• 제목/요약/키워드: deposition condition

검색결과 990건 처리시간 0.033초

저압 화학 기상 증착법으로 제작한 다결정 실리콘의 표면 형태 및 결정 성장 (Surface Morphology and Grain Growth of LPCVD Polycrystalline Silicon)

  • 이은구;박진성;이재갑
    • 한국재료학회지
    • /
    • 제5권2호
    • /
    • pp.197-202
    • /
    • 1995
  • 저압 화학 기상증착법으로 제작한 비정질 실리콘의 표면 형태 및 결정 성장 과정을 증착조건과 열처리 조건의 변화에 따라 조사하였다. 비정질에서 결정으로 변화하는 전이온도인 570~$590^{\circ}C$에서 증착한 시편은 (311)조직의 거친 표면으로 성장하였다. 같은 증착 온도에서 두께가 두꺼울수록 다결정에서 비정질로 변화하였다. 증착하는 과정에서의 결정화는 기판에서부터 시작되지만, 진공상태를 그대로 유지하고 비정질 실리콘을 전이온도에서 열처리하면 표면 실리콘 원자가 이동하여 결정화하였다.

  • PDF

$Si_2H_6$$H_2$ 가스를 이용한 LPCVD내에서의 선택적 Si 에피텍시 성장에 미치는 산소의 영향 (The effects of oxygen on selective Si epitaxial growth using disilane ane hydrogen gas in low pressure chemical vapor deposition)

  • 손용훈;박성계;김상훈;이웅렬;남승의;김형준
    • 한국진공학회지
    • /
    • 제11권1호
    • /
    • pp.16-21
    • /
    • 2002
  • $Si_2H_6$가스를 이용한 LPCVD내에서의 실리콘의 선택적 에피텍시 성장을 $1000^{\circ}C$ 이하의 초청정 분위기하의 저온에서 수행하였다. HCI 첨가없이 초청정 공정으로 인한 양질의 에피텍시 Si층이 균일하게 얻어 졌으며, $SiO_2$위에 증착된 실리콘의 잠복기를 발견할 수 있었다. 단결정위의 에피텍시 층은 산화물 층위 보다 더 두껍게 증착되었다. 산소첨가로 잠복기가 20~30초간 증가하였다. 증착된 박막의 절단면과 표면 형상은 SEM으로 관찰되었으며, XRD를 통해 막질을 평가하였다.

Se, As 및 Te를 이용한 고감도 다층 광도전막의 제작 및 그 응용 (Fabrication of High Sensitive Photoconductive Multilayer Using Se,As and Te and its Application)

  • 박기철;이건일;김기완
    • 대한전자공학회논문지
    • /
    • 제25권4호
    • /
    • pp.422-429
    • /
    • 1988
  • The photoconductive multilayer of Se-As(hole blocking layer)/Se-As-Te (photoconductive layer) /Se-As (layer for supporiting hole transport)/Se-As(layer or controlling total capacitance)/Sb2S3(electron blocking layer) was fabricated and its electrical and optical properties were investigated. The photoconductive multilayer is made of evaporated a-Se as the base material, doped with As and Te to prevent the crystallization of a-Se and to enhance red sensitivity, respectively. The multilayer with good image reproducibility has the following deposition condition. The first layer has the thickness of 250\ulcornerat the deposition rate of 250\ulcornersec. The second layer has the thickness of 800\ulcornerat the deposition rate of 250\ulcornersec. The third layer has the thickness of 125\ulcornerat the deposition rate of 250\ulcornersec. The fourth layer has the thickness of 1700\ulcornerunder the Ar gas ambient of 50x10**-3torr. The image pick-up tube, employing this multilayer demonstrates the following characteristics. The photosensitivity is 0.8, the resolution limit is above 300TV line, and the decay lag is about 7%. And spectral response convers the whole visible range. Therfore the application to color TV camera is expected.

