• Title/Summary/Keyword: deposition condition

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The influence of crystalline direction of substrate and depostion conditions on the orientation of diamond films (기판의 결정 방향 및 증착 변수가 다이아몬드 박막의 배향성에 미치는 영향)

  • Lee, Tae-Hoon;Seo, Soo-Hyung;Park, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1542-1545
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    • 2002
  • Experimental works were performed to implement the hetero-epitaxial growth of diamond films on the (100)- and (111)-oriented Si substrates. The deposition process used to prepare diamond films consisted of a bias-enhanced nucleation(BEN) step, accompanied with a growth step using a microwave plasma CVD system. The highly oriented diamond films were deposited under the growth condition of relatively low methane concentrations and high temperatures. Material properties and surface morphologies of deposited diamond films were improved by the addition of carburization step into the deposition process.

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Tribolgical Characteristics of DLC Film using Substrates with Varying Hardness

  • Park, Jae-Hong;Jang, Beom-Taek;Kim, Seock-Sam
    • KSTLE International Journal
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    • v.9 no.1_2
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    • pp.31-35
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    • 2008
  • DLC (Diamond Like Carbon) films have predominant tribological properties like a high hardness, low friction and high chemical resistance; therefore, DLC films are applied in a wide range of industrial fields. This paper evaluated the characteristics of DLC films deposited on bearing steel with different hardness by RF-PECVD (Radio Frequency - Plasma Enhanced Chemical Vapor Deposition) method. Si-interlayer was deposited on bearing steel to improve adhesion strength by RF-Sputtering method. The DLC film structures were analyzed with Raman spectra and Gaussian function. Adhesion strength of DLC films was measured with a scratch tester. Friction and wear test were carried out with a ball-on -disc type to investigate the tribological characteristics. Experimental results showed that DLC films deposited on bearing steel under same deposition condition have typical structure DLC films regardless of hardness of bearing steel. Adhesion strength of DLC film is increased with a hardness of bearing steel. Friction coefficient of DLC film showed lower at the high hardness of bearing steel.

Fabrication of Ultra-smooth 10 nm Silver Films without Wetting Layer

  • Devaraj, Vasanthan;Lee, Jongmin;Baek, Jongseo;Lee, Donghan
    • Applied Science and Convergence Technology
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    • v.25 no.2
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    • pp.32-35
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    • 2016
  • Using conventional deposition techniques, we demonstrate a method to fabricate ultra-smooth 10 nm silver films without using a wetting layer or co-depositing another material. The argon working pressure plays a crucial role in achieving an excellent surface flatness for silver films deposited by DC magnetron sputtering on an InP substrate. The formation of ultra-smooth silver thin films is very sensitive to the argon pressure. At the optimum deposition condition, a uniform silver film with an rms surface roughness of 0.81 nm has been achieved.

Numerical Simulation of Particle Deposition Pattern on Cylindrical Fiber under External Electrical Field (외부 전기장내의 단일 섬유에 대한 먼지층 형사 수치 모사)

  • 박현설;정용원;박영옥;이규원
    • Journal of Korean Society for Atmospheric Environment
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    • v.15 no.1
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    • pp.41-51
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    • 1999
  • In this study, the two dimensional morphology of particle accumulates on a cylindrical fiber was numerically simulated when a uniform external electric field was present across a cylindrical fiber. In order to investigate the mechanism of linear dendrite formation which is observed under the above electrostatic condition, the electrostatic forces between a newly introduced particle and each deposited particle were calculated and compared with those between the particle and fiber As a result of this study it was found that dielectrophoretic forces between the oncoming particle and fiber play principal roles in linear dendrite formation.

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A study on the structural properties of BaTiO$_3$thin films with sputtering condition (sputtering 조건에 따른 BaTiO$_3$박막의 구조적 특성에 관한 연구)

  • 이문기;류기원;배선기;이영희
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.11a
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    • pp.183-186
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    • 1996
  • BaTiO$_3$thin films were deposited on Pt/SiO$_2$/Si substrates by RF sputtering technique. The structural and crystallographic properties were studied with deposition conditions and annealing temperatures. Deposition rates and structural properties of BaTiO$_3$thin films were investigated by the SEM, XRD and AFM. The thickness of BaTiO$_3$thin films deposited with optimized conditions was 5200[$\AA$]. The grain size was found to increase remarkably with increasing sputtering power and independent on the sputtering pressure.

