• Progress in Superconductivity and Cryogenics
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• v.6 no.3
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• pp.6-11
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• 2004

YBa$_2$Cu$_3$$O_{7-x}$ (YBCO) films were deposited on MgO(100) and SrTiO$_3$(100) single crystal substrates by cold-wall type MOCVD method using continuous source supplying system. Under the deposition temperature of 740∼76$0^{\circ}C$, c-axis oriented YBCO films were obtained. In case of the YBCO films deposited on MgO (100) single crystal substrate, the critical temperature (T$_{c}$) was under 81 K regardless of the deposition conditions, whereas T$_{c}$ of the YBCO films deposited on SrTiO$_3$(100) single crystal substrate was 83∼84 K. The critical current (I$_{c}$) of the YBCO film deposited on SrTiO$_3$(100) single crystal substrate for 30 min was 49 A/cm-width and the critical current density (J$_{c}$) was 0.82 MA/$\textrm{cm}^2$ to film thickness of 0.6 ${\mu}{\textrm}{m}$. I$_{c}$ increased to 84.4 A/cm-width as the deposition time increased to 50 min, but J$_{c}$ decreased to 0.53 MA/$\textrm{cm}^2$ to film thickness of 1.8 ${\mu}{\textrm}{m}$.rm}{m}$.

• Journal of Electrical Engineering and Technology
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• v.1 no.1
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• pp.110-113
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• 2006

A high rate deposition sputtering process of magnesium oxide thin film in oxide mode has been developed using a 20 kW unipolar pulsed power supply. The power supply was operated at a maximum constant voltage of 500 V and a constant current of 40 A. The pulse repetition rate and the duty were changed in the ranges of $10\sim50$ kHz and $10\sim60%$, respectively. The deposition rate increased with rising incident power to the target. Maximum incident power to the magnesium target was obtained by the control of frequency, duty and current. The deposition rate of a moving state was 9 nm m/min at the average power of 1.5 kW. This result shows higher deposition rate than any other previous work involving reactive sputtering in oxide mode. The thickness uniformities over the entire substrate area of $982mm{\times}563mm$ were observed at the processing pressure of $2.8\sim9.5$ mTorr. The thickness distribution was improved at lower pressure. This technique is proposed for application to a high through-put sputtering system for plasma display panels.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.5
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• pp.1624-1638
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• 1996

A study of thermophoretic particle deposition has been carried out for a particle laden stagnation flow considering the effect of radiative heat transfer. Energy, concentration and radiative transfer equations are all coupled and have been solved iteratively assuming that absorption and scattering coefficients were proportional to the local concentration of particles. Radiative heat transfer was shown to strongly affect the profiles of temperature and particle concentration. e. g., radiation increases the thickness of thermal boundary layer and wall temperature gradients significantly. As the wall temperature gradients increase, the particle concentration at the wall decreases due to thermophoretic particle transport. The deposition rate that is thermophoretic velocity times particle concentration at the wall decreases as the effects of radiation increases. The effects of optical thickness, conduction to radiation parameter and wall emissivity have been determined. The effects of anisotropic scattering are shown as insignificant.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.8
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• pp.319-324
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• 2003

AIN thin films are deposited on Si (100) and $SiO_2$/Si substrates by using an RF magnetron sputtering method and by changing the conditions of deposition variables, such as RF power, $N_2$/Ar flow ratio, and substrate temperature ($T_sub$). For all the deposited AIN films, XRD Peak patterns are monitored to examine the effect of deposition condition on the crystal orientation. Highly (002)-oriented AIN films are obtained at following nominal deposition conditions; RF Power : 350W, $N_2$/Ar ratio = 10/20, T$_{sub}$ : $250^{\circ}C$, and working pressure = 5mTorr, respectively. AIN-based SAW devices are fabricated using a lift-off method by varying the thickness of AIN layer. Insertion losses and side-lobe rejection levels of fabricated SAW devices are extracted from their frequency response characteristics, which are also compared in terms of AIN thickness and substrate. Relationships between the film properties of AIN films and the frequency responses of SAW devices are discussed. It is concluded from the experimental results that the (002)-preferred orientation as well as the surface roughness of AIN film may play a crucial role of determining the device performances of AIN-SAW devices.s.

• Korean Journal of Materials Research
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• v.29 no.11
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• pp.715-719
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• 2019

Molybdenum is a low-resistivity transition metal that can be applied to silicon devices using Si-metal electrode structures and thin film solar cell electrodes. We investigate the deposition of metal Mo thin film by plasma-enhanced atomic layer deposition (PE-ALD). $Mo(CO)_6$ and $H_2$ plasma are used as precursor. $H_2$ plasma is induced between ALD cycles for reduction of $Mo(CO)_6$ and Mo film is deposited on Si substrate at $300^{\circ}C$. Through variation of PE-ALD conditions such as precursor pulse time, plasma pulse time and plasma power, we find that these conditions result in low resistivity. The resistivity is affected by Mo pulse time. We can find the reason through analyzing XPS data according to Mo pulse time. The thickness uniformity is affected by plasma power. The lowest resistivity is $176{\mu}{\Omega}{\cdot}cm$ at $Mo(CO)_6$ pulse time 3s. The thickness uniformity of metal Mo thin film deposited by PE-ALD shows a value of less than 3% below the plasma power of 200 W.

