• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.26 no.4
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• pp.263-279
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• 2022

This paper presents an automatic inspection of defects in semiconductor images. We devise a statistical method to find defects on homogeneous background from the observation that it has a log-normal distribution. If computer aided design (CAD) data is available, we use it to construct a signed distance function (SDF) and change the pixel values so that the average of pixel values along the level curve of the SDF is zero, so that the image has a homogeneous background. In the absence of CAD data, we devise a hybrid method consisting of a model-based algorithm and two neural networks. The model-based algorithm uses the first right singular vector to determine whether the image has a linear or complex structure. For an image with a linear structure, we remove the structure using the rank 1 approximation so that it has a homogeneous background. An image with a complex structure is inspected by two neural networks. We provide results of numerical experiments for the proposed methods.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.3416-3422
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• 2014

A shock absorber rod is located in the center of the absorber piston and is responsible for the reciprocating movement portion. If it has surface defects, the damping performance of product will be adversely affected. A rod surface has gloss by heat treatment. Therefore, it is difficult to find a defect, such as dust, imprints, and blowholes. Because a total inspection is achieved by visual inspection by workers, it causes eyestrain and the quality of the product is not constant. In this paper, a machine vision system was developed to find a defect using a line-scan camera. The machine can detect surface defects than 0.3mm. To minimize the occurrence probability of defects on the inspection process, the developed auto inspection system had an automatic feeding system and incorporated a protection system. Through the development of this system, which relies on the operator's visual inspection of the surface of the shock absorber, the Rod inspection system constructed quality inspection standards and standardized tests to ensure improved reliability.

• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1493-1499
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• 2004

This paper describes the speckle shearing interferometry, a non-destructive optical method, for quantitative estimation of void defect and monitoring separation defect inside of a pneumatic tire. Previous shearing interferometry has not supplied quantitative result of inside defect, due to effective factors. In the study, factors related to the details of an inside defect are classified and optimized with pipeline simulator. The size and the shape of defect can be estimated accurately to find a critical point and also is closely related with shearing direction. The technique is applied for quantitative estimation of defects inside of a pneumatic tire. The actual traveling tire is monitored to reveal the cause of separation and the starting points. And also unknown void defects on tread are inspected and the size and shape of defects are estimated which has good agreement with the result of visual inspection.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.7
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• pp.1737-1742
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• 2015

In the industrial field for product inspection needs not only on the surface of the product but also the internal components defect inspection. Generally, optical inspection is mainly used for item inspection from production process. However, this is only to check defect of surface it is difficult to perform inspection of goods internal. To overcome these limitations, Instead of optical device by using the portable X- ray DR image acquisition device system developed to obtain an image in real time at the same time and determine product defects. After obtaining the X- ray image, the inspection product within error range is passed after machine image processing. Also, the results and numbers are stored by users.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.551-552
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.451-452
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.389-390
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• 2007

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.1
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• pp.101-106
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• 2020

This research is related to a development of the ultrasonic detector for an internal defect detection of various assembly part's welding zone. In this research, measurement S/Ws including system's motion control, S/W ultrasonic transmitter/receiver control, defect judgment standard setting, etc. have been designed for ultrasonic detection, and welding defects sample network, etc. were also designed for comparison between products in good condition and defective products. Through this kind of system, automatic detection function can be performed for the depth and the defect location of the assembly parts welding zone, and the system is able to make a judgment of internal defect detection which is used to be performed by an expert in the past.

• Journal of Korea Multimedia Society
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• v.19 no.3
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• pp.633-641
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• 2016

Automatic defect inspection system is composed of the step in the pre-processing, defect candidate detection, and classification. Polarizing films containing various defects should be minimized over-detection for classifying defect blobs. In this paper, we propose a defect detection algorithm using a skewness of histogram for minimizing over-detection. In order to detect up defects with similar to background pixel, we are used the characteristics of the local region. And the real defect pixels are distinguished from the noise using the probability density function. Experimental results demonstrated the minimized over-detection by utilizing the artificial images and real polarizing film images.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.12
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• pp.1072-1080
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• 2013

In a the present day, many vision inspection techniques are used in productive industrial areas. In particular, in the semiconductor industry the vision inspection system for wafers is a very important system. Also, inspection techniques for semiconductor wafer production are required to ensure high precision and fast inspection. In order to achieve these objectives, parallel processing of the inspection algorithm is essentially needed. In this paper, we propose the GPU (Graphical Processing Unit)-based parallel processing algorithm for the fast inspection of semiconductor wafers. The proposed algorithm is implemented on GPU boards made by NVIDIA Company. The defect detection performance of the proposed algorithm implemented on the GPU is the same as if by a single CPU, but the execution time of the proposed method is about 210 times faster than the one with a single CPU.