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High-Efficiency ITO/Se Solar Cells (Se 태양전지(太陽電池)의 고효율화(高效率化)에 관한 연구(硏究))

  • Kim, Tae-Seoung
    • Solar Energy
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    • v.7 no.2
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    • pp.7-13
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    • 1987
  • Indium-Tin-Oxide (ITO)/Selenium heterojunction solar cells which fabricated by vacuum deposition technique and annealing process has been investigated. Prior to the Selenium deposition, a thin tellurium layer (about $10{\AA}$) was deposited onto the ITO layers to provide a sufficient mechanical bond between the Oxide and Selenium layers. The amorphous Selenium layer was deposited onto the Te-ITO layers, and then the crystallization of the amorphous Selenium was carried out using a hot plate at about $180^{\circ}C$ for 4 min. Efficient Selenium solar cells with conversion efficiency as high as 4.52% under AM1 condition has been fabricated in polycrystalline Selenium layer ($6{\mu}m$). The optimum data in manufacturing Se solar cell was listed in table.

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A Study on the Formation of Interface and the Thin Film Microstructure in TiN Deposited by Ion Plating (이온플레팅에 의한 TiN 증착중 계면형성과 박막 미소조직에 관한 연구)

  • 여종석;이종민;한봉희
    • Journal of the Korean institute of surface engineering
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    • v.24 no.2
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    • pp.73-79
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    • 1991
  • Recent studies son surface coatings have shown that the change of physical, chemical and crystallographic structure analysed and observed according to the deposition process variables has the effects on the resultant film properties. Under the same preparation condition conditions of the substrate and process variables, physical morphology variations characterized by substrate temperature and bias which offect the surface mobility of adatom and adhesion variations related to the formation of Ti interlayer were considered in the present study. Microhardness showed the highest value around 40$0^{\circ}C$ of the substrate temperature and increased with the substrate bias. Adhesion was improved with the increase of substrate temperature and bias. An interlayer of pure titanium formed prior to deposition of TiN improves the adhesion at its optimum thickness. These results were explained by the change of physical morphology and phase analysis.

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Deposition Technology of Copper Thin Films for Multi-level Metallizations (다층배선을 위한 구리박막 형성기술)

  • 조남인
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.3
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    • pp.1-6
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    • 2002
  • A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $130^{\circ}C$ and $250^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5 \times10^{-6}$ Torr vacuum condition and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.0 $\mu \Omega \cdot \textrm{cm}$ was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nano-structures of the copper grains, but more depended on the contamination of the copper films.

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Displacement Current Characteristics of DMPC Lipid Monolayer (DMPC 인지질 단분자막의 변위전류 특성)

  • Choi, Yong-Sung;Sang, Jin-Won;Lee, Kyung-Sup
    • Proceedings of the KIEE Conference
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    • 2006.10a
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    • pp.12-13
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    • 2006
  • The physical properties of DMPC monolayer were made for dielectric relaxation phenomena by the detection of the surface pressures and displacements current. The current was measured after the electric bias across the manufactured MIM device. It is found that the phospolipid monolayer of dielectric relaxation takes a little time and depend on the molecular area. When electric bias is applied across the manufactured MIM device by the deposition condition of phospolipid mono-layer, it wasn't breakdown when the higher electric field to impress by increase of deposition layers.

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Preparation of Crack-free YBCO Films by EPD on Silver

  • Soh, Dea-wha;Li, Young-mae;Korobova N.;Park, Sung-Jai
    • Journal of information and communication convergence engineering
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    • v.1 no.1
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    • pp.27-30
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    • 2003
  • Electrophoretic deposition (EPD) of alcohol YBCO suspensions on the Ag wire electrode is studied. Poly(ethylene glycol) was coordinated to a structure formed by the EPD process with YBCO particles. The suspension is characterized in terms of zeta potential and conductivity. The d.c electric fields of 200-300 V/cm are applied for 1-10 min. The optimal condition for the EPD allows modifying the properties and microstructure of the deposited films. Superconducting coatings with nanometer-sized pores and a preferred orientation along the c-axis were prepared from the result with chemically modified precursor solution. In contrast, YBCO coatings of submicrometer-sized pores and randomly orientated grains were prepared from the solution without PEG.