• Journal of the Korean institute of surface engineering
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• v.46 no.5
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• pp.216-222
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• 2013

In order to improve the performance of electrodeposited diamond-nickel composite, surface modification of diamond particles was carried out using powder immersion reaction assisted coating (PIRAC). Titanium and chromium were selected as coating elements, which are known as carbide former. With respect to the powder elements, various phases were formed on diamond; metallic Ti and TiC for Ti powder, $Cr_3C_2$ for Cr powder, and TiC and $Cr_3C_2$ for Ti-Cr mixed powder. Surface modified diamond particle showed higher specific surface area, especially Ti coating induced considerable increase of specific surface area. The increase of specific surface area suggests increase of surface roughness, and that was confirmed by surface observation using FE-SEM. In addition, wear properties of diamond-nickel composite including surface modified diamonds were improved, and Ti coated diamond showed the highest performance. The wear property of diamond-nickel composite is dependent on adhesion strength between diamond particle and nickel layer. Therefore, surface modification of diamond particle by PIRAC increasing surface roughness is effective to improve the properties of diamond-nickel composite.

• Nuclear Engineering and Technology
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• v.54 no.3
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• pp.975-983
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• 2022

A four-layered W/Cu functionally graded material (FGM) (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W60% + Cu40%, wt.% fraction) and a four-layered diamond/W-Cu FGM (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W55% + Cu40% + diamond5%, wt.% fraction) were fabricated by microwave sintering. The thermal conductivity and thermal shock resistance of diamond/W-Cu FGM and W-Cu FGM were investigated. The morphologies of the diamond particles and different FGMs were analyzed using AFM, SEM, EDS, and TEM. The results show that a 200 nm rough tungsten coating was formed on the surface of the diamond. The density of the tungsten-coated diamond/W-Cu FGM, obtained by microwave sintering at 1200 ℃ for 30 min, was 94.66%. The thermal conductivity of the fourlayered diamond/W-Cu FGM was 220 W·m^-1·K^-1, which is higher than that of the four-layered W/Cu FGM (209 W m^-1 K^-1). This indicates that adding an appropriate amount of tungsten-coated diamond to the high Cu layer W/Cu FGM improves the thermal conductivity of the composite. The diamond/W-Cu FGM sintered at 1200 ℃ for 10 min exhibited better thermal shock resistance than diamond/W-Cu FGM sintered at 1100 ℃ for 10 min.

• Journal of Korea Foundry Society
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• v.12 no.4
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• pp.317-325
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• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.1
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• pp.26-33
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• 2016

In this study, a new method to develop a fixed diamond wire for silicon wafer machining by the multi-wire cutting method was developed. The new twist diamond wire has improved performance with high breaking strength and chip flutes structure. According to these characteristics, the new twist diamond wire can be used in the higher speed multi-wire cutting process with a long lifetime. Except the design of the new structure, the twist diamond wire is coating by electroless-electroplating process. It is good for reducing breakage and the falling-off of diamond grains. Based on the silicon material removal mechanism and performance of the wire-cutting machine, the optimal processing condition of the new twist diamond wire has been derived via mathematical analysis. At last, through the tensile testing and the machining experiments, the performance of the twist diamond wire has been obtained to achieve the development goals and exceed the single diamond wire.

• Journal of the Korean Society for Heat Treatment
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• v.30 no.5
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• pp.222-226
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• 2017

Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.

• The Korean Journal of Ceramics
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• v.3 no.1
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• pp.5-12
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• 1997

Charged carbon clusters which are formed by the gas activation are suggested to be responsible for the formation of the metastable diamond film. The number of carbon atoms in the cluster that can reverse the stability between diamond and graphite by the capillary effect increases sensitively with increasing the surface energy ratio of graphite to diamond. The gas activation process produces charges such as electrons and ions, which are energetically the strong heterogeneous nucleation sites for the supersaturated carbon vapor, leading to the formation of the charged clusters. Once the carbon clusters are charged, the surface energy of diamond can be reduced by the electrical double layer while that of graphite cannot because diamond is dielectric and graphite is conducting. The unusual phenomena observed in the chemical vapor deposition diamond process can be successfully approached by the charged cluster model. These phenomena include the diamond deposition with the simultaneous graphite etching, which is known as the thermodynamic paradox and the preferential formation of diamond on the convex edge, which is against the well-established concept of the heterogeneous nucleation.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.127-132
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• 2006

The present study deals with polishing machining of diamond for jewelry using developed automatic polishing machine that can cut diamond to have 58 facets in a brilliant cutting which has been hardly achieved by a conventional manually operating polishing machine. Upon the 3-dimensional Sarin M/C test and analysis on the machined diamond by the developed automatic polishing machine its proportion and finishing turned out to be better than the machined diamond by the conventional manually operating polishing machine.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.185-188
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• 2002

An abrasive vitreous bonded solid mass having a vitrified abrasive structure comprising diamond grains which are held by an in inorganic bonding agent, the vitrified diamond wheel is impregnated with a composition which comprises a thermosetting synthetic resin and a surfactant. The vitrified diamond wheel is manufactured by preparing the composition including the resin and the surfactant, impregnating the abrasive structure with the composition, and curing the composition. The diamond wheel newly developed showed excellent performance in grinding carbide.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1503-1505
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• 2000

To grow the diamond films by using RF-MW mix-process, at first, diamond seeds were deposited on silicon substrate by RF plasma CVD, and then a diamond layer grown by MW plasma CVD on the seeds. The grain-size of diamond films deposited by using HF-MW mix-process was smaller and denser than those of the MW plasma CVD process. The deposited diamond films were analyzed by scanning electron microscophy, X-ray diffractometer and Raman spectroscopy.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.2
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• pp.102-111
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• 1997

This paper deals with the machinability based on turning of WC-Co allows with the coated and the sintered diamond tools. The main conclusions obtained are as follows. (1) When machining WC-10%Co alloy, the flank wear of sintered diamond tool increases more largely with the increase of cutting speed in comparison with coated diamond tool. The tool wear decreases with the increase of the grain size and nose radius of sintered diamond tool. (2) When machining WC-20%Co alloy, the tool wear and cutting force decrease with the decrease of rake angle. Their exists a certain cutting speed range to exhibit the smallest tool wear in machining the WC-20%Co alloy, and this critical cutting speed becomes higher by 2 times in the case of coated diamond tool compared with sintered diamond tool. (3) The machinability becomes better with the increase of Co content. The effects of cutting speed and feed rate on the roughness of machined surface become smaller with the increase of Co content.