• ETRI Journal
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• 제41권3호
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국내학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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• pp.349-352
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• 1988

In this study, a structured supervisory control for automatic assembly system is developed. And also diagnosis and fault-recovery capability of this supervisory control are discussed. This structured supervisory control is actually applied to Die Bonding Machine and is proved to be useful and to work well.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권7호
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• pp.315-318
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• 2005

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

• 한국주조공학회지
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• 제25권3호
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• pp.134-141
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• 2005

To overcome the undesirable deformation, peeling off and geometrical restrictions which were mainly caused by differences in thermal expansion coefficients during the cladding of aluminum strip and stainless strip, new processing method based on vacuum die casting is designed and implemented in fabricating Al/Fe-17wt%Cr steel(stainless steel). To increase cast-bonding ability, the surface of Fe-17wt%Cr steel is electrochemically etched to have optimum pit size and density. The optimum conditions to generate best pit are as follows: Solution: 1 M $Fecl_{3}$+1 M Nacl, Addition: $CuCl_{2}+HCl$, Current density: 80 $mA/cm^{2}$, Total current: 400 $coulomb/cm^{2}$, AC frequency :60 Hz.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.393-396
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• 2005

This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.

• 소성∙가공
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• 제13권4호
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• pp.342-349
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• 2004

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair. The joining strength from the process ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance is devised to reduce the depth of drawing and the forming load. Taguchi method is employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method is used. The experiments show that in the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions is reduced by more than 65 percent and the forming load by 50 percent.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.69-73
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• 2008

본 연구에서는 리드-온-칩 패키징 기술을 이용한 반도체 제품에서 디바이스의 패드의 위치가 온도변화로 인한 신뢰성 문제에 대단히 중요하다는 것을 보여준다. 컴퓨터를 이용한 이론적 계산 및 실험을 통해 패시베이션 파손으로 대변되는 신뢰성 문제가 디바이스의 코너 부위에 위치한 패턴에서 가장 심하게 발생할 수 있다는 것을 보여준다. 따라서, 패시베시션 파손 등으로 인한 디바이스의 신뢰성 저하를 예방하기 위해서는 취약한 패드 부위는 다바이스의 테두리 부위보다는 중앙부위에 위치하도록 설계하는 것이 바람직하다는 것을 본 연구에서는 지적하고 있다.

• 대한기계학회논문집A
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• 제25권10호
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• pp.1541-1550
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• 2001

This paper describes experimental investigations in the direct extrusion of copper clad aluminum rods through conical dies. Composite materials consist of two or more different material layers. Copper clad aluminum composite materials are being used fur economic and structural purposes and the development of an efficient production method of copper clad aluminum composite material rods by extrusion is very important, It is necessary to know the conditions in which successful uniform extrusion ,and sound cladding may be carried out without any defects in the direct extrusion. There are several variables that have an influence on determining a sound clad extrusion. In order to investigate the influence of these parameters on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with various extrusion temperatures, extrusion ratios and semi-cone angles of die. Subsequently, the microscopic inspection of interface bonding is carried out for extruded products. By measuring hardness, along extrusion way of products, a variation of hardness has been discussed. Proportional flow state has been considered by measuring radius ratio of Cu sleeve and Al core before and after extrusion.

• 한국산학기술학회논문지
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• 제18권4호
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• pp.175-182
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• 2017

본 와이어 본딩은 발광 다이오드의 패키징 공정에서 매우 중요한 공정으로 금 와이어를 이용하여 발광 다이오드 칩과 리드 프레임을 연결함으로써 다음 공정에서의 전기적 작동을 가능하게 한다. 와이어 본딩 공정은 얇은 금속선을 연결하는 공정으로 열 압착 본딩(thermo compression bonding)과 초음파 본딩(ultra sonic bonding)이 있다. 일반적인 와이어 본딩 공정은 LED 칩 상부 전극 부위에 볼 모양의 본딩을 진행하는 1st ball bonding 공정, loop를 형성하여 다른 전원 연결부위로 wire를 늘어뜨리는 looping 공정, 다른 전극 부위 상부에 stitch를 형성하여 bonding 하는 2nd stitch bonding으로 구분된다. 본 논문에서는 발광 다이오드 다이 본딩 공정에 영향을 주는 다양한 공정 변수에 대하여 분석을 수행하였다. 그리고 반응 표면 분석법을 통하여 Zener 다이오드 칩과 PLCC 발광 다이오드 패키지 프레임을 연결하는 공정 최적화 결과를 도출하였다. 실험 계획법은 5인자, 3수준에 대하여 설정하였으며 4가지 반응에 대하여 인자를 분석하였다. 결과적으로 본 연구에서는 모든 목표에 맞는 최적 조건을 도출하였다.

• Design & Manufacturing
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• 제2권1호
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• pp.15-19
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• 2008

While recent industrial structure is various, it is small quantity batch production structure, and products requiring of various functions are increasing. In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.