• Journal of Powder Materials
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• v.29 no.1
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• pp.8-13
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• 2022

In this study, we have prepared a Ti-6Al-4V/V/17-4 PH composite structure via a direct energy deposition process, and analyzed the interfaces using scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The joint interfaces comprise two zones, one being a mixed zone in which V and 17-4PH are partially mixed and another being a fusion zone in the 17-4PH region which consists of Fe+FeV. It is observed that the power of the laser used in the deposition process affects the thickness of the mixed zone. When a 210 W laser is used, the thickness of the mixed zone is wider than that obtained using a 150 W laser, and the interface resembles a serrated shape. Moreover, irrespective of the laser power used, the expected σ phase is found to be absent in the V/17-4 PH stainless steel joint; however, many VN precipitates are observed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.419-419
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• 2012

We fabricated the Polyamide 4,6 (PA46) thin film using Adipoyl chloride and 1,4-butadiamine. PA46 film was grown at $70^{\circ}C$ by Molecular Layer Deposition (MLD) method. MLD is sequential and self-terminating fabrication method for organic thin film. The growth rate of PA46 is $3.5{\acute{\AA}}$ cycle. The thickness of PA46 film was measured by Ellipsometer. Surface morphology of this film was investigated by Atomic Force Microscopy (AFM) and roughness is directly proportional to number of growing cycles.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.415.1-415.1
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• 2016

2009년도에 Perovskite가 태양전지에 처음 적용된 이후, Perovskite를 기반으로 하는 태양전지는 급속한 발전을 이루고 있으나, 향후 상용화를 위해서는 추가적인 공정개선 및 제조 단가를 낮추는 노력이 필수적이다. 초창기 Perovskite의 증착 공정은 One step deposition 방법이 사용되었으나, Layer의 thickness, uniformity 등을 조절하기 어려워 Sequential deposition 방법으로 개선되었다. 하지만 결과적으로 초기방법 대비 추가공정이 발생함에 따라 시간 및 비용의 증가가 불가피하였다. 제조단가 측면에서는 Perovskite 태양전지를 구성하는 재료 중 HTM(정공수송물질)을 구성하는 Spiro-MeOTAD의 비용이 가장 비싸다. 따라서 저비용 태양전지를 위해서는 HTM이 없는 구조가 필요하다. 이 페이퍼에서는 Perovskite 물질이 고흡광 능력 외에 충분한 전하수송능력을 보유한다는 점에 착안하여, Gas Pressure Assisted Modified One Step Deposition을 이용한 HTM Free Perovskite를 제작하고 기존의 Sequential Deposition Method 통해 만들어진 Perovskite 태양전지와 비교/분석하였다.

• Transactions on Electrical and Electronic Materials
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• v.8 no.4
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• pp.153-156
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• 2007

Structural and electrical properties of the fully crystallized-bismuth magnesium niobate ($Bi_2Mg_{2/3}Nb_{4/3}O_7$, BMN) films with 15 mol% excess bismuth deposited on Pt bottom electrode by pulsed laser deposition are characterized for various deposition temperatures. The BMN films were crystallized with a monoclinic structure from $300^{\circ}C$ and the surface roughness slightly decreases with increasing deposition temperature. The capacitance density of the films increases with increasing deposition temperature and especially, films deposited at $400^{\circ}C$ exhibit a capacitance density of approximately $620nF/cm^2$. The crystallized BMN films with approximately 170 nm thickness exhibit breakdown strength above 600 kV/cm (${\leq}10V$) irrespective of deposition temperature and a leakage current density of approximately $2{\times}10^{-8}A/cm^2$ at 590kV/cm (at 10 V).

• 전기의세계
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• v.28 no.9
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• pp.43-50
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• 1979

Silicon nitride films were chemically deposited on silicon substrates by reacting SiCl$_{4}$ and NH$_{3}$ in a nitrogen atmosphere at 700~1100 .deg.C. The deposition rate increased rapidly with deposition temperature upto about 1000 .deg.C, and became less temperature dependent above this temperature. The etch rate of films in buffered HF solution decreased, with an increase of deposition temperature, and a heat treatment at a temperature higher than that of the deposition considerably reduced the etch rate. It indicates that the heat treatment resulted in a densification of the films. Surface charge density of 3~4 * 10$^{11}$ /cm$^{2}$ was determined from the C-V characteristics of MNS diode, and it was also found that surface charge density depended on deposition temperature, but not film thickness. The current-voltage characteristics displayed a logI-V$^{1}$2/ dependence in the temperature range of 300~500.deg.K. Measurement of the slope of this characteristics and its dependence on temperature and bias polarity suggest that conduction in sili con nitride films arises from the Poole-Frenkel mechanism.