• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 한국세라믹학회지
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• 제38권9호
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• pp.799-805
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• 2001

상용 알루미나 분말(0.5${\mu}$m, 3${\mu}$m)을 die-press법을 이용하여 1120$^{\circ}$C에서 2시간 1차 소결하여 다공성 전성형체를 제조하고 1100$^{\circ}$C에서 4시간 $La_2O_3-Al_2O_3-SiO_2$계 유리를 용융 침투시켜 치밀한 유리-알루미나 복합체를 제조하였다. 알루미나 입도가 유리-알루미나 복합체의 충진율, 미세조직, 젖음성, 기공률 및 크기, 기계적 특성에 미치는 영향을 조사하였다. 입도 범위가 0.1∼48${\mu}$m로 넓고 bimodal size 입도 분포를 가지면서 random orientation을 가진 3${\mu}$m 알루미나가 분산된 복합체가 최적의 기계적 특성 및 충진률이 관찰되었으며 강도와 인성값은 각각 519MPa, $4.5MPa{\cdot}m^{1/2}$이었다.

• The Journal of Advanced Prosthodontics
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• 제7권3호
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• pp.233-239
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• 2015

PURPOSE. This study aimed to evaluate the fit of zirconia ceramics before and after veneering, using 3 different veneering processes (layering, press-over, and CAD-on techniques). MATERIALS AND METHODS. Thirty standardized zirconia CAD/CAM frameworks were constructed and divided into three groups of 10 each. The first group was veneered using the traditional layering technique. Press-over and CAD-on techniques were used to veneer second and third groups. The marginal gap of specimens was measured before and after veneering process at 18 sites on the master die using a digital microscope. Paired t-test was used to evaluate mean marginal gap changes. One-way ANOVA and post hoc tests were also employed for comparison among 3 groups (${\alpha}$=.05). RESULTS. Marginal gap of 3 groups was increased after porcelain veneering. The mean marginal gap values after veneering in the layering group ($63.06{\mu}m$) was higher than press-over ($50.64{\mu}m$) and CAD-on ($51.50{\mu}m$) veneered groups (P<.001). CONCLUSION. Three veneering methods altered the marginal fit of zirconia copings. Conventional layering technique increased the marginal gap of zirconia framework more than pressing and CADon techniques. All ceramic crowns made through three different veneering methods revealed clinically acceptable marginal fit.

• 한국기계가공학회지
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• 제15권3호
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• pp.44-51
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• 2016

This paper presents the characteristics of the energy absorption in an expansion tube type impact absorber that is applied to a high weight drop tester and the use of a response surface methodology to predict the impact energy absorption. In order to identify the characteristics of the energy absorption, a set of finite element analysis was conducted with Abaqus Explicit. Moreover, the ISCD-II sampling method and a first order polynomial were used to build a response surface. As a result, we demonstrated that the impact energy could be controlled by four main design variables, namely an expansion pipe's thickness, inner radius, pressing die's expansion angle and expansion ratio. Additionally, we observed the relationship between the four main design variables and the impact energy absorbing time, displacement, and maximum impact force.

• 한국분말재료학회지
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• 제26권6호
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• pp.508-514
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• 2019

In the development of advanced ceramic tools, material improvements and design freedom are critical in improving tool performance. However, in the die press molding method, many factors limit tool design and make it difficult to develop innovative advanced tools. Ceramic 3D printing facilitates the production of prototype samples for advanced tool development and the creation of complex tooling products. Furthermore, it is possible to respond to mass production requirements by reflecting the needs of the tool industry, which can be characterized by small quantities of various products. However, many problems remain in ensuring the reliability of ceramic tools for industrial use. In this study, alumina inserts, a representative ceramic tool, was manufactured using the digital light process (DLP), a 3D printing method. Alumina inserts prepared by 3D printing are pressurelessly sintered under the same conditions as coupon-type specimens prepared by press molding. After sintering, a hot isostatic pressing (HIP) treatment is performed to investigate the effects of relative density and microstructure changes on hardness and fracture toughness. Alumina inserts prepared by 3D printing show lower relative densities than coupon specimens prepared by powder molding but indicate similar hardness and higher fracture toughness values.

• 한국해양공학회지
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• 제22권6호
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• pp.75-82
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• 2008

Flame bending has been extensively used in the shipbuilding industry for hull plate forming In flame bending it is difficult to obtain the desired shape because the residual deformation dependson the complex temperature distribution and the thermal plastic strain. Mechanical bending such as reconfigurable press forming multi-point press forming or die-less forming has been found to improve the automation of hull plateforming because it can more accurately control the desired shape than line heating. Multi-point forming is a process in which external forces are used to form metal work-pieces. Therefore it can be a flexible and efficient forming technique. This paper presents an optimal approach to determining the press-stroke for multi-point press forming of curved shapes. An integrated configuration of Finite element analysis (FEA) and spring-back compensation algorithm is developed to calculate the strokes of the multi-point press. Not only spring-back is modeled by elastic plastic shell elements but also an iterative algorithm to compensate the spring-back is applied to adjust the amount of pressing stroke. An iterative displacement adjustment (IDA) method is applied by integration of the FEA procedure and the spring-back compensation work. Shape deviation between the desired surface and deform￡d plate is minimized by the IDA algorithm.

• Korean Chemical Engineering Research
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• 제57권4호
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• pp.525-530
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• 2019

고체산화물 연료전지의 성능과 안정성은 전극의 기공률, 기공 분포와 전해질의 치밀도, 두께에 따라 결정 된다. 연료극의 기공률과 기공 분포는 활성면적와 연료 흐름에 영향을 주고, 전해질의 치밀한 미세구조와 두께는 단위전지의 Ohmic 저항에 영향을 준다. 하지만 이를 위해 값 비싼 공정 장비를 이용하거나 여러 단계의 제작 공정이 추가 될 경우 단위전지 제작비가 증가하므로 상업화를 목표로 하는 연구에는 적합하지 않다. 본 연구에서는 위와 같은 문제점들을 해결하기 위하여 상용 소재 기반의 NiO-YSZ 연료극을 선정 후 간단한 혼합 방법 및 일축가압 성형법과 담금코팅(dip coating) 공정을 사용하여 저비용 고효율의 세라믹 공정 기반의 고성능 단위전지를 제작하였다. 연료극의 기공률은 기공형성제로서 사용되는 카본 블랙(CB, carbon black)의 첨가량(10~20 wt%)과 최종 소결온도($1350{\sim}1450^{\circ}C$)를 변경하며 제어하였고, YSZ 전해질의 두께와 미세구조는 담금코팅 슬러리의 고상 분말량(YSZ, 1~5 vol%)을 제어하여 치밀한 박막의 전해질을 구현하고자 하였다. 그 결과 Ni-YSZ 연료극에서 최적의 값으로 잘 알려진 40%의 기공률은 카본 블랙을 15 wt% 첨가하고최종소결온도를 $1350^{\circ}C$로설정함으로써얻을수있었다. 담금코팅을통한 YSZ 두께는 $2{\sim}28{\mu}m$까지 제어가 가능하였고, 3 vol%의 고상분말량에서 치밀한 전해질 미세구조가 형성되었다. 최종적으로 40%의 기공률을 갖는 Ni-YSZ 연료극, $20{\mu}m$ 두께의 치밀한 YSZ전해질, LSM-YSZ 공기극으로 구성된 단위전지는 $800^{\circ}C$에서 $1.426Wcm^{-2}$의 우수한 성능을 얻을 수 있었다.