• Design & Manufacturing
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• 제2권5호
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• pp.1-4
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• 2008

LCD-BLU (Liquid Crystal Display - Back Light Unit) is one of kernel parts of LCD unit and it consists of several optical sheets(such as prism, diffuser and protector sheets), LCP (Light Guide Plate), light source (CCFL or LED) and mold frame. The LGP of LCD-BLU is usually manufactured by forming numerous dots with $50-200{\mu}m$ in diameter on it by erosion method. But the surface of the erosion dots of LGP is very rough due to the characteristics of the erosion process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. Especially, the negative and positive micro-lens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP.

• Design & Manufacturing
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• 제2권6호
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• pp.1-6
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• 2008

Recently, many researches have been done to improve optical performance of LCD-BLU(Back Light Unit). One of the most important parts in LCD-BLU is LGP(Light Guiding Plate). Micro-patterned LGP is known to have different optical characteristics depending on their shape, pattern density and size, etc. In the present study, a micro-optical patterned LGP mold was fabricated using LiGA process. The difference in the optical characteristics between positive and negative patterned LGP's was investigated by fixing the density, location and size of each pattern. It was found that the negative patterned LGP showed better optical characteristics than positive one.

• Journal of Welding and Joining
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• 제32권3호
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• 한국생산제조학회지
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• 제20권2호
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• pp.151-156
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• 2011

This study examined the casting analysis of fuel pressure regulator of LPI vehicles. We aims to predict all the phenomenon accompanied by flow and solidification in die casting, and maximize productivity and quality through optimal casting design. As a result of comparing Types A and B of casting design, it was found that the number of overflow affected flow, flowspeed and solidification temperature. And there was a minute difference between solidification temperatures at thick section of the spare parts. Solidification began at temperatures of $624^{\circ}C{\sim}630^{\circ}C$ but after the casting was completed, temperatures at the center of the parts were $600^{\circ}C{\sim}614^{\circ}C$ Temperature of molten metal showed optimal flow at temperature of $680^{\circ}C$. It began to solidity around at $650^{\circ}C$ and to be cooled between $580^{\circ}C{\sim}550^{\circ}C$ in high speed. When the process was analysed through a computer simulation, it was found that hardness of regulators manufactured through Type B of overflow was above $H_R60$.

• Design & Manufacturing
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• 제10권2호
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• pp.34-38
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• 2016

In this paper, a transversely isotropic behavior of AZ31 Mg alloy produced by equal-channel angular pressing (ECAP) process was investigated through tensile test and microstructure observation. The effects of initial ECAP pass number on the anisotropic behavior and mechanical properties of the Mg alloy are evaluated after conventional direct extrusion test, which are carried out at a temperature of $200^{\circ}C$. As a result of the tensile test in three directions ($0^{\circ}$, $45^{\circ}$, and $90^{\circ}$ to the extrusion direction of the sheet) at room temperature, elongation of as-extruded AZ31 alloy(ECAP for 0 pass) showed an unusual anisotropic behavior depending on the extrusion direction although the yield strength and tensile strength are similar to the ECAPed AZ31 alloy. After ECAP for 4 passes at $200^{\circ}C$, microstructural observations of ECAPed magnesium alloy showed a significant grain refinement, which is leading to an equiaxed grain structure with average size of $2.5{\mu}m$. The microstructures of the extruded billet are observed by the use of an electron back-scattering diffraction (EBSD) technique to evaluate of the influence on the grain refinement during extrusion process and re-crystallization mechanism of AZ31 Mg alloy.

• Design & Manufacturing
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• 제2권2호
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• pp.29-32
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• 2008

A back light unit (BLU) is a key module of a thin film transistor liquid crystal display (TFT-LCD), frequently utilized in various mobile displays. In this study, we experimentally characterize transcription and optical properties of concave and convex microlens arrays (MLAs) of light guide plate (LGP) fabricated by injection molding with polycarbonate as a LGP substrate material. Nickel mold inserts were manufactured by electroforming on the MLA which was fabricated by the thermal reflow of photoresist microstructures patterned by UV-photolithography. For the case of convex microlens, the height of replicated microlens was less than that of the mold insert while maintaining almost the same microlens diameter of the mold insert as the location of the microlens is far from the gate. In contrast, for the concave microlens, the diameter of replicated microlens was larger than that of mold insert, while showing almost the same microlens height as the mold insert. From the optical examination of replicated convex and concave MLAs, it was found that a higher luminance of the LGP was achieved by the concave MLAs compared to the convex MLAs (about 30% enhancement in this case)due to the utilization of a larger amount of light provided by the light sources.

