• Title/Summary/Keyword: diode structure

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Design of a Band-Tunable Ultra-Wideband Single-Balanced Doubler (대역 가변형 초광대역 단일 평형 체배기의 설계)

  • Kim, In-Bok;Kim, Young-Gon;Jang, Tae-Gyoung;Song, Sun-Young;Kim, Kang-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.8
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    • pp.714-720
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    • 2009
  • In this paper, design and the implementation method of a band-tunable ultra-wideband planar doubler are described Microstrip-to-CPS(balun) transition and Microstrip-to-CPW transition are respectively used for input/output matching circuits for the doubler. The Input balun structure allows to apply diode bias, and the doubler output frequency is tunable by changing the diode bias voltage. With the bias voltage of -0.6 V, the measured operating frequency band of the implemented doubler is $10{\sim}20$ GHz, with the bias voltage of $-0.2{\sim}-0.4$ V, the operating frequency band is $10{\sim}30$ GHz, and with 0 V bias, the operating frequency band is $20{\sim}30$ GHz. The doubler provides conversion loss of less than 15 dB and fundamental frequency suppression of 30 dB.

A Comparison Study of Input ESD Protection schemes Utilizing Thyristor and Diode Devices (싸이리스터와 다이오드 소자를 이용하는 입력 ESD 보호방식의 비교 연구)

  • Choi, Jin-Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.4
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    • pp.75-87
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    • 2010
  • For two input-protection schemes suitable for RF ICs utilizing the thyristor and diode protection devices, which can be fabricated in standard CMOS processes, we attempt an in-depth comparison on HBM ESD robustness in terms of lattice heating inside protection devices and peak voltages developed across gate oxides in input buffers, based on DC, mixed-mode transient, and AC analyses utilizing a 2-dimensional device simulator. For this purpose, we construct an equivalent circuit for an input HBM test environment of a CMOS chip equipped with the input ESD protection circuits, which allows mixed-mode transient simulations for various HBM test modes. By executing mixed-mode simulations including up to six active protection devices in a circuit, we attempt a detailed analysis on the problems, which can occur in real tests. In the procedure, we suggest to a recipe to ease the bipolar trigger in the protection devices and figure out that oxide failure in internal circuits is determined by the junction breakdown voltage of the NMOS structure residing in the protection devices. We explain the characteristic differences of two protection schemes as an input ESD protection circuit for RF ICs, and suggest valuable guidelines relating design of the protection devices and circuits.

Three-dimensional micro photomachining of polymer using DPSSL (Diode Pumped Solid State Laser) with 355 nm wavelength (355nm 파장의 DPSSL을 이용한 폴리머의 3차원 미세 형상 광가공기술)

  • 장원석;신보성;김재구;황경현
    • Korean Journal of Optics and Photonics
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    • v.14 no.3
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    • pp.312-320
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    • 2003
  • The basic mechanistic aspects of the interaction and practical considerations related to polymer ablation were briefly reviewed. Photochemical and photothermal effects, which highly depend on laser wavelength have close correlation with each other. In this study, multi-scanning laser ablation processing of polymer with a DPSS (Diode Pumped Solid State) 3rd harmonic Nd:YVO$_4$ laser (355 nm) was developed to fabricate a three-dimensional micro shape. Polymer fabrication using DPSSL has some advantages compared with the conventional polymer ablation process using KrF and ArF laser with 248 nm and 193 nm wavelength. These advantages include pumping efficiency and low maintenance cost. And this method also makes it possible to fabricate 2D patterns or 3D shapes rapidly and cheaply because CAD/CAM software and precision stages are used without complex projection mask techniques. Photomachinability of polymer is highly influenced by laser wavelength and by the polymer's own chemical structure. So the optical characteristics of polymers for a 355 nm laser source is investigated experimentally and theoretically. The photophysical and photochemical parameters such as laser fluence, focusing position, and ambient gas were considered to reduce the plume effect which re-deposits debris on the surface of substrate. These phenomena affect the surface roughness and even induce delamination around the ablation site. Thus, the process parameters were tuned to optimize for gaining precision surface shape and quality. This maskless direct photomachining technology using DPSSL could be expected to manufacture tile prototype of micro devices and molds for the laser-LIGA process.

