• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2001년도 추계종합학술대회
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• pp.587-591
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• 2001

본 연구에서는 영상 처리를 이용하여 외형적인 칼라 팔레트내의 불량품을 식별하는 실험을 수행하고자 한다. 기본적인 팔레트 자동선별시스템에 대해 기술하며, 각 샘플링된 팔레트에 대해 영상처리기법을 이용한 불순물 검출 알고리듬을 제안하고자 한다. 또한 이를 상용화할 수 있도록 윈도우환경의 비전처리 프로그램을 제시하였다. 끝으로 본 연구에 대한 평가와 앞으로의 연구과제에 대해 기술하고자 한다.

• International Journal of Precision Engineering and Manufacturing
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• 제7권3호
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• pp.18-23
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• 2006

The formation degree of sustain (ITO pattern) determines the quality of a PDP (Plasma Display Panel). Thus, in the present study, we attempt to detect 100% of the defects that are larger than $30{\mu}m$. Currently, the inspection method in the PDP manufacturing process is dependent upon the naked eye or a microscope in off-line mode. In this study, a prototype inspection system for PDP ITO patterned glass is developed. The developed system, which is based on a line-scan mechanism, obtains information on the defects and sorts the defects by type automatically. The developed inspection system adopts a multi-vision method using slit-beam formation for minimum inspection time and the detection algorithm is embodied in the detection ability. Characteristic defects such as pin holes, substances, and protrusions are extracted using the blob analysis method. Defects such as open, short, spots and others are distinguished by the line type inspection algorithm. It was experimentally verified that the developed inspection system can detect defects with reliability of up to 95% in about 60 seconds for the 42-inch PDP panel.

• 제어로봇시스템학회논문지
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• 제21권10호
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• 상하수도학회지
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• 제27권6호
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• pp.731-741
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• 2013

CCTV inspection method has been used in Korea for more than 20 years, but there is no proper assessment system for sewer failure severity that considers the domestic circumstances. This study classified the defects caused by the overburden load of reinforced concrete sewer pipes depending on severity and developed defect code by analyzing the domestic CCTV inspection videos. The defect score was assigned to each defect code, and it was classified into 5 grades for the decision-making of repair and rehabilitation. The result of this study is expected to be useful for domestic CCTV inspectors to assess the sewer condition and helpful for managers to make a decision of repair and rehabilitation.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 D
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• pp.2521-2524
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• 2002

In this paper, We propose an Image processing algorithm for a paper-cup inner defect inspection. First, we devide a cup image to four sections considering the characteristic of a cup and filter noises limit by using the flood-fill algorithm and median filter. Second, to obtain the clearer inspection result of the edge point inner cup, We apply the sharpening convolution filer to the objected inspect the edge points by using the LOG edge detector. Third, executing sub-pixel operation with the orignal image, we find the defect parts in the cup. Finally, denoting the inspected defect parts as rectangular, we recompose the images of the defected ones.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• 제어로봇시스템학회논문지
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• 제19권2호
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• pp.171-176
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• 2013

X-ray cross-sectional image-based inspection technique is one of the most useful methods to inspect the brazing joints of heat exchanger. Through X-ray cross-sectional image acquisition, image processing, and defect inspection, the defects of brazing joints can be detected. This paper presents a method to judge the type of detected defects automatically, and to display them three-dimensionally. The defect type is classified as unconnected defect, void, and so on, based on location, size, and shape information of defect. Three-dimensional display which is realized using OpenGL (Open Graphics Library) will be helpful to understand the overall situation including location, size, shape of the defects in a test object.

• 제어로봇시스템학회논문지
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• 제19권3호
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• pp.256-261
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• 2013

In the steel manufacturing area, researches for defect inspection receive a big attention for quality control. This paper proposes an algorithm to detect a scratch defect on steel billets. This algorithm takes ROIs (Regions of Interest), and extracts 11 features which represent properties of defect on a ROI. SVM (Support Vector Machine) is used to classify defect and normal ROIs. The algorithm classifies a frame image of a Billet as a defect image if there is one or more defect ROIs. In the experiments, the proposed algorithm had reliable classifying accuracy.

• 산업공학
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• 제21권2호
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• pp.151-160
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• 2008

Defect size distribution is a probability density function for the defects that occur on wafers or glasses during semiconductor/LCD fabrication. It is one of the most important information to estimate manufacturing yield using well-known statistical estimation methods. The defects are detected by automatic optical inspection (AOI) facilities. However, the data that is provided from AOI is not accurate due to resolution of AOI and its defect detection mechanism. It causes distortion of defect size distribution and results in wrong estimation of the manufacturing yield. In this paper, I suggest a size conversion method and a maximum likelihood estimator to overcome the vague defect size information of AOI. The methods are verified by the Monte Carlo simulation that is constructed as similar as real situation.

• 국제학술발표논문집
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• The 5th International Conference on Construction Engineering and Project Management
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• pp.7-13
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• 2013

Recently, defect management have been considered as one of the major issues for more large-sized and complicated in domestic construction industry. However, the defect management have not been performed systematically because of special manpower, excessive amount of documents, 2D based inspection work, unclear traditional checklists, complicated work process and difficulty in communicating construction information. Therefore, the construction field manager could not performed the quality inspection and defect management work on time as well as the reliability of recorded quality and defect factors was decreased. The primary objective of this study is develop a Construction Defect Management Application CDMA) using a mobile (smartphone). The application can be sharing a huge information and communication technology based on RFID (Radio-Frequency Identification), BIM (Building Information Modeling) which enables field mangers to efficiently gather the information of defection in construction on-site.