• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.92-97
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• 1994

The there axis CNC grinding machine tool for ultra-precison mirror surface grinding of advanced materials such as ceramics and other hard and brittle materials was designed and manufactured. The grinding machine is composed of the air spindle, the high damping resin concrete bed, and the three axis CNC controller with the high resolution AC servo motor. To investigate the dynamic properties of the grinding machine, the natural frequencies of the spindle and the headstock were experimentally measured. The truing method using the break truer to revise the shape of the metal bonded diamond wheel was developed. Form the results of the machining using the prototype three axis CNC grinding machine manufactured, the mirror surface were achieved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.55-60
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• 1994

최근의 사무기기용 다면체반사경을 비롯하여 메모리 디스크,복사기용 드럼등은 물론 레이저 응용, X-선용의 천체망원경 및 현미경등의 광기술에 "초정밀 가공기술"의 용도가 점차 확대되어 가고 있는데, 이는 진보된 과학과 공업기술에 대한 시스템에 있어서 광학, 전기 및 전자 그리고 기계 부품의 생산에 가장 중요한 핵심기술의 하나이다. 본 연구에서는 초정밀 전용 공작기계가 아닌 범용 CNC 선반에 초정밀 절삭공구인 직선 절인의 천연다이아몬드 공구와 공작물로써 알루미늄합금을 장착하고, 선삭하여 초정밀 절삭에 관한 정성적인 데이터를 얻고자, 절삭조건에 따른 표면거칠와 절삭력 등의 변화를 조사하였다.변화를 조사하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.561-562
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• 2006

To enhance the precision and productivity of ultra precision aspheric surface micro lens, the development of ultra-precision grinding system and process for the aspheric surface micro lens are described. In the work reported in this paper, an ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the grinding surface roughness and profile accuracy. This paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. The optimization of grinding conditions on ground surface roughness and profiles accuracy is investigated using the design of experiments.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.34-34
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• 2004

정보의 급속한 발전, 컴퓨터, 가전기기, 자동차등 내구 소비재의 제품 개발기간 단축, 생산자의 지속적인 생산성 향상 활동, 소비자 선호의 다양성, 품질 요구 수준 상승 등 제반 환경변화는 절삭가공부분에 있어 핵심이 되고 있다. 여기에 전통적 제조업의 고부가가치화 및 새로운 시스템의 도입 등과 맞물려 최근의 초정밀 공작기계는 고속화, 고정밀화를 바탕으로 크게 발전하고 있다, 특히 21세기로 향하는 지금 공작기계 기술은 고속화, 정밀화, 개방화, 환경친화의 방향으로 혁신을 지속하고 있으며, 머지 않아 마이크로 프로세서의 급속한 발전에 힘입어 고속화 기술은 극 초고속화 단계로, 정밀화 기술은 극 초정밀화 단계로, CNC 기술은 오픈화 및 네트워크화를 통한 다양한 통신기술이 부가됨으로써 설계, 생산, 영업 및 서비스 정보와 연계시켜 통합제어를 통한 타 지역의 공작기계를 원격제어 할 수 있는 단계로 이르게 될 것이다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.265-265
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• 2004

최근 IT산업으로 대표되는 광통신 및 광신호 전달에 이용되는 광 반사경 및 렌즈어레이, 광가이드 판넬(BLU, FLU)등 광부품의 수요가 급증하고 있고, 이의 생산을 위한 다양한 제조공정이 연구 개발되고 있다 근년까지 이러한 마이크로 광부품의 제조방법은 포토리소그래피, 에칭기술을 베이스로 한 MEMS 기술, PDMS를 이용한 복재기술에 크게 의존하고 있다. 기계적 가공법으로는 오래전부터 초정밀 경면 선삭이나 연삭에 의한 마이크로 렌즈와 미세 패턴의 금형가공이 이루어져 왔다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.202-205
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• 2002

The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\Phi$ 50${\mu}{\textrm}{m}$ micro-drill which is coated with diamond is used for drilling of super micro-hole sues. For the machining of taper parts of entrance and exit, drill having $\Phi$ 9mm inclination angle 20$^{\circ}$ is used. This is useful for anti tool-breakage in drilling process. After micro-drilling, the polishing process by abrasive is carried out for increasing surface roughness.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.227-230
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• 2002

New polishing technique for small parts has been tried out using the principle of particle electromechanics. Common fine abrasives such as alumina, diamond, silicon carbide are dielectric materials which are polarized under an electric field, and a non-uniform electric field makes abrasive particles translate along the field line. Using this principle, We make abrasive particles aggregate in the vicinity of the micro tool which is fir the surface finishing of a small part without contact with it. The behavior of particles is optically measured, and the machined depth of glass is examined.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.40-45
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• 2003

Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.76-82
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• 2009

To obtain the surface roughness with nano order, we need a ultra-precision machine, cutting condition, and materials. In this paper, the cutting condition for getting nano order smooth surface of core have been examined experimentally by the ultra-precision machine and diamond wheels. The effects of the cutting velocity, the feed rate and depth of cut on the surface roughness were studied. And also, the surface roughness was measured by the Form Talysurf series PGI 840. The champion data of developed core was surface roughness Rmax 24.6nm, figure accuracy Rmax 68.9nm.

• International Journal of Precision Engineering and Manufacturing-Green Technology
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• v.5 no.5
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• pp.571-581
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• 2018

In the present study, monitoring of elliptical vibration cutting process by utilizing internal data in the ultrasonic elliptical vibration device without external sensors such as a dynamometer and displacement sensor is investigated. The internal data utilized here is the change of excitation frequency, i.e. resonant frequency of the device, voltages applied to the piezoelectric actuators composing the device, and electric currents flowing through the actuators. These internal data change automatically in the elliptical vibration control system in order to keep a constant elliptical vibration against the change of the cutting process. Correlativity between the process and the internal data is described by using a vibration model of ultrasonic elliptical vibration cutting and verified by several experiments, i.e. planing and mirror surface finishing of hardened die steel carried out with single crystalline diamond tools. As a result, it is proved that it is possible to estimate the elements of elliptical vibration cutting process, e.g. tool wear and machining load, which are important for stable cutting in such precision machining.