• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.5
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• pp.442-449
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• 2009

An investigation has been made on the relationship between characteristics of torsional mode signal in MsS and SH mode signal in BEM modeling for the defect of stainless steel pipe. In order to compare torsional mode signal with SH mode signal of defect in stainless steel pipe, specimens were made by changing size of depth and width along to circumferential direction 360 degrees. All the defects was detected by torsional mode signal of MsS, especially according to the change of depth size, amplitude of signal was changed. But width change for the circumferential defects has no certain tendency. SH mode signal of BEM modeling shows similar results with torsional mode, with change makes amplitude variation of signal. In this paper, the characteristics of torsional mode and SH mode signals were found. It is possible to predict the circumferential defects for the pipe by SH mode modeling.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.43-48
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• 2017

Semiconductors are leading the development of industrial technology, leading to miniaturization and weight reduction of electronic products as a leading technology, we are dragging the electronic industry market Especially, the semiconductor manufacturing process is composed of highly accurate and complicated processes, and effective production is required Recently, a vision system combining a computer and a camera is utilized for defect detection In addition, the demand for a system for measuring the shape of a fine pattern processed by a special process is rapidly increasing. In this paper, we propose a vision algorithm using mask image to detect scratch defect of semiconductor pockage. When applied to the manufacturing process of semiconductor packages via the proposed system, it is expected that production management can be facilitated, and efficiency of production will be enhanced by failure judgment of high-speed packages.

• Journal of Biosystems Engineering
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• v.39 no.2
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• pp.142-149
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• 2014

Purpose: A multispectral algorithm for detection and differentiation of defective (defects on apple skin) and normal Red Delicious apples was developed from analysis of a series of hyperspectral line-scan images. Methods: A fast line-scan hyperspectral imaging system mounted on a conventional apple sorting machine was used to capture hyperspectral images of apples moving approximately 4 apples per second on a conveyor belt. The detection algorithm included an apple segmentation method and a threshold function, and was developed using three wavebands at 676 nm, 714 nm and 779 nm. The algorithm was executed on line-by-line image analysis, simulating online real-time line-scan imaging inspection during fruit processing. Results: The rapid multispectral algorithm detected over 95% of defective apples and 91% of normal apples investigated. Conclusions: The multispectral defect detection algorithm can potentially be used in commercial apple processing lines.

• Journal of Powder Materials
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• v.21 no.3
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• pp.215-221
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• 2014

Translucent alumina is a potential candidate for high temperature application as a replacement of the glass or polymer. Recently, due to the increasing demand of high power light emitting diode (LED), there is a growing interest in the translucent alumina. Since the translucent property is very sensitive to the internal defect, such as voids inside or abnormal grain growth of sintered alumina, it is important to fabricate the defect-free product through the fabrication process. Powder injection molding (PIM) has been commonly applied for the fabrication of complex shaped products. Among the many parameters of PIM, the flowability of powder/binder mixture becomes more significant especially for the shape of the cavity with thin thickness. Two different positions of the gate were applied during PIM using the disc type of die. The binder was removed by solvent extraction method and the brown compact was sintered at $1750^{\circ}C$ for 3 hours in a vacuum. The flowability was also simulated using moldflow (MPI 6.0) with two different types of gate. The effect of the flowability of powder/binder mixture on the microstructure of the sintered specimen was studied with the analysis of the simulation result.

• Journal of the Korean Magnetics Society
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• v.24 no.6
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• pp.171-178
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• 2014

Remote Field Eddy Current Testing (RFECT), one of the ways which is a nondestructive testing using electromagnetic fields, can make up for Magnetic Flux Leakage (MFL) weaknesses and general Eddy Current Testing (ECT) weaknesses which is an occurrence of a huge friction force or disadvantage of detecting defects on the outer wall. So many of institutes and laboratories have studied on RFECT for the past 50 years. But There is a lack of discussion about a study on eddy current and magnetic field distributions in a pipe wall and designing of RFECT exciter coil. In this paper, eddy current and magnetic field distributions in a pipe wall and influence of altering variables are analyzed. Also, the optimal design algorithm about the RFECT Exciter coil are proposed, and influence on defect signals caused by alteration of its shape is analyzed.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.40 no.3
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• pp.27-37
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• 2017

As the global uncertainty of manufacturing has increased and the quality problem has become global, the recall has become a fatal risk that determines the durability of the company. In addition, as the convergence of PSS (product-service system) product becomes common due to the development of IT convergence technology, if the function of any part of hardware or software does not operate normally, there will be a problem in the entire function of PSS product. In order to manage the quality of such PSS products in a stable manner, a new approaches is needed to analyze and manage the hardware and software parts at the same time. However, the Fishbone diagram, FTA, and FMEA, which are widely used to interpret the current quality problem, are not suitable for analyzing the quality problem by considering the hardware and software at the same time. In this paper, a quality risk assessment model combining FTA and FMEA based on defect rate to be assessed daily on site to manage quality and fishbone diagram used in group activity to solve defective problem. The proposed FTA-FMEA based risk assessment model considers the system structure characteristics of the defect factors in terms of the relationship between hardware and software, and further recognizes and manages them as risk. In order to evaluate the proposed model, we applied the functions of ITS (intelligent transportation system). It is expected that the proposed model will be more effective in assessing quality risks of PSS products because it evaluates the structural characteristics of products and causes of defects considering hardware and software together.

