• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.6
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• pp.591-598
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• 2012

In this study, the cutting characteristics of bulk metallic glass (BMG) cut using a computer numerically controlled (CNC) lathe were investigated for different insert tool materials and cutting speeds. The surface roughness, chip morphology, cutting forces, and tool wear during turning of $Zr_{50}Cu_{40}Al_{10}$ BMG alloy were examined. Four kinds of tool materials were used to cut an 8-mm-diameter BMG. The examination of the surface roughnesses of the BMG specimens machined at each cutting speed showed that the surface roughness became better as the cutting speed increased, and the tool materials also influenced the surface roughness. The chip morphology investigations showed that the unoxidized BMG chips had serrated curled chips with adiabatic shear bands, while the oxidized chips exhibited local melting and tangling rather than the usual spiral-shaped chips. The cutting force induced during machining of the Zr-based BMG was the largest for the TiN-WC tool, followed by the polycrystalline diamond (PCD) tool. The cermet tool exerted the smallest cutting force.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.

• Journal of Astronomy and Space Sciences
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• v.21 no.2
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• pp.141-152
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• 2004

Optics fabrication process for precision space optical parts includes bound abrasive grinding, loose abrasive lapping and polishing. The traditional bound abrasive grinding with bronze bond cupped diamond wheel leaves the machine marks of about $20{mu}m$ rms in height and the subsurface damage of about 1 ${mu}m$ rms in height to be removed by subsequent loose abrasive lapping. We explored an efficient quantitative control of precision CNC grinding. The machining parameters such as grain size, work-piece rotation speed and feed rate were altered while grinding the work-piece surfaces of 20-100 mm in diameter. The input grinding variables and the resulting surface quality data were used to build grinding prediction models using empirical and multi-variable regression analysis. The effectiveness of such grinding prediction models was then examined by running a series of precision CNC grinding operation with a set of controlled input variables and predicted output surface quality indicators. The experiment achieved the predictability down to ${pm}20$ nm in height and the surface roughness down to 36 nm in height. This study contributed to improvement of the process efficiency reaching directly the polishing and figuring process without the need for the loose abrasive lapping stage.