  • PDF

RF 마그네트론 스퍼터링법을 이응한 ZnO 박막 증착에 판한 연구 (Deposition of ZnO thin films by RF magnetron sputtering)

  • 강창석;김영진
    • 한국결정학회지
    • /
    • 제2권2호
    • /
    • pp.1-6
    • /
    • 1991
  • RF 마그네트론 스퍼터링법을 이용하여 ZnO 박 막을 실리콘 기판과 Corning 7059유리 기판위에 증착시켜 증착변수에 따른 ZnO 박막의 구조적, 전기적, 광학적 특성을 분석하였다. 1 전력을 증가시킴에 따라 c축 배향성이 뛰어난 ZnO 박막을 얻을 수 있었으며, 2가 34.4인 피크의 X·ray rocking curve표준 편차 값은 6.8-7.2˚사이에 있었다. 유리 기판위에 증착된 ZnO 박막은 가시광선 영역에서 실험조건에 관계없이 80% 이상의 높은 투광도를 갖고 있었다. ZnO박막의 비저항 값은 증착 변수인 rf전력과 Ar압력에 의해 심한 영향을 받고 있었으며 3×102-2×109 Ω·cm의 비저항 영역을 갖고 있었다.

  • PDF

무전해 니켈 도금액 제조와 복합제에 따른 도금 특성 (Preparation of nickel Plating solution and the characteristics of deposition with complexents)

  • 정승준;박종은;손원근;박수길
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
    • /
    • pp.909-911
    • /
    • 1999
  • Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

  • PDF

다양한 증착변수에 따른 AIN 박막의 물성 및 SAW 소자의 특성 분석 (Effects of Deposition Conditions on Properties of AIN Films and Characteristics of AIN-SAW Devices)

  • 정준필;이명호;이진복;박진석
    • 대한전기학회논문지:전기물성ㆍ응용부문C
    • /
    • 제52권8호
    • /
    • pp.319-324
    • /
    • 2003
  • AIN thin films are deposited on Si (100) and $SiO_2$/Si substrates by using an RF magnetron sputtering method and by changing the conditions of deposition variables, such as RF power, $N_2$/Ar flow ratio, and substrate temperature ($T_sub$). For all the deposited AIN films, XRD Peak patterns are monitored to examine the effect of deposition condition on the crystal orientation. Highly (002)-oriented AIN films are obtained at following nominal deposition conditions; RF Power : 350W, $N_2$/Ar ratio = 10/20, T$_{sub}$ : $250^{\circ}C$, and working pressure = 5mTorr, respectively. AIN-based SAW devices are fabricated using a lift-off method by varying the thickness of AIN layer. Insertion losses and side-lobe rejection levels of fabricated SAW devices are extracted from their frequency response characteristics, which are also compared in terms of AIN thickness and substrate. Relationships between the film properties of AIN films and the frequency responses of SAW devices are discussed. It is concluded from the experimental results that the (002)-preferred orientation as well as the surface roughness of AIN film may play a crucial role of determining the device performances of AIN-SAW devices.s.

직교배열표를 쓴 remote-PECVD 산화막형성의 공정최적화 및 특성 (Optimization of remote plasma enhanced chemical vapor deposition oxide deposition process using orthogonal array table and properties)

  • 김광호;김제덕;유병곤;구진근;김진근
    • E2M - 전기 전자와 첨단 소재
    • /
    • 제8권2호
    • /
    • pp.171-175
    • /
    • 1995
  • Optimum condition of remote plasma enhanced chemical vapor deposition using orthogonal array method was chosen. Characteristics of oxide films deposited by RPECVD with SiH$_{4}$ and N$_{2}$O gases were investigated. Etching rate of the optimized SiO$_{2}$ films in P-etchant was about 6[A/s] that was almost the same as that the high temperature thermal oxide. The films showed high dielectric breakdown field of more than 7[MV/cm] and a resistivity of 8*10$^{13}$ [.ohmcm] around at 7[MV/cm]. The interface trap density of SiO$_{2}$/Si interface around the midgap derived from the high frequency C-V curve was about 5*10$^{10}$ [/cm$^{2}$eV]. It was observed that the dielectric constant of the optimized SiO$_{2}$ film was 4.29.