Implant Isolation Characteristics for 1.25 Gbps Monolithic Integrated Bi-Directional Optoelectronic SoC (1.25 Gbps 단일집적 양방향 광전 SoC를 위한 임플란트 절연 특성 분석)

  • Kim, Sung-Il;Kang, Kwang-Yong;Lee, Hai-Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.8
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    • pp.52-59
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    • 2007
  • In this paper, we analyzed and measured implant isolation characteristics for a 1.25 Gbps monolithic integrated hi-directional (M-BiDi) optoelectronic system-on-a-chip, which is a key component to constitute gigabit passive optical networks (PONs) for a fiber-to-the-home (FTTH). Also, we derived an equivalent circuit of the implant structure under various DC bias conditions. The 1.25 Gbps M-BiDi transmit-receive SoC consists of a laser diode with a monitor photodiode as a transmitter and a digital photodiode as a digital data receiver on the same InP wafer According to IEEE 802.3ah and ITU-T G.983.3 standards, a receiver sensitivity of the digital receiver has to satisfy under -24 dBm @ BER=10-12. Therefore, the electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysed and measured results of the implant structure, the M-BiDi SoC with the implant area of 20 mm width and more than 200 mm distance between the laser diode and monitor photodiode, and between the monitor photodiode and digital photodiode, satisfies the electrical crosstalk level. These implant characteristics can be used for the design and fabrication of an optoelectronic SoC design, and expended to a mixed-mode SoC field.

The Electrical and Optical Properties of Polymer Light Emitting Diode with ITO/PEDOT:PSS/MEH-PPV/Al Structure at Various Concentration of MEH-PPV (ITO/PEDOT:PSS/MEH-PPV/Al 구조에서 MEH-PPV 농도에 따른 유기발광다이오드의 전기$\cdot$광학적 특성)

  • Gong Su Cheol;Back In Jea;Yoo Jae Hyouk;Lim Hun Seung;Chang Ho Jung;Chang Gee Keun
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.2 s.35
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    • pp.155-159
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    • 2005
  • In this report, Polymer light emitting diodes (PLEDs) with an ITO/PEDOT:PSS/MEH-PPV/Al structure were prepared by spin coating method on the glass substrate patterned ITO (indium tin oxide), using PEDOT:PSS(poly(3,4=ethylenedioxythiophene):poly(styrene sulfolnate)) as the hole transfer material and MEH-PPV(poly(2-methoxy-5-(2-ethyhexoxy)-1,4-phenylenvinylene)) having a different concentration (0.1, 0.3, 0.5, 0.7, 0.9, 1.5 wt$\%$) as the emitting material. The electrical and optical properties of the prepared PLED samples were investigated. The good electrical and optical properties were observed for the PLED samples with a MEH-PPV concentration ranging from 0.5 to $0.9 wt\%$. However, the current and luminance values for PLED sample with $1.5 wt\%$ of MEH-PPV decreased greatly. The maximum luminance and light efficiency for the PLEDs with concentration of $0.5 wt\%$ MEH-PPV were $409 cd/m^2$ and 4.90 Im/W at 9 V, respectively. The emission spectrums were found to be $560{\~}585 nm$ in wavelength showing orange color.

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Low temperature growth of Ga2O3 thin films on Si substrates by MOCVD and their electrical characteristics (MOCVD에 의한 Si 기판 위의 Ga2O3 박막 저온 결정 성장과 전기적 특성)

  • Lee, Jung Bok;Ahn, Nam Jun;Ahn, Hyung Soo;Kim, Kyung Hwa;Yang, Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.32 no.2
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    • pp.45-50
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    • 2022
  • Ga2O3 thin films were grown on n-type Si substrates at various growth temperatures of 500, 550, 600, 650 and 700℃. The Ga2O3 thin films grown at 500℃ and 550℃ were characterized as featureless flat surface. Grown at higher temperatures (600, 650, and 700℃) showed very rough surface morphology. To figure out the annealing effect on the thin films grown at relatively low temperatures (500, 550, 600, 650 and 700℃), the Ga2O3 films were thermally treated at 900℃ for 10 minutes. Crystal structure of the Ga2O3 films grown at 500 and 550℃ were changed from amorphous to polycrystalline structure with flat surface. Ga2O3 film grown at 550℃ was chosen for the fabrication of a Schottky barrier diode (SBD). Electrical properties of the SBDs depend on the thermal treatment were evaluated. A MSM type photodetector was made on the low temperature grown Ga2O3 thin film. The photocurrent for the illumination of 266 nm wavelength showed 5.32 times higher than dark current at the operating voltage of 10 V.

Surface Control of Planarization Layer on Embossed Glass for Light Extraction in OLEDs

  • Cho, Doo-Hee;Shin, Jin-Wook;Moon, Jaehyun;Park, Seung Koo;Joo, Chul Woong;Cho, Nam Sung;Huh, Jin Woo;Han, Jun-Han;Lee, Jonghee;Chu, Hye Yong;Lee, Jeong-Ik
    • ETRI Journal
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    • v.36 no.5
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    • pp.847-855
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    • 2014
  • We developed a highly refractive index planarization layer showing a very smooth surface for organic light-emitting diode (OLED) light extraction, and we successfully prepared a highly efficient white OLED device with an embossed nano-structure and highly refractive index planarization layers. White OLEDs act as an internal out-coupling layer. We used a spin-coating method and two types of $TiO_2$ solutions for a planarization of the embossed nano-structure on a glass substrate. The first $TiO_2$ solution was $TiO_2$ sol, which consists of $TiO_2$ colloidal particles in an acidic aqueous solution and several organic additives. The second solution was an organic and inorganic hybrid solution of $TiO_2$. The surface roughness ($R_a$) and refractive index of the $TiO_2$ planarization films on a flat glass were 0.4 nm and 2.0 at 550 nm, respectively. The J-V characteristics of the OLED including the embossed nano-structure and the $TiO_2$ planarization film were almost the same as those of an OLED with a flat glass, and the luminous efficacy of the aforementioned OLED was enhanced by 34% compared to that of an OLED with a flat glass.