• Journal of IKEEE
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• v.20 no.3
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• pp.310-313
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• 2016

In this paper, we propose the tester apparatus for 48 channel GM Tube sensor. The proposed apparatus can test up to 48 channel GM tube simultaneously to detect the defect and analyze the sensor characteristic. 300-1000V variable high voltage generation circuit is utilized for the apparatus suitable for the sensor characteristic. Thus, the proposed system is useful for various GM Tube sensor characteristic analysis. Multiple sensor testing environment is established for the early detection of the defect and the analysis to reduce the costs for manufacturing and rework. Developed 48 channel GM Tube sensor test is evaluated with certified testing equipment and shows excellent performance with respect to the uncertainty of the sensor test results.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.11
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• pp.2085-2092
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• 2016

One of the most important properties of the IC substrate is that it should be uniform over large areas. Among the various physical approaches of wafer defect characterization, special attention is to be payed to the infrared techniques of inspection. In particular, a high spatial resolution, near infrared absorption method has been adopted to directly observe defects in semi-insulating GaAs. This technique, which relies on the mapping of infrared transmission, is both rapid and non-destructive. This method demonstrates in a direct way that the infrared images of GaAs crystals arise from defect absorption process. A new interpretation is presented for the observed reversal of contrast in the infrared absorption of nonuniformly distributed deep centers, related to EL2, in semi-insulating GaAs. The low temperature photoquenching experiment has demonstrated in a direct way that the contrast inverse images of GaAs wafers arise from both absorption and scattering mechanisms rather than charge re-distribution or local variation of bandgap.

• Journal of Electrical Engineering and Technology
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• v.11 no.4
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• pp.939-942
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• 2016

One of the most important characteristic curves of a solar cell is its current density-voltage (J-V) curve under AM1.5G insolation. Solar cell can be considered as a semiconductor diode, so a diode equivalent model was used to estimate its parameters from the J-V curve by numerical simulation. Active layer plays an important role in operation of a solar cell. We investigated the effect thicknesses and defect densities (N_d) of the active layer on the J-V curve. When the active layer thickness was varied (for N_d = 8×10¹⁷ cm^-3) from 800 nm to 100 nm, the reverse saturation current density (J_o) changed from 3.56×10^-5 A/cm² to 9.62×10^-11 A/cm² and its ideality factor (n) changed from 5.28 to 2.02. For a reduced defect density (N_d = 4×10¹⁵ cm^-3), the n remained within 1.45≤n≤1.92 for the same thickness range. A small increase in shunt resistance and almost no change in series resistance were observed in these cells. The low reverse saturation current density (J_o = 9.62×10^-11 A/cm²) and diode ideality factor (n = 2.02 or 1.45) were observed for amorphous silicon based solar cell with 100 nm thick active layer.

• Transactions on Electrical and Electronic Materials
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• v.11 no.1
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• pp.42-47
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• 2010

Polymer insulating materials such as cross linked polyethylene (XLPE) are employed in electric cables used for extra high voltage. These materials can degrade due to chemical, mechanical and electric stress, possibly caused by voids, the presence of extrinsic materials and protrusions. Therefore, this study measured discharge patterns, discharge phase angle, quantity and occurrence frequency as well as changes in XLPE under different temperatures and applied voltages. To quantitatively analyze the irregular partial discharge patterns measured, the discharge patterns were examined using a statistical program. A three layer sample was fabricated, wherein the upper and lower layers were composed of non-void XLPE, while the middle layer was composed of an air void and copper particles. After heating to room temperature and $50^{\circ}C$ and $80^{\circ}C$ in silicone oil, partial discharge characteristics were studied by increasing the voltage from the inception voltage to the breakdown voltage. Partial discharge statistical analysis showed that when the K-means clustering was carried out at 9 kV to determine the void discharge characteristics, the amount discharged at low temperatures was small but when the temperature was increased to $80^{\circ}C$, the discharge amount increased to be 5.7 times more than that at room temperature because electric charge injection became easier. An analysis of the kurtosis and the skewness confirmed that positive and negative polarity had counterclockwise and clockwise clustering distribution, respectively. When 5 kV was applied to copper particles, the K-means was conducted as the temperature changed from $50^{\circ}C$ to $80^{\circ}C$. The amount of charge at a positive polarity increased 20.3% and the amount of charge at a negative polarity increased 54.9%. The clustering distribution of a positive polarity and negative polarity showed a straight line in the kurtosis and skewness analyses.