• Title/Summary/Keyword: diode structure

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Fabrication of High Power $Al_{0.07}$$Ga_{0.93}$As Laser Diode Array) (고출력 $Al_{0.07}$$Ga_{0.93}$As 레이저 다이오드 어레이 제작)

  • 손노진;박성수;안정작;권오대;계용찬;정지채;최영수;강응철;김재기
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.10
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    • pp.43-50
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    • 1995
  • A laser diode(LD) structure consisting of a single 150$\AA$ $Al_{0.07}$Ga$_{0.93}$As quantum well active region operating at ${\lambda}$=809nm, cladded with an AlGaAs graded-index separate confinement heterostructure, has bes been grown by MOCVD. Temperature coefficient of wavelength is approximately 0.2nm $^{\circ}C$ for the diode. The active aperture consists of five emitters separated from each other by means of SiO$_{2}$ deposition and stripe formation, which creates insulating regions that channel the current to 100-$\mu$m-wide stripes placed on 450-$\mu$m centers. From a typical uncoated LD, the output power of 0.8W has been obtained at a 1$\mu$s, 1kHz pulsed current level of 2.0$\AA$, which results in about 64% external quantum efficiency. The threshold current density is 736A/cm$^{2}$ for the case of 500$\mu$m cavity length LD's. The measure of an internal quantum efficiency was 75.8% and the internal loss 4.83$cm^{-1}$ . Finally, 3.1W output power has been obtained at a 1$\mu$s, 1kHz pulsed current level of 9A from the 500$\mu$m-aperture LD array with 460-$\mu$m- cavity length.

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Design and fabrication of current limiting InP Gunn diode for W-band waveguide FTO (W-band 도파관 FTO 적용을 위한 전류제한 InP Gunn diode 설계 및 제작)

  • Ko, Dong-Sik;Kwak, No-Seong;Kim, Young-Jin;Heo, Jun-Woo;Ko, Pil-Seok;Kim, Sam-Dong;Park, Hyun-Chang;Rhee, Jin-Koo;Chun, Young-Hoon;Lee, Seok-Chul
    • Journal of the Institute of Electronics and Information Engineers
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    • v.51 no.3
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    • pp.45-54
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    • 2014
  • In this paper, We have designed and fabricated 20 InP Gunn diodes using a current limiting epitaxial structure by MINT's optimized fabrication processes. We have also packaged the fabricated InP Gunn diodes using our optimized packaging method, and then designed and fabricated a W-band waveguide FTO to measure characteristics of the packaged InP Gunn diodes. The packaged InP Gunn diode have a ceramic ring, a Au plated stud and a lid, and a Maltese cross. The fabricated InP Gunn diodes have good RF characteristics such as high output powers (11.8~17 dBm) and limiting low currents (less than 400 mA) between 92.9 and 94.78 GHz.

Compact Tunable Bandstop Filter Using DOS Section (DGS 구조를 이용한 소형 가변 대역 억제 필터)

  • Sung, Young-Je
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.12
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    • pp.1333-1338
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    • 2008
  • In this paper, RF varactor diode are applied to the design of miniaturized and tunable bandstop filter. The proposed bandstop filter is based on a Defected Ground Structure(DGS) section topology. The designed tunable bandstop filter can achieve a significant size reduction by with loading capacitance component of varactor diode. It is observed from the measured results that the proposed tunable bandstop filter shows a wide tuning range of 42.9 % from 1.01 GHz to 1.99 GHz. The rejection level in the stopband is higher as the number of DGS section increases. In case of the proposed tunable bandstop filter with two DGS sections, the rejection level of the filter is better than 20 dB in the stopband during the tuning. In this case, the maximum insertion loss in the lower passband is 0.5 dB.

1.5 kV GaN Schottky Barrier Diode for Next-Generation Power Switches (차세대 전력 스위치용 1.5 kV급 GaN 쇼트키 장벽 다이오드)

