• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.213-216
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• 2001

A micro hole punching system was developed and micro holes of 100m in diameter were successfully made on brass sheets of loom in thickness. A micro punch made of tungsten carbide was designed to withstand the punch load, considering the buckling and the bending moment due to possible misalignment error. The punch was fabricated by the grinding process with diamond wheel. The die was designed considering the punch load and fabricated by micro electrodischarge machining process. In this system the stripper is designed to guide punch tip to minimize the possible misalignment. The punch was installed on a vertical stepper and the die was mounted on an X-Y translation unit. The precision motion controller controlled all motions of the micro hole punching system. In this study technical difficulties and solutions in the micro hole punching process were also discussed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.1
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• pp.80-85
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• 2007

High speed cutting is a machining process which cuts materials with the fast movement and rotation of a spindle in a machine tool. High speed cutting leaves a plastically deformed layer on the machined surface. This deformed layer affects in various forms to the surface roughness of machined parts such as the dimensional instability, the micro crack. The surface roughness is called surface integrity which is very important in precision cutting. This paper aims to study on the machined surfaces characteristics of aluminum alloy and brass by AFM(Atomic force microscope) measurement. The objective is contribution to ultra- precision cutting by exhibit foundation data of surface roughness and tool wear when parts are cutting with diamond tool at the factory.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.987-992
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• 1997

Burrs always come out with the machining of ducterial with small size. Though the size of burrs is small, burrs dominate deterioration of the accuracy of the micro grooves. So the burr generation model especially side burr generation model was investigated to predict the size of the burrs at the given cutting conditions. The side shear plane is introduced to build the burr generation model and the width of side shear plane nomalized with cutting depth is defined with the shear angle. From the theoretical observation, the width of side shear plane can vary up 40% of the cutting depth. To determine the size of burr and stiffness, single groovings were carried out and it was found that there exist a critical depth of cut that the size or stiffness of the burr vary.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.413-414
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.407-408
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• 2006

• Journal of the Korean Society for Precision Engineering
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• v.9 no.3
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• pp.67-72
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• 1992

This paper presents the process of manufacturing technology of ceramics ferrule for opitcal fiber connector. Precision zirconia ceramic ferrules is widely for high performance and low cost single mode optical fiber connectors. To polish the hole of the zirconia ceramic ferrule, the wire lapping instrument is developed and the machining experiment is conducted. Through the centerless grinding using diamond wheel the surface roughness of zirconia ceramics ferrule is below the 1$\mu$m Rmax.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.604-607
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• 2003

This study investigates the micro-cutting of cemented carbides using PCD(polycrystalline diamond) and PCBN(polycrystalline cubic boron nitride) cutting tools are performed with SEM direct observation method. The purpose of this study is to make clear the cutting mechanism of cemented carbides and the fracture of WC particles at the plastic deformation zone in orthogonal micro-cutting. And also to achieve systematic understanding, the effect of machining parameter on chip formation and machined surface was investigated, including cutting speed. depth of cut and various tool rake angle.

• Journal of the Korean Ceramic Society
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• v.49 no.1
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• pp.90-94
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• 2012

This study has been focused on properties of mirror surface grinding technology by ELID(Electrolytic In-process Dressing) for metal matrix ceramic composites using in high precision mirror for optics. The experimental studies have been carried out to get mirror surface by grinding for composites, Al-SiC, Al-graphite and Mg-SiC. Grinding process is carried out with varying abrasive mesh type, depth of cut and feed rate using diamond wheel. The machining result of the surface roughness and condition of ground surface, have been analyzed by use of surface roughness tester and SEM measurement system. ELID grinding technology could be applied successfully for the mirror-surface manufacturing processes in spite of ductility of metal matrix material. As the results of experiments, surface roughness of Al-SiC(45 wt%) has been the most superior in these experimental work-pieces as 0.021 ${\mu}m$ Ra.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.3
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• pp.224-230
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• 2009

FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In the paper, we studied the FIB-Sputtering rate according to mold materials. And surface roughness characteristics had been analysed for micro or nano mold fabrication. Si wafer, Glassy Carbon, STAVAX and DLC that have been normally considered as good micro or nano mold materials were used in the study.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.502-506
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• 1999

Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, so it is important to control the chipping generation in the process of dicing. This paper deals with chipping of the silicon wafer dicing. The relationships between the dicing force and the wafer chipping are investigated. It is confirmed that the wafer chipping increases as the dicing force increases.