  • PDF

Effect of Sulfurization on CIGS Thin Films by RF Magnetron Sputtering Using a Cu(In1-xGax)Se2 Single Target

  • Jung, Sung Hee;Chung, Chee Won
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
    • /
    • pp.675-675
    • /
    • 2013
  • CIGS thin films have received a great attention as a promising material for solar cells due to their high absorption coefficient, appropriate bandgap, long-term stability, and low cost production. CIGS thin films have been deposited by various methods such as co-evaporation, sputtering, spray pyrolysis and electro-deposition. In this study, Cu(In,Ga)Se2(CIGS) thin films were prepared using a single quaternary target by rf magnetron sputtering. The effect of sulfurization on the structural, compositional and electrical properties of the films was examined in order to develop the deposition process. An optimal sulfurization process will be selected for the preparation of CIGS thin films with good structural, optical and electrical properties by applying various sulfurization processes. In addition, the electrical properties of CIGS thin films were investigated by post-deposition annealing process. The carrier concentration of CIG(SSe) thin films after sulfurization was increased from $10^{14}cm^{-3}$ to $10^{16}cm^{-3}$ and the resistivity was increased from 10 ${\Omega}cm$ to $10^3$ ${\Omega}cm$. It is confirmed that CIG(SSe) thin films prepared at optimal deposition condition have similar atomic ratio to the target value after sulfurization.

  • PDF

승온중 수소 분위기 제어에 의한 선택적 Si 에피텍시 성장 (Selective Si Epitaxial Growth by Control of Hydrogen Atmosphere During Heating-up)

  • 손용훈;박성계;김상훈;남승의;김형준
    • 한국재료학회지
    • /
    • 제12권5호
    • /
    • pp.363-368
    • /
    • 2002
  • we proposed the use of $Si_2H_ 6/H_2$ chemistry for selective silicon epitaxy growth by low-pressure chemical vapor deposition(LPCVD) in the temperature range $600~710^{\circ}C$ under an ultraclean environment. As a result of ultraclean processing, an incubation period of Si deposition only on $SiO_2$ was found, and low temperature epitaxy selective deposition on Si was achieved without addition of HCI. Total gas flow rate and deposition pressure were 16.6sccm and 3.5mtorr, respectively. In this condition, we selectively obtained high-quality epitaxial Si layers of the 350~1050$\AA$ thickness. In older to extend the selectivity, we kept high pressure $H_2$ environment without $Si_2H_6$ gas for few minutes after first incubation period and then we conformed the existence of second incubation period.

Al doped ZnO 박막 증착을 위한 모듈레이티드 펄스 스퍼터링 (Modulated Pulse Power Sputtering Technology for Deposition of Al Doped ZnO Thin Film)

  • 양원균;주정훈
    • 한국표면공학회지
    • /
    • 제45권2호
    • /
    • pp.53-60
    • /
    • 2012
  • Modulated Pulse Power (MPP) magnetron sputtering is a new high-power pulsed magnetron sputtering (HPPMS) technology which overcomes the low deposition rate problem by modulating the pulse voltage shape, amplitude, and the duration. Highly ionized magnetron sputtering can be performed without arcing because it can be controlled as multiple steps of micro pulses within one overall pulse period in the range of 500-3,000 ${\mu}s$. In this study, the various waveforms of discharge voltage and current for micro pulse sets of MPP were investigated to find the possibility of controlling the strongly ionized plasma mode. Enhanced ionization of the sputtered metal atoms was obtained by OES. Large grained columnar structure can be grown by the strongly ionized plasma mode in the AZO deposition using MPP. In the most highly ionized deposition condition, the preferred orientation of (002) plane decreased, and the resistivity, therefore, increased by the plasma damage.