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Machining Characteristics of Micro-parts using the Ultra-precision Machine Tools (초정밀 공작기계를 이용한 미소부품의 가공특성)

  • 이재종;이응숙;제태진;이선우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.858-861
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    • 2001
  • As the application fields of micro parts that are micro endo-scope, PDA, and tele-communication had been extended, there are required the micro machine tools and MEMS in order to machining for those parts. In order to machining of the micro parts, the micro machining center is very effective. The micro machining center had some advantages that are lower cost, higher accuracy, and lower required powers than existing machine tools for machining of micro parts. In this study, in order to analyze the machining characteristics and its application possibility of the developing micro machining center with 60,000rpm rotations, 0.1$\mu\textrm{m}$ resolutions, and 80 50 50mm sliding unit, the machining experiment had been executed. In this experimental machining, 0.1~ 0.5mm endmills are used to machining the micro cap and tele-communication's parts. In the future, experimental results will be adapted to the micro-machining center.

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A Study on Basic Research Trends of Ultra-Precision Machining Technology in Korea (우리나라 초정밀가공기술의 기초연구동향 분석 연구)

  • Park, Won-Kyoo;Lee, Dae-Myung;Hong, Won-Hwa
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.1
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    • pp.86-95
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    • 2011
  • Ultra-precision machining technology is the essential core technology in today's micro-electronics and electro-optical industries. The needs for processing systems to manufacture products to nanometer(nm) accuracy and sub-nanometer resolutions are increased recently. By using ion beam, it is possible to fabricate ultra-precision and ultra-fine products with nm accuracy and sub-nm resolution. In this paper, the basic research trends of ultra precision machining technology in domestic are surveyed, and the ways to reach to the world-leading level of basic research capabilities in the field of ultra-precision machining technology in domestic is suggested.

Burr and shape distorion in micro-grooving of optical componets (광학부품용 비세홈의 금형가공에 있어서 버와 형상변형에 관한 연구)

  • 임한석;안중환
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.53-57
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    • 1996
  • The side burrs and shape distortion resulting from the micromachining of an array of V-shape microgrooves in optical components were experimentally invesigated and a simplified model for their formation is proposed. Burr/shpae distortion should be kept to a minimum level since they degrade the characteristics and performance of these parts. The focus of this study is on the influence of depth of cut and workpiece material. The workpiece materials use were brass, bronze and copper. From the obsevation of the chip shape and burr/shape distortion, the proposed model, that the compressive force at the cutting edge causess the ductile uncut chip material to flow plastically outward toward the free surface to result in a burr, was verified.

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The Characteristics of Ultra Precision Machining of Optical Crystal (광학소자의 초정밀절삭 특성에 관한 연구)

  • 김주환;박원규;김건희;원종호
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.529-532
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    • 2003
  • Machining technique for optical crystals with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency. poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials. As a result. the surface roughness is good when spindle speed is 200m/min. and teed rate is small. The influence of depth of cut is very small.

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A Study on the Mirror Surface Grinding of Optical Glass Utilizing Electrolytic In-Process Dressing (전해 인프로세스 드레싱을 이용한 Optical glass계의 경면연삭에 관한 연구)

  • 조주현;원종호;박원규;이진오;김민수;김성수
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.410-415
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    • 2003
  • Electrolytic In-process Dressing (ELID) technique for metal bonded diamond grinding wheel has been developed for mirror surface grinding of hard and brittle materials. This study process optical glass in using Electrolytic In-process Dressing. In using to main variable wheel speed (400rpm~2000rpm),feed rate (5$\mu\textrm{m}$/min~25$\mu\textrm{m}$/min),depth of cut (3$\mu\textrm{m}$~5$\mu\textrm{m}$),dressing and spray. We measured surface roughness in representative brittle materials

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A Study on the Machining Characteristic of DLC Coated Mold Material Using FIB (FIB를 이용한 DLC소재의 가공공정에 관한 연구)

  • Hong, W.P.;Choi, B.Y.;Kang, E.G.;Lee, S.W.;Choi, H.Z.
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.3
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    • pp.224-230
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    • 2009
  • FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In the paper, we studied the FIB-Sputtering rate according to mold materials. And surface roughness characteristics had been analysed for micro or nano mold fabrication. Si wafer, Glassy Carbon, STAVAX and DLC that have been normally considered as good micro or nano mold materials were used in the study.

A Study on Ultraprecision Dicing Machining of Silicon Wafer (실리콘 웨이퍼의 초정밀 절단가공에 관한 연구)

  • 김성철
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.502-506
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    • 1999
  • Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, so it is important to control the chipping generation in the process of dicing. This paper deals with chipping of the silicon wafer dicing. The relationships between the dicing force and the wafer chipping are investigated. It is confirmed that the wafer chipping increases as the dicing force increases.

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Evaluation on the Optimum Grinding of Aspheric Surface Micro Lens for Camera Phone (휴대폰 카메라용 비구면 마이크로 렌즈 최적 연삭가공 평가)

  • Baek Seung-Yub;Lee Eun-Sang
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.2
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    • pp.1-9
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    • 2006
  • As consumers in optics, electronics, aerospace and electronics industry grow, the demand for ultra-precision aspheric surface lens increases higher. To enhance the precision and productivity of ultra precision aspheric surface micro lens, the development of ultra-precision grinding system and process for the aspheric surface micro lens are described. In the work reported in this paper, an ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the ground surface roughness and profile accuracy. This paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. The optimization of grinding conditions on ground surface roughness and profiles accuracy is investigated using the design of experiments.

Trends of Flat Mold Machining Technology with Micro Pattern (미세패턴 평판 금형가공 기술동향)

  • Je, Tae-Jin;Choi, Doo-Sun;Jeon, Eun-Chae;Park, Eun-Suk;Choi, Hwan-Jin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.2
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    • pp.1-6
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    • 2012
  • Recent ultra-precision machining systems have nano-scale resolution, and can machine various shapes of complex structures using five-axis driven modules. These systems are also multi-functional, which can perform various processes such as planing, milling, turning et al. in one system. Micro machining technology using these systems is being developed for machining fine patterns, hybrid patterns and high aspect-ratio patterns on large-area molds with high productivity. These technology is and will be applied continuously to the fields of optics, display, energy, bio, communications and et al. Domestic and foreign trends of micro machining technologies for flat molds were investigated in this study. Especially, we focused on the types and the characteristics of ultra-precision machining systems and application fields of micro patterns machined by the machining system.

Machining of Micro Structure using Elliptical Vibration Grooving Machine (타원궤적 진동절삭 가공기를 이용한 미세 형상 가공)

  • Kim, Gi-Dae;Loh, Byoung-Gook
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.11
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    • pp.45-51
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    • 2008
  • Successive micro-scale V-grooves and a grid of pyramids were machined by elliptical vibration tufting (EVC) to investigate feasibility of using EVC as an alternative method of creating micro-molds to photo-lithography and electroforming, which have been commonly employed. An elliptical vibration grooving machine was developed which consists of two orthogonally-arranged piezoelectric actuators, a diamond cutting tool, and a motorized xyz stage. The micro-scale features were machined on materials of copper, duralumin, nickel, and hastelloy and it was found that EVC significantly reduces cutting resistance and prohibits generation of side burrs and rollover burrs, thus resulting in improving machining qualify of micro-molds in ail experimented workpiece materials.