• The Korean Journal of Pain
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• 제33권3호
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• pp.245-257
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• 2020

Background: Musculoskeletal pain is associated with obesity; however, information on factors associated with pain in adults with obesity and severe obesity is limited. The purpose of this study was to assess the prevalence of musculoskeletal pain by site and intensity of pain and associated factors in individuals with severe obesity (body mass index ≥ 35.0 kg/㎡). Methods: Baseline data from the DieTBra Trial study evaluating pain symptoms in nine body regions over the last seven days using the Nordic Questionnaire on Musculoskeletal Symptoms and Numerical Pain Scale. The variables analyzed using multiple Poisson regression with hierarchical analysis were: sociodemographic, lifestyle, food consumption, clinical, and anthropometric, and the outcome was moderate and intense pain. Results: In 150 participants, there was a high prevalence of ankle and foot pain (68.7%), lower back pain (62.7%), pain in the knees (53.3%) and upper back pain (52.0%), with a predominance of intense pain. Factors associated with pain according to specific sites were: type 2 diabetes with hand/wrist pain; sedentary time with hip pain; insomnia with pain in the hip and knee; edema in the lower limbs with pain in the lower back and ankles/feet; degree of obesity with ankle/foot pain; and percentage of total fat with ankle/foot pain. Conclusions: There was a high prevalence of pain and intense pain in individuals with severe obesity and an association with clinical variables, the degree of obesity, and sedentary lifestyle.

• 소성∙가공
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• 제4권3호
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• pp.214-221
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• 1995

In the paper, we have proposed a new method to determine the initial billet for the forged products using a function approximation in the neural network. The architecture of neural network is a three-layer neural network and the back propagation algorithm is employed to train the network. By utilizing the ability of function approximation of a neural network, an optimal billet is determined by applying the nonlinear mathematical relationship between the aspect ratios in the initial billet and the final products. The amount of incomplete filling in the die is measured by the rigid-plastic finite element method. The neural network is trained with the initial billet aspect ratios and those of the unfilled volumes. After learning, the system is able to predict the filling regions which are exactly the same or slightly different to the results of finite element simulation. This new method is applied to find the optimal billet size for the plane strain rib-web product in cold forging. This would reduce the number of finite element simulation for determining the optimal billet size of forging product, further it is usefully adapted to physical modeling for the forging design.

• Design & Manufacturing
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• 제18권2호
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• pp.9-16
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• 2024

Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.

• 산업경영시스템학회지
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• 제39권4호
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• pp.90-96
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• 2016

Incremental sheet forming (ISF) is a highly versatile and flexible process for rapid manufacturing of complex sheet metal parts. Compared to conventional sheet forming processes, ISF is of a clear advantage in manufacturing small batch or customized parts. ISF needs die-less machine alone, while conventional sheet forming requires highly expensive facilities like dies, molds, and presses. This equipment takes long time to get preparation for manufacturing. However, ISF does not need the full facilities nor much cost and time. Because of the facts, ISF is continuously being used for small batch or prototyping manufacturing in current industries. However, spring-back induced in the process of incremental forming becomes a critical drawback on precision manufacturing. Since sheet metal, being a raw material for ISF, has property to resilience, spring-back would come in the case. It is the research objective to investigate how geometrical shaping parameters make effect on shape dimensional errors. In order to analyze the spring-back occurred in the process, this study experimented on Al 1015 material in the ISF. The statistical tool employed experimental design with factors. The table of orthogonal arrays of $L_8(2^7)$ are used to design the experiments and ANOVA method are employed to statistically analyze the collected data. The results of the analysis from this study shows that the type of shape and the slope of bottom are the significant, whereas the shape size, the shape height, and the side angle are not significant factors on dimensional errors. More error incurred on the pyramid than on the circular type in the experiments. The sloped bottom showed higher errors than the flat one.