• Journal of the korean academy of Pediatric Dentistry
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• v.39 no.2
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• pp.153-159
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• 2012

The objective of this study was to assess the effect of salivary contamination on shear bond strength of pit and fissure sealant using several bonding agents by means of applying saliva at different stages of treatment. 56 teeth were randomly divided into one of seven groups (8 per group): (Group A, B) acid etching; (Group C, D, E) Adper$^{TM}$ Single Bond after acid-etching; (Group F, G) Adper$^{TM}$ Prompt L-pop. Saliva was applied to teeth surface of B, D, E, and G groups for 10 seconds. Especially, group D was contaminated after acid-etching and group E was contaminated with saliva after adhesive application. After light curing, all of the specimens were thermocycled and the shear bond strength tests were performed. The results were as follows. 1. In generally performed pit and fissure sealant group, shear bonding strength significantly differently reduced when was contaminated by saliva (p<0.05). However the group that was applied with bonding agent during pit and fissure sealant procedure, there were no significant differences in the kind of bonding agents nor the stage of contamination. 2. In group that was not contaminated by saliva during pit and fissure sealant treatment, Adper$^{TM}$ Single Bond yielded the highest bonding strength but there were no significant differences. 3. The failure pattern on the debonded surfaces shows that most specimens from groups using bonding agents showed cohesive failures while most specimens from groups that didn't use bonding agents showed adhesive failures.

• Restorative Dentistry and Endodontics
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• v.32 no.3
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• pp.222-235
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• 2007

The objectives of this study was to evaluate the effect of thermocycling on the ${\mu}TBS$ (microtensile bond strength) to dentin with four different adhesive systems to examine the bonding durability. Freshly extracted $3^{rd}$ molar teeth were exposed occlusal dentin surfaces, and randomly distributed into 8 adhesive groups 3-steps total-etching (Scotchbond Multi-Purpose Plus; SM, All Bond-2; AB), 2-steps total-etching (Single Bond; SB, One Step plus; OS), 2-steps self-etching (Clearfil SE Bond; SE, AdheSE AD) and single-step self-etching systems (Promp L-Pop; PL, Xeno III; XE) Each adhesive system in 8 adhesives groups was applied on prepared dentin surface as an instruction and resin composite (Z250) was placed incrementally and light-cured. The bonded specimens were sectioned with low-speed diamond saw to obtain $1\times1mm$ sticks after 24 hours of storage at $37^{\circ}C$ distilled water and proceeded thermocycling at the pre-determined cycles of 0, 1,000 and 2,000. The ${\mu}TBS$ test was carried out with EZ-tester at 1mm/min. The results of bond strength test were statistically analyzed using one-way ANOVA/ Duncan's test at the a < 0.05 confidence level. Also, the fracture mode of debonded surface and the interface were examined under SEM. The results of this study were as follows ; 1. 3-step total etching adhesives showed stable, but bond strength of 2-step adhesives were decreased as thermocycling stress. 2. SE showed the highest bond strength, but single step adhesives (PL, XE) had the lowest value both before and after thermocycling. 3 Most of adhesives showed adhesive failure. The total-etching systems were prone to adhesive failure and the single-step systems were mixed failure after thermocycling. Within limited results of this study, the bond strength of adhesive system was material specific and the bonding durability was affected by the bonding step/ procedure of adhesive Simplified bonding procedures do not necessarily imply improved bonding performance.

• Restorative Dentistry and Endodontics
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• v.35 no.2
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• pp.69-79
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• 2010

The purpose of this study was to evaluate the effect of film thickness of various resin cements on bonding efficiency in indirect composite restoration by measurement of microtensile bond strength, polymerization shrinkage, flexural strength and modulus, fractographic FE-SEM analysis. Experimental groups were divided according to film thickness (< $50\;{\mu}m$-control, $50\;{\mu}m$-T50, $100\;{\mu}m$-T100, $150\;{\mu}m$-T150) using composite- based resin cements (Variolink II, Duo-Link) and adhesive-based resin cements (Panavia F, Rely X Unicem). The data was analyzed using ANOVA and Duncan's multiple comparison test (p < 0.05). The results were as follows ; 1. Variolink II showed higher microtensile bond strength than that of adhesive-based resin cements in all film thickness (p < 0.05) but Duo-Link did not show significant difference except control group (p > 0.05). 2. Microtensile bond strength of composite-based resin cements were decreased significantly according to increasing film thickness (p < 0.05) but adhesive-based resin cements did not show significant difference among film thickness (p > 0.05). 3. Panavia F showed significantly lower polymerization shrinkage than other resin cements (p < 0.05). 4. Composite-based resin cements showed significantly higher flexural strength and modulus than adhesive-based resin cements (p < 0.05). 5. FE-SEM examination showed uniform adhesive layer and well developed resin tags in composite-based resin cements but unclear adhesive layer and poorly developed resin tags in adhesive-based resin cements. In debonded surface examination, composite-based resin cements showed mixed failures but adhesive-based resin cements showed adhesive failures.