employed as the illumination source. The optical near-field produced at the tip of the nanoprobe induces a photochemical reaction on the irradiated region, leading to the fabrication of nanostructures below the diffraction limit of the laser light. By controlling the process parameters properly, nanopatterns as small as 100㎚ are produced on both the photoresist and azopolymer samples. The shape and size variations of the nanopatterns are examined with respect to the key process parameters such as laser beam power, irradiation time or scanning speed of the probe, operation modes of the NSOM (DC and AC modes), etc. The characteristic features during the fabrication of ordered structures such as dot or line arrays using NSOM lithography are investigated. Not only the direct writing of nano array structures on the polymer films but also the fabrication of NSOM-written patterns on the silicon substrate were investigated by introducing a passivation layer over the silicon surface. Possible application of thereby developed NSOM lithography technology to the fabrication of data storage is discussed.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.65-70
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• 2023

Nanoimprint lithography (NIL) has attracted much attention due to its process simplicity, excellent patternability, process scalability, high productivity, and low processing cost for pattern formation. However, the pattern size that can be implemented on metal materials through conventional NIL technologies is generally limited to the micro level. Here, we introduce a novel hard imprint lithography method, extreme-pressure imprint lithography (EPIL), for the direct nano-to-microscale pattern formation on the surfaces of metal substrates with various thicknesses. The EPIL process allows reliable nanoscopic patterning on diverse surfaces, such as polymers, metals, and ceramics, without the use of ultraviolet (UV) light, laser, imprint resist, or electrical pulse. Micro/nano molds fabricated by laser micromachining and conventional photolithography are utilized for the nanopatterning of Al substrates through precise plastic deformation by applying high load or pressure at room temperature. We demonstrate micro/nanoscale pattern formation on the Al substrates with various thicknesses from 20 ㎛ to 100 mm. Moreover, we also show how to obtain controllable pattern structures on the surface of metallic materials via the versatile EPIL technique. We expect that this imprint lithography-based new approach will be applied to other emerging nanofabrication methods for various device applications with complex geometries on the surface of metallic materials.

• Current Optics and Photonics
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• v.5 no.1
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• pp.8-15
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• 2021

An elliptical zone plate (EZP) array is important in off-axis optical systems because it provides two advantages. First, the residual beam and the main source are not focused in the same direction and second, the light from the observation plane is not reflected back towards the beam source. However, the fill factor of the previous EZP array was about 76% which was a little low. Hence, this EZP array could not collect the maximum amount of illumination light, which affected the overall optical performance of the lens array. In this study, we propose a new EZP array design with a 97.5% fill factor used in off-axis imaging system for enhancement of brightness and contrast. Then, direct laser lithography was used to fabricate the high fill factor EZP array by moving the XY linear stage of the system in a zigzag motion. The imaging properties of the proposed EZP array were experimentally verified at the focal plane and compared with the previous model.

• Current Optics and Photonics
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• v.6 no.1
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• pp.44-50
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• 2022

An off-axis zone plate is able to focus on a single order while neglecting the zeroth order in a visible imaging system. This allows one to enhance the contrast quality in diffractive images, which is the major advantage of this type of zone plate. However, most previous reflection zone plates are used in focusing X-rays with a small grazing incident angle and are intricately designed with the use of a local grating period. In this study, we suggest the design of an off-axis elliptical zone plate (EZP) that is used to focus a monochromatic light beam with separation between the first and unfocused orders under a large grazing incident angle of 45°. An assumption using the total grating period, which depends on the average and constant grating period, is proposed to calculate the desired distance between the first and zeroth order and to simplify the construction of a novel model off-center EZP. Four diffractive optical elements (DOEs) with different parameters were subsequently fabricated by direct laser lithography and then verified using a performance evaluation system to compare the results from the assumption with the experimental results.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.144-151
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• 2024

This work focuses on the fabrication of excellent magnetic structures for trapping breast cancer cells. Micromagnetic structures were patterned for trapping cancer cells by depositing 30 nm of permalloy on a silicon substrate. These structures were designed and fabricated using two fabrication techniques: electron beam lithography and laser direct writing. Two types of magnetic structures, rectangular wire and zig-zagged wire, were created on a silicon substrate. The length of each rectangular wire and each straight line of zig-zagged wire was 150 ㎛ with a range of widths from 1 to 15 ㎛ for rectangular and 1, 5, 10 and 15 ㎛ for zigzag, respectively. The magnetic structures showed good responses to the applied magnetic field despite adding layers of silicon nitride and polyethylene glycol. The results showed that Si + Si₃N₄ + PEG exhibited the best adhesion of cells to the surface, followed by Si + Py + Si₃N₄ + PEG. concentration of 5-6 with permalloy indicates that this layer affected silicon nitride in the presence of Polyethylene glycolPEG.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.184-189
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• 2005

An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.503-507
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• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.2
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• pp.829-834
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• 2011

Exposure process is the most important technology to fabricate highly integrated circuit. Up to now, mask type lithography process has been generally used. However, it is not efficient for small quantity and/or frequently changing products. Therefore, maskless lithography technology is raised in exposure process. In this study, relations between multi-beam energy and overlay were analyzed. Exposure experiment of generating pattern was performed. It was from presented scan line by multi- beam simulation. As a result, optimal scan line distance was proposed by simulation, and micro pattern accuracy could be improved by exposure experiment using laser direct imaging system.