• Journal of the Korean Society for Precision Engineering
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• v.17 no.6
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• pp.185-191
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• 2000

Recently, a slightest influence to the circuit can be a great damage because the size of semiconductor smaller. It must be controlled the chippingless dicing process and the precision dicing without any damage to tile circuit. In this study, the relationship between chipping effect and the force of dicing was analysed. The rate of chipping was decreased as the farce of dicing decreased. It was also examined that the farce of dicing decreased according to the lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve the chippingless process.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.39 no.3
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• pp.147-155
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• 2016

Industry 4.0's goal is the 'Smart Factory' that integrates and controls production process, procurement, distribution and service based on the fundamental technology such as internet of the things, cyber physical system, sensor, etc. Basic requirement for successful promotion of this Industry 4.0 is the large supply of semiconductor. However, company I who produces dicing blades has difficulty to meet the increasing demand and has hard time to increase revenue because its raw material includes high price diamond, and requires very complex and sensitive process for production. Therefore, this study is focused on understanding the problems and presenting optimal plan to increase productivity of dicing blade manufacturing processes. We carried out a study as follows to accomplish the above purposes. First, previous researches were investigated. Second, the bottlenecks in manufacturing processes were identified using simulation tool (Arena 14.3). Third, we calculate investment amount according to added equipments purchase and perform economic analysis according to cost and sales increase. Finally, we derive optimum plan for productivity improvement and analyze its expected effect. To summarize these results as follows : First, daily average blade production volume can be increased two times from 60 ea. to 120 ea. by performing mixing job in the day before. Second, work flow can be smoother due to reduced waiting time if more machines are added to improve setting process. It was found that average waiting time of 23 minutes can be reduced to around 9 minutes from current process. Third, it was found through simulation that the whole processing line can compose smoother production line by performing mixing process in advance, and add setting and sintering machines. In the course of this study, it was found that adding more machines to reduce waiting time is not the best alternative.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.861-864
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• 1997

Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.963-966
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• 2000

Plasma display panel (PDP) is a type of flat panel display utilizing the light emission that is produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalk from adjacent sub-pixels. Mold for forming barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing process such as screen printing, sand-blasting and photosensitive glass methods. Mold for PDP barrier ribs have stripes of micro grooves transferring stripes of glass-material wall. In this paper. Stripes of grooves of which width 48 um, depth 124um, pitch 274um was acquired by machining the material of WC with dicing saw blade. Maximum roughness of the bottom and sidewall of the grooves was respectively 120 nm, 287 nm. Maximum tilt angle caused by difference between upper-most width and lower-most width was 2$^{\circ}$. Maximum Radius of curvature of bottom was 7.75 ${\mu}{\textrm}{m}$. This results meets the specification for barrier ribs of 50 inch XGA PDP. Forming the glass paste will be followed by using mold in the near future.

• Journal of the Korean institute of surface engineering
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• v.46 no.1
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• pp.22-28
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• 2013

$WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.171-176
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• 2001

Plasma Display Panel(PDP) is a type of flat panel display utilizing the light emission produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalks from adjacent sub-pixels. Mold for forming barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing process such as screen printing, sand-blasting and photosensitive glass methods. Mold for PDP barrier ribs have stripes of micro grooves transferring glass-material wall. In this paper, Stripes of grooves of which width 48${\mu}{\textrm}{m}$ and 270${\mu}{\textrm}{m}$, depth 124${\mu}{\textrm}{m}$, pitch 274${\mu}{\textrm}{m}$ was acquired by machining hard and brittle materials of WC, Silicon, Alumina with dicing saw blade. Maximum roughness of the bottom and sidewall of the grooves was respectively 120nm, 287nm in grooving WC. Maximum tilt angle caused by difference between upper-most width and lower-most width was 2$^{\circ}$. Maximum Radius of bottom curvatures was 7.75${\mu}{\textrm}{m}$. This results satisfies the specification for barrier ribs of 50 inch XGA PDP if the groove form of mold was fully transferred to the barrier ribs. Barrier ribs were formed with Silicone rubber mold, which is transferred from grooved hard materials. Silicone rubber mold has elasticity accommodating the waveness of lower glass plate of PDP.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.335-340
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• 2008

Cutting performance and wear behavior were studied with the diamond micro-blade of Cu/Sn bond materials containing various amount of lubricant materials such as graphite and $MoS_2$. Measurement of instantaneous electric power consumption for cutting glass workpiece at the constant velocity was conducted and proposed as a method to assess cutting efficiency. The energy consumption of micro-blade for glass cutting decreased with the content of graphite and $MoS_2$ while wear amount of blade in volume increased with the amount of lubricant addition during the dicing test. It is because that hardness, flexural strength, and fracture toughness ($K_{IC}$) reduced with the amount of lubricant addition. Blades with $MoS_2$ additive showed higher mechanical properties than those with graphite additives when the same amount of the lubricant additive in wt.% was added. Due to the lower density of graphite than $MoS_2$, higher volume fraction of graphite could result in stronger effect on lowering electric power consumption by reducing the friction between blade and work piece however increasing wear rate due to the reduction in strength and fracture toughness. Adhesive wearing mode of micro blade could be remarkably improved by the addition of graphite as well as $MoS_2$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.443-448
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• 2010

Rapid advance in information technology requires high performance devices with compact size. Integrated multi-layer electronic element with different functions enables those compact devices to possess various performances and powerful capabilities. In mass production, the multi-layer electronic element is manufactured as a bulk type with a large number of parts for productivity. However, this may cause the electronic part to be damaged in the cutting process of the bulk elements to separate into each part. Therefore the cutting performance of multi-layer element bulk is playing an important role in the view of production efficiency. This study focuses on the cutting characteristics of multi-layer electronic elements. In order to increase the efficiency, the vibration cutting method was applied to the blade cutting machine. Flexure hinge structure, which is an physical amplifier of increasing displacement, was attached to the vibration cutting device for machining efficiency. The behaviors of flexure hinge were modeled with Lagrange equation and simulated with finite element method (FEM). Performance of hinge structure was verified by experimental modal analysis (EMA) for hinge structure to be tuned to the specific mode of vibrations. Cutting experiments of multi-layer elements were conducted with the proposed vibrating cutting module, and the characteristics was analyzed.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.37-42
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• 2012

$WS_2$ powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of $WS_2$ additive on cutting efficiency was investigated and compared with the micro-blades with $MoS_2$ developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with $WS_2$ but wear depth increased. It was found that the blades including $WS_2$ consumed less momentary energy than the blades containing $MoS_2$ during dicing test. Micro-blades containing $WS_2$ exhibited lower flexural strength than the blades with $MoS_2$ resulting from higher amount of sintering defects relevant to the less effectiveness of $WS_2$ on fluidity. The effect of $WS_2$ and $MoS_2$ on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.% of $WS_2$ showed the best cutting efficiency.