  • Ha, Min-Woo
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.61 no.11
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    • pp.1646-1649
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    • 2012
  • The $O_2$ annealing technique has considerably suppressed the leakage current of GaN power devices, but this forms NiO at Ni-based Schottky contact with increasing on-resistance. The purpose of the present study was to fabricate 1.5 kV GaN Schottky barrier diodes by improving $O_2$-annealing process and GaN buffer. The proposed $O_2$ annealing performed after alloying ohmic contacts in order to avoid NiO construction. The ohmic contact resistance ($R_C$) was degraded from 0.43 to $3.42{\Omega}-mm$ after $O_2$ annealing at $800^{\circ}C$. We can decrease RC by lowering temperature of $O_2$ annealing. The isolation resistance of test structure which indicated the surface and buffer leakage current was significantly increased from $2.43{\times}10^7$ to $1.32{\times}10^{13}{\Omega}$ due to $O_2$ annealing. The improvement of isolation resistance can be caused by formation of group-III oxides on the surface. The leakage current of GaN Schottky barrier diode was also suppressed from $2.38{\times}10^{-5}$ to $1.68{\times}10^{-7}$ A/mm at -100 V by $O_2$ annealing. The GaN Schottky barrier diodes achieved the high breakdown voltage of 700, 1400, and 1530 V at the anode-cathode distance of 5, 10, and $20{\mu}m$, respectively. The optimized $O_2$ annealing and $4{\mu}m$-thick C-doped GaN buffer obtained the high breakdown voltage at short drift length. The proposed $O_2$ annealing is suitable for next-generation GaN power switches due to the simple process and the low the leakage current.

1 Selector + 1 Resistance Behavior Observed in Pt/SiN/Ti/Si Structure Resistive Switching Memory Cells

  • Park, Ju-Hyeon;Kim, Hui-Dong;Kim, Tae-Geun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.307-307
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    • 2014
  • 정보화 시대로 접어들면서 동일한 공간에 더 많은 정보를 저장할 수 있고, 보다 빠른 동작이 가능한 비휘발성 메모리 소자에 대한 요구가 증가하고 있다. 하지만, 최근 비휘발성 메모리 소자 관련 연구보고에 따르면, 메모리 소자의 소형화 및 직접화 측면에서, 전하 저장을 기반으로 하는 기존의 Floating-Gate(FG) Flash 메모리는 20 nm 이하 공정에서 한계가 예측 되고 있다. 따라서, 이러한 FG Flash 메모리의 한계를 해결하기 위해, 기존에 FET 기반의 FG Flash 구조와 같은 3 terminal이 아닌, Diode와 같은 2 terminal로 동작이 가능한 ReRAM, PRAM, STT-MRAM, PoRAM 등 저항변화를 기반으로 하는 다양한 종류의 차세대 메모리 소자가 연구되고 있다. 그 중, 저항 변화 메모리(ReRAM)는 CMOS 공정 호환성, 3D 직접도, 낮은 소비전력과 빠른 동작 속도 등의 우수한 동작 특성을 가져 차세대 비휘발성 메모리로 주목을 받고 있다. 또한, 상하부 전극의 2 terminal 만으로 소자 구동이 가능하기 때문에 Passive Crossbar-Array(CBA)로 적용하여 플래시 메모리를 대체할 수 있는 유력한 차세대 메모리 소자이다. 하지만, 이를 현실화하기 위해서는 Passive CBA 구조에서 발생할 수 있는 Read Disturb 현상, 즉 Word-Line과 Bit-Line을 통해 선택된 소자를 제외하고 주변의 다른 소자를 통해 흐르는 Sneak Leakage Current(SLC)를 차단하여 소자의 메모리 State를 정확히 sensing하기 위한 연구가 선행 되어야 한다. 따라서, 현재 이러한 이슈를 해결하기 위해서, 많은 연구 그룹에서 Diodes, Threshold Switches와 같은 ReRAM에 Selector 소자를 추가하는 방법, 또는 Self-Rectifying 특성 및 CRS 특성을 보이는 ReRAM 구조를 제안 하여 SLC를 차단하고자 하는 연구가 시도 되고 있지만, 아직까지 기초연구 단계로서 아이디어에 대한 가능성 정도만 보고되고 있는 현실 이다. 이에 본 논문은 Passive CBA구조에서 발생하는 SLC를 해결하기 위한 새로운 아이디어로써, 본 연구 그룹에서 선행 연구로 확보된 안정적인 저항변화 물질인 SiN를 정류 특성을 가지는 n-Si/Ti 기반의 Schottky Diode와 결합함으로써 기존의 CBA 메모리의 Read 동작에서 발생하는 SLC를 차단 할 수 있는 1SD-1R 구조의 메모리 구조를 제작 하였으며, 본 연구 결과 기존에 문제가 되었던 SLC를 차단 할 수 있었다.

