• Title/Summary/Keyword: diamond machining

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Wear of Single Crystal Diamond(SCD) Tools in Ultra Precision Turning of Electro-Nickel Plated Drum (전해니켈도금된 대면적 롤금형 가공시 단결정 다이아몬드공구의 마모에 관한 연구)

  • Lee, D.Y.;Hong, S.H.;Kang, H.C.;Choi, H.Z.;Lee, S.W.
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.7
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    • pp.621-628
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    • 2009
  • Nickel-phosphorus alloys are attractive materials for diamond turning applications such as fabrication of large optics and other high precision parts. It is also well-known that the higher phosphorus content of the alloys minimizes the diamond tool wear. Due to the weakness of electoless nickel plating that the phosphorus contents is limited to 13-14% (wgt), increased attention has been paid at electro-nickel plating which enables the alloys with 15-16% phosphorus. In this study, experiments were carried out to observe the wear characteristic of single crystal diamond tools in micro-grooving of electro-nickel plated drums. The experiments shows that long distance (50km) machining of micro-grooving on electro-nickel plated drum is possible with a single crystal diamond tool without any significant tool wear and defective machined surface.

Fabrication of Micro Diamond Tip Cantilever for AFM and its Applications (AFM 부착형 초미세 다이아몬드 팁 켄틸레버의 제작 및 응용)

  • Park J.W.;Lee D.W.
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2005.05a
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    • pp.395-400
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    • 2005
  • Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin damaged layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The damaged layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

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Fabrication of Micro Diamond Tip Cantilever for AFM-based Tribo-Nanolithography (AFM 기반 Tribo-Nanolithography 를 위한 초미세 다이아몬드 팁 켄틸레버의 제작)

  • Park Jeong-Woo;Lee Deug-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.8 s.185
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    • pp.39-46
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    • 2006
  • Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin mask layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The mask layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

Characterization of the Chemical Mechanical Micro Machining for Single Crystal Silicon (실리콘의 화학기계적 미세가공 특성)

  • Jeong, Sang-Cheol;Park, Jun-Min;Lee, Hyeon-U;Jeong, Hae-Do
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.1
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    • pp.186-195
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    • 2002
  • The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.

A Study on the Precision Machining Characteristics in Heavy Cutting of Al-alloy (Al합금의 중절삭시 정밀가공 특성에 관한 연구)

  • 권용기;김동현
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.10a
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    • pp.203-208
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    • 2002
  • This paper deals with turning experiments of aluminium alloy using a single crystal diamond with round cutting edge. A face cutting was conducted using a special precision machine to study the characteristic phenomena in heavy cutting of aluminium alloy. In many cases, one of the most important matter on the surface integrity is about a damaged layer remaining just under the surface after machining. A machined surface roughness can be improved at a small geometrical surface roughness under special cutting conditions, even if a steady vibration exists between a tool and a workpiece.

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Cutting Force Prediction in Single Point Diamond Turning (정밀 선삭 가공 과정의 절삭력 예측모델)

  • 윤영식
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.6
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    • pp.1456-1464
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    • 1993
  • The achievable machining accuracy depends upon the level of the micro-engineering, and the dimensional tolerances in the order of 10 nm and surface roughness in the order of 1 nm are the accuracy targets to achieved today. Such requirements cannot be satisfied by the conventional machining processes. Single point diamond turning is one of the new techniques which can produce the parts with such accuracy limits. The aims of this thesis are to get a better understanding of the complex cutting forces. A cutting model for describing the influence of cutting conditions (cutting speed, feedrate and depth of cut), material properties of the workpiece and tool geometry has been proposed after estimating the two cutting force models-the Recht model and the Dautzenberg model. The experiments with Al-alloy workpieces, which have been carried out in order to estimate the models, show that the proposed model in this thesis is better than the two models. As the depth of cut and feedrate are increased in the operations settings (depth of cut 8-100$\mu{m}$, feedrate 8-140$\mu{m}$/rev, and cutting speed 8 m/sec), the relation of dimensionless cutting forces from experiments are similar to the proposed model. With the undeformed chip area of $30-80{\times}10^{2}$\mu{m}^2$, the experimental cutting forces accord with the force prediction.