Design of 808nm GRIN-SCH Quantum Dot Laser Diode (808nm GRIN-SCH 양자점 레이저 다이오드 설계)

  • Chan, Trevor;Son, Sung-Hun;Kim, Kyoung-Chan;Kim, Tae-Geun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.131-131
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    • 2010
  • The power of semiconductor laser diodes has been limited primarily by the heating effects which occur at high optical intensities. The actual limiting event can take one of a number of forms such as. catastrophic optical damage or filamentation. A general approach to this problem is to design a heterostructure which creates a high powered output while maintaining low internal optical intensities. A graded index separate confinement heterostructure (GRIN-SCH) is one such structure that accomplishes the above task. Here, the active region is sandwiched between graded index layers where the index of refraction increases nearer to the active layer. This structure has been shown to yield a high efficiency due to the confinement of both the optical power and carriers, thereby reducing the optical intensity required to achieve higher powers. The optical confinement also reinforces the optical beam quality against high power effects. Quantum dots have long been a desirable option for laser diodes due to the enhanced optical properties associated with the zeroth dimensionality. In our work, we use PICS3D software created by Crosslight Software Inc. to simulate the performance of In0.67A10.33As/A10.2Ga0.8AsquantumdotsusedwithaGRIN-SCH. The simulation tools are used to optimize the GRIN-SCH structure for high efficiency and optical beam quality.

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Novel structure for a full-color AMOLED using a blue common layer (BCL)

  • Kim, Mu-Hyun;Chin, Byung-Doo;Suh, Min-Chul;Yang, Nam-Chul;Song, Myung-Won;Lee, Jae-Ho;Kang, Tae-Min;Lee, Seong-Taek;Kim, Hye-Dong;Park, Kang-Sung;Oh, Jun-Sik;Chung, Ho-Kyoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.797-798
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    • 2005
  • We report a novel structure for a full-color AMOLED (Active Matrix Organic Light Emitting Diode) eliminating the patterning process of a blue emitting layer. The patterning of the three primary colors, RGB, is a key technology in the OLED fabrication process. Conventional full color AMOLED containing RGB layers includes the three opportunities of the defects to make an accurate position and fine resolution using various technologies such as fine metal mask, ink-jet printing and laser-induced transfer system. We can skip the blue patterning step by simply stacking the blue layer as a common layer to the whole active area after pixelizing two primary colors, RG, in the conventional small molecular OLED structure. The red and green pixel showed equivalent performances without any contribution of the blue emission.

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Development of Blue Organic Light-emitting Diodes(OLEDs) Due to Change in Mixed Ratio of HTL:EML(DPVBi:NPB) Layers (HTL:EML(DPVBi:NPB)층의 조성비 변화에 따른 청색 유기 발광 소자 개발)

  • Lee, Tae-Sung;Lee, Byoung-Wook;Hong, Chin-Soo;Kim, Chang-Kyo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.9
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    • pp.853-858
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    • 2008
  • The structure of organic light-emitting diodes(OLEDs) with typical heterostructure consists of anode, hole injection layer, hole transport layer, light-emitting layer, electron transport layer, electron injection layer, and cathode. 4,4bis[N-(1-napthyl)-N-phenyl-amino]-biphenyl(NPB) used as a hole transport layer and 4'4-bis(2,2'-diphenyl vinyl)-1,1'-biphenyl(DPVBi) used as a blue light emitting layer were graded-mixed at selected ratio. Interface at heterojunction between the hole transport layer and the elecrtron transport layer restricts carrier's transfer. Mixing of the hole transport layer and the emitting layer reduces abrupt interface between the hole transport layer and the electron transport layer. The operating voltage of OLED devices with graded mixed-layer structure is 2.8 V at 1 $cd/m^2$ which is significantly lower than that of OLED device with typical heterostructure. The luminance of OLED devices with graded mixed-layer structure is 21,000 $cd/m^2$ , which is much higher than that of OLED device with typical heterostructure. This indicates that the graded mixed-layer enhances the movement of carriers by reducing the discontinuity of highest occupied molecular orbital(HOMO) of the interface between hole transport layer and emitting layer.