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Study on Color Shifting Mechanism for Organic Light Emitting Diode with Red Dopant-doped Emitting Layer (적색 도펀트가 도핑된 발광층을 갖는 유기발광다이오드에서의 컬러 시프트 메커니즘 연구)

  • Lee, Ho-Nyeon;Oh, Tae-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.10
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    • pp.4590-4599
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    • 2011
  • The Color shift phenomenon is becoming a major degradation factor of the emitting color purity in the organic emitting diodes which is generating a plurality of colors. In this study, the basic structure of organic light emitting diode device is comprised of ITO/${\alpha}$-NPD/$Alq_3$:DCJTB[wt%]/$Alq_3$/Mg:Ag, we have carry out numerical simulation of the electric-optical characteristics in organic light emitting diode device to estimate the mechanism of color shift phenomenon. We have investigated the causes of the color shift through the change of DCJTB doping concentration ratio. As the result, we have confirmed that the changes of the recombination rate which generated by trapped electrons and holes is one of the major factors for the color shift phenomenon.

Improved leakage current characteristics of $p^{+}n$ diode with polysilicon layer (다결정 실리콘을 이용한 $p^{+}n$ 다이오드의 누설전류 개선)

  • Kim, Weon-Chan;Lee, Jae-Gon;Choi, Sie-Young
    • Journal of Sensor Science and Technology
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    • v.5 no.1
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    • pp.57-62
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    • 1996
  • To decrease the leakage current of $p^{+}n$ junction diode with hyperabrupt structure, the $3000{\AA}$ polysilicon was deposited on the top of conventional $p^{+}n$ diode and then annealed for 30 minutes at $900^{\circ}C$ in the $N_{2}$ ambient. It was estimated for both $p^{+}n$ diodes with and without polysilicon layer, and the impurity materials of n diffused layer to observe the influence of the polysilicon layer on leakage current characteristics. The leakage current was reduced to the order of 3 by using polysilicon layer. A large number of dislocation loops, which were believed to be generated by As-implanted diffused layer, were found to be removed by using polysilicon through TEM analysis.

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Wide Tuning and Modulation Characteristics Analysis of Coupled-Ring Reflector Laser Diode (결합 링 반사기 레이저 다이오드의 광대역 파장 가변 및 변조 특성 해석)

  • Yoon, Pil-Hwan;Kim, Su-Hyun;Chung, Young-Chul
    • Korean Journal of Optics and Photonics
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    • v.17 no.6
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    • pp.544-547
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    • 2006
  • A time-domain modeling approach is used to study characteristics of a widely tunable coupled-ring reflector (CRR) laser diode(LD). The CRR consists of a bus waveguide and two coupled ring resonators coupled to the bus without resorting to distributed Bragg grating structure. The tuning range can be a few tens of nanometers with a side mode suppression ratio exceeding 35dB through the adjustment of currents into the phase control sections in the rings. The CRR laser diode has long effective cavity length compared to conventional laser diodes. Accordingly, a broad additional resonance peak in the amplitude modulation characteristics is observed between 20 to 30 GHz, implying the extension of amplitude modulation bandwidth.

A High Power SP3T MMIC Switch (고출력 SP3T MMIC 스위치)

  • 정명득;전계익;박동철
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.11 no.5
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    • pp.782-787
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    • 2000
  • The monolithic single-pole three-throw(SP3T) GaAs PIN diode switch circuit for the broadband and high power application was designed, fabricated and characterized. To improve the power handling capability, buffer layers of the diode employ both low temperature buffer and superlattice buffer. The diode show the breakdown voltage of 65V and turn-on voltage of 1.3V. The monolithic integrated switch employed microstrip lines and backside via holes for low-inductance signal grounding. The vertical epitaxial PIN structure demonstrated better microwave performance than planar type structures due to lower parasitics and higher quality intrinsic region. As the large signal characteristics of the fabricated SP3T MMIC switch, the insertion loss was measured less than 0.6dB and the isolation better than 50dB when the input power was increased from 8dBM to 32dBm at 14.5GHz.

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Design of Power Detection Block for Wireless Communication Transmitter Systems (무선통신 송신시스템용 전력검출부 설계)

  • Hwang, Mun-Su;Koo, Jae-Jin;Ahn, Dal;Lim, Jong-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.5
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    • pp.1000-1006
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    • 2007
  • This paper presents a power detector circuit which monitors the transmitting power for the application in CDMA cell phones. The proposed power detector are composed of coupler for coupling output power and detector fur monitoring output power. The designed coupler has low loss characteristic because it adopts the stripline structure which consists of two ground planes at both sides of signal plane. The design frequency is 824-849MHz which is the Tx band fur CDMA mobile terminal, and the coupling factor of the stripline coupler is -20dB. A schottky barrier diode is adopted for detector design because of its high speed operation with minimized loss. The required impedance matching is performed to improve the linearity and sensitivity of output voltage at relatively low detector input level where the nonlinear characteristic of diode exists. The package parasitics as well as intrinsic diode model are considered for simulation of the detector. The predicted performances agree well